CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, three Indium Corporation team members will share their insights and knowledge on a variety of industry-related topics throughout APEC 2024, February 25-29, in Long Beach, CA.

• Tuesday, February 27
  • 1:30 p.m. – 2:00 p.m. PST
    • Power Module Package-Attach Materials Technology by Product Manager – ESM/Power Electronics Joe Hertline
    • Hertline will explore new innovations and trends in power module package-attach materials technology, including a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. This alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. Sintering applications and thermal interface materials trends will also be discussed.
• Thursday, February 29
  • 2:45 p.m. – 3:10 p.m. PST
    • Material Considerations for Next Generation EV Inverter Architectures by Strategic Advisor Dongkai Shangguan
    • Dr. Shangguan will focus on the unique challenges posed by 800V inverter architecture, a field growing in complexity with the increasing size of power electronics. Key issues will include design considerations, thermal management, and the selection of suitable materials. Particular emphasis is placed on the problems of warpage and delamination, which present notable manufacturing challenges and have critical implications for the reliability and safety of end-products.
  • 2:50 p.m. – 3:10 p.m. PST
    • Low-Temperature Pb-Free Solder Preform Technology for Molded Power Module Package Attach Designed for Improved Thermomechanical Performance by Senior Applications Development Engineer Ryan Mayberry
    • Mayberry will examine a low-temperature Pb-free soldering solution for high-power density power electronics, addressing the trade-off between cost, complexity, and performance in thermal management/mechanical attach solutions for power modules. The proposed SAC-In alloy solution, in a solder preform configuration, has reflow temperatures below industry standard lead-free and high-temperature solders. It serves as a drop-in replacement, offering improved thermal performance compared to organic-based thermal management solutions, while mitigating risks of component damage, material stress, and reducing energy consumption with a peak reflow temperature below ~215°C. The Bi-free alloy also demonstrates robust lifecycle performance comparable to standard Pb-free alloys in thermal shock testing at -40°C/+125°C.

Hertline is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

Dr. Shangguan is a Strategic Advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also serves as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published three books, more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 33 U.S. patents and several foreign patents.

Mayberry is responsible for generating test strategies, data sets, and application guidelines for Indium Corporation’s Engineered Solder Materials (ESM) product line. He collaborates with sales, R&D, operations, and quality departments as a subject matter expert to enable key pursuits in the power electronics and thermal market segments by developing process recommendations and supporting new product qualifications for a successful customer experience. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.

To learn more about Indium Corporation’s innovative products for EV and power electronics, visit us at booth #752 at APEC or online at indium.com.

ATLANTA – Koh Young, the leader in True3DTM measurement-based inspection solutions, is pleased to announce the newest addition to its growing family, Mr. Hector Hernandez. As part of our commitment to expansion and excellence, Hector joins Koh Young as the Regional Sales Manager for the regions of Baja, Sonora, Durango, Chihuahua, and Jalisco.

Bringing over 8 years of experience in sales, Hector Hernandez is a seasoned professional in our industry. His proven history and extensive knowledge make him an ideal fit to further elevate our market presence in Mexico. This strategic move underscores Koh Young's dedication to delivering innovative technology and customer satisfaction.

Hector Hernandez shared his excitement about the transition, saying, "Joining Koh Young America as a Regional Sales Manager was a natural progression for me as a sales rep. The dynamic and innovative environment at Koh Young left a lasting impression on me during my time as a sales rep. Koh Young's commitment to advanced technology and customer satisfaction aligns seamlessly with my professional values."

In his new role, Hector will be based at our Mexico Headquarters in Guadalajara, Jalisco, contributing his expertise to drive tailored solutions and address customer challenges. His genuine passion for the industry and dedication to building lasting relationships perfectly align with Koh Young's mission to actively contribute to the advancement of our customers.

Please join us in welcoming Hector Hernandez to the Koh Young family. We look forward to achieving new milestones and continued success with him as a valued member of our team.

NORTHAMPTON, UK – A.T.E. Solutions Ltd, a leading Test Equipment Solutions provider based in Blisworth, Northants, proudly announces the appointment of Dean Kavanagh as its new Managing Director. This strategic move follows the acquisition of A.T.E. Solutions in 2023 by Bergman & Beving, who will oversee the company under their Tools and Consumables Division.

Dean Kavanagh brings to A.T.E. Solutions a wealth of experience and a proven track record in technologically advanced manufacturing operations. With over 25 years of experience, Dean is recognised for his achievements in global exports and has received the prestigious Institute of Directors' West Midlands Director of the Year award twice for his outstanding contributions to industry.

Reflecting on his new role, Dean expressed his enthusiasm, stating, "I'm delighted to be joining A.T.E. as their new Managing Director. I have some big shoes to fill, but the attractiveness of A.T.E. as a market-leading Test Equipment Solutions provider, alongside the growth potential that the business wants to fulfil, was too great to resist."

A.T.E. Solutions Ltd was incorporated in 2002, and under the leadership of Steve Lees, the company has thrived, establishing itself as a prominent player in the test market. Steve Lees, who remains with the business, spoke highly of the decision to appoint Dean Kavanagh: "Selling the business was a huge decision for me, and selecting the right partner in Bergman & Beving is tremendously important in knowing my team and their future are in safe hands. In Dean, we have someone who I know is fully tuned in to where we want to take the business and being able to do so in a sensible and scalable way." Steve is migrating to a Technical Director role that will allow him to focus on key projects and ongoing R&D activities.

Dean Kavanagh has a strong background in driving business improvement through the application of "Lean" philosophies and challenging long-held assumptions. His leadership style is characterised by excellent communication, emotional intelligence, and an authentic approach that instils confidence and self-belief in his teams.

Prior to joining A.T.E. Solutions, Dean served as the Managing Director at QED Environmental Systems, a market-leading provider of environmental technology solutions. But, his commitment to business excellence extends beyond his professional roles, as he volunteers as a Non-Executive Director for a Multi Academy Trust of eight schools in Coventry.

A.T.E. Solutions is confident that Dean Kavanagh's leadership will contribute significantly to the company's growth and strengthen its position in competitive international markets.

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces that Senior Application Engineer Ravi Parthasarathy will be presenting a technical session titled "Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges" at the upcoming Surface Mount Technology Association (SMTA) Wafer Level Packaging Symposium.

Scheduled for February 13th, 11:30 AM to 12:00 PM, Ravi Parthasarathy's presentation will delve into the intricacies of enhancing High Bandwidth Memory (HBM) wafer surface treatment processes while addressing the unique cleaning challenges associated with this advanced technology.

As a seasoned professional in the electronics manufacturing industry, Ravi brings a wealth of knowledge and hands-on experience to this presentation. His insights into optimizing HBM wafer surface treatment will prove invaluable for engineers, researchers, and professionals seeking to stay at the forefront of wafer-level packaging advancements.

For more information about the SMTA Wafer Level Packaging Symposium and to attend Ravi Parthasarathy's presentation, please visit https://smta.org/BlankCustom.asp?page=wafer