CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is pleased to announce the appointment of Rupinderjit (Rubi) Catuna as Chief Financial Officer.

Ms. Catuna joined the Company in 2006 and has served in various roles within Accounting and Finance, most recently as a VP of Finance and Corporate Controller. During her tenure at NEOTech, she has been an instrumental part of the Company’s growth where she took critical roles in the M&A activities of Epic, OnCore, and Stellar acquisitions. Additionally, she brings the experience in capital restructuring, systems integration, and divestitures. Committed to NEOTech’s culture of continuous improvements, Ms. Catuna spearheaded the consolidation and integration of accounting functions for all acquired entities.

She is a key member of the executive team and has managed Global Finance and Accounting for NEOTech since 2019. In the new role, she will be responsible for the Company’s corporate and financial strategies and its financial operations and processes.

Ms. Catuna is a Certified Public Accountant in the State of California and holds a bachelor’s degree in accounting from California State University, Northridge.

“Rubi has been instrumental in our success and exemplifies our culture of integrity and accountability. We are very proud of all of Ms. Catuna’s contributions and look forward to her continued success,” commented Kunal Sharma, President and Chief Operating Officer.

With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the Aerospace and Defense industry, Medical Products, and High-Tech Industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech services, visit the company’s website at www.NEOTech.com

HEERBRUGG, SWITZERLAND – As an EMS provider catering to major OEMs, ESCATEC believes in the importance of continually upgrading its technological capabilities to keep delivering high quality products and to accommodate customer requests for more advanced services. Within the Group, ESCATEC Switzerland (ECH) plays the role of an innovation hub and testbed, where new technology and processes are evaluated and, if found beneficial, will be rolled-out to ESCATEC’s other production sites.

A recent example illustrates this ‘technology roll-out’ process, with ECH taking the lead for the wider Group. Based in Heerbrugg, Switzerland, ECH integrated a Mycronic MY700 jet printer to its Surface Mount Technology (SMT) line in early August 2023 and the results have been right on target. The advanced, cutting-edge jet printer offers many advantages over the stencil printing method usually employed for soldering in SMT production and has enabled ECH to improve the flexibility, efficiency, and quality, of its SMT output.

The SMT process is a foundational activity towards assembling most electronic products with a key part of it being soldering via stencil printing of various electronic components onto printed circuit boards (PCBs). Stencil printing involves using a stencil that is essentially a thin sheet with openings (apertures) corresponding to the locations where solder paste needs to be deposited on the PCB. The solder paste itself is typically a low-melting-point metal alloy that creates electrical and mechanical connections, enabling the components to be reliably ‘joined’ to the PCB. SMT’s significance in electronics production lies in its ability to enable miniaturisation, reduce production costs, enhance quality and reliability, and adaptability to various PCB designs and component types.

ECH’s new jet printer provides significant innovation over the stencil printing method, notes Production & Engineering Manager Dr Martin Mundlein. “It is a unique equipment allowing a very high level of flexibility for solder paste application, enabling up to 700,000 solder paste dots per hour and dispensing down to 200um size. By using it in combination with a stencil printer, it has given ECH full process flexibility when it comes to SMT,” he explained.

The jet printer is currently installed directly in ECH’s SMT line after a stencil printer and before a 3D solder paste inspection station. It has allowed ECH to reduce cost and lead times for prototype builds and low volume production by eliminating the need for stencils (which are expensive), while greatly expanding flexibility in the type and complexity of PCBs that can be run.

Increased Flexibility, Cost Reduction, and Improved Quality

ECH’s new jet printer can apply solder paste to a far wider range of components, including those with complex geometries or that are in difficult-to-reach areas. This makes it ideal for NPI and low-volume production, as well as for high-volume production applications that require a high degree of flexibility.

The jet printer has reduced costs in several ways for ECH. Firstly, by eliminating the need for expensive stencils which have a long lead time when ordering and to set up. Secondly, there is an improvement in yield by reducing the risk of solder paste misprints and process failure, thirdly by allowing for precise control of the solder paste volume applied to each component, and fourthly by reducing the number of scrap or rejects.

ECH has also gained from higher standards of quality in relation to its SMT output because the jet printer improves the consistency of the solder paste deposits while reducing the risk of solder bridging and other defects. There is also an improvement in the overall appearance of the finished products.

Dr Mundlein believes the new jet printer is a valuable addition to ECH's manufacturing capabilities and, once it has been thoroughly evaluated and fine-tuned in ECH and with experience in hand, the technology is likely to be rolled out to ESCATEC’s network of production sites in Europe and Malaysia. Most importantly, ECH’s customers will benefit from the cost savings, shorter lead times, and higher quality, gained from the new jet printer.

FARNBOROUGH, UK – Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, is pleased to announce the appointment of John Barraclough as the Head of Business Development. This strategic appointment follows the retirement of Nick Redgrave-Plumb, who served Gen3 with dedication and excellence for 24 years.

John brings a wealth of experience and expertise to his new role as the Head of Business Development at Gen3. With a career that has encompassed various leadership positions in business development and sales management across diverse industries, including electronics, defense, aerospace, and oil and gas (O&G), John’s background aligns seamlessly with Gen3's mission and vision.

John’s career journey has been marked by a commitment to excellence and a passion for innovation. Starting with an Electrical and Electronic Engineering apprenticeship at BAe (British Aerospace), he progressed from printed circuit board layout design to technical support and eventually assumed sales and management roles. Notably, John served as the General Manager - Operations and Sales for Flowserve Limitorque EMEA, demonstrating his versatility and leadership skills.

Over the past five years, John has contributed significantly to the electronics arena by holding sales management positions for conformal coating companies. His extensive industry knowledge and dedication to customer satisfaction have made him a respected figure in the field.

John, who is also a qualified scuba diving instructor and a devoted Formula 1 enthusiast, expressed his enthusiasm for joining Gen3. "I am excited to have joined Gen3, a company that has established itself as the market leader in testing and measuring equipment for the electronics industry," he remarked. "I look forward to contributing to the company's growth and continued success."

Nick Redgrave-Plumb, who dedicated himself to Gen3 after two tours of duty, spanning from 1991 to 2023, has been a true leader within the organization. His unwavering commitment and contributions have been pivotal to the company’s success. On departure of Nick, and appointment of John, Nick commented, "Having been with the company for such a long time Gen3 has become as much a part of me as I have become of Gen3. The Gen3 team we have now are nothing less then fantastic, and I’ll really miss the camaraderie.

I’ve seen many changes to this family business, and my role has been highly rewarding for me both professionally and personally. I’ve genuinely enjoyed my 24 years with Gen3, so I have to thank Graham and Andrew Naisbitt, as well as the deceased Arthur and Doreen Naisbitt. That being Graham’s parents who founded the company. They have always provided a rewarding work environment and invaluable support to not only myself, but my family also.

"John has very been carefully selected to take over my role as Head of Business. His background, experience and attitude is ideally suited to the work he will now take on. John will do well, of this I am sure and I will continue to provide all the support he requires, whenever he needs my help."

Gen3 expresses its heartfelt appreciation for Nick’s invaluable service and wishes him a well- deserved and fulfilling retirement.

As Gen3 looks ahead to the future with John at the head of Business Development, the company remains committed to its mission of delivering cutting-edge testing and measuring solutions to the electronics industry.

For more information about Gen3 and its innovative testing solutions, visit www.gen3systems.com

CLINTON, NY – Indium Corporation Regional Product Manager Wisdom Qu will present at the iNEMI Workshop on Automotive Electronics on October 13, in Shenzhen, China.

In her presentation Low-Voiding, High-Reliability, Lead-Free Solder Paste Design for Automotive Applications, Qu will examine the results of a test comparing a solder paste based on a mixed powder technology, containing Sn/Ag/Cu/Bi/Sb/In in the final joint, with SAC305 and other high-reliability pastes. The voiding from a QFN package was consistently lower than 15%, which is better than SAC305. TCT reliability under AEC Grade 1 for BGA192, QFN, and chip-resistor also demonstrated improved reliability compared to SAC305 and the other high-reliability alloys.

With the rapid growth of the 5G and EV markets, the electronics industry has higher requirements for product reliability, with the extended lifetime under AEC Grade 1 or even Grade 0 conditions. Traditional high-reliability solder alloys contain five or six elements or even more, which strengthens through solid solution and/or precipitate solution.

“The microstructural complexity of the multi-element high-reliability alloys makes the melting behavior complicated, which may lead to worsened voiding performance compared to traditional SAC305 after reflow,” said Qu. “Designing the solder paste with mixed powder technology can reduce voiding by using at least one ternary or quaternary alloy powder constituent in the paste while the final joint is still a quinary or even senary alloy system.”

As Regional Product Manager for PCB Assembly Solder Paste in Asia, Qu facilitates business development and growth of PCB assembly product offerings, focusing on solder paste. A certified SMT process engineer, she has more than 17 years of experience in surface mount technology and earned a degree in mathematics from Hubei Radio and Television University in China.