CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMT-Info Technical Conference taking place October 15-16 in Brno, Czech Republic. AIM’s Ales Sedlak will be giving a presentation titled “Addressing Concerns of Ultra-Miniature Component Assembly: M0201, 008005, and Micro/MiniLEDs.”

Presentation abstract: The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss the new information on how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.

Among other great products, AIM will also be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste at this event. AIM’s NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at SMT-Info October 15-16, or visit www.aimsolder.com 

MANASSAS, VA – ZESTRON, the global leader in high- precision cleaning products, services, and training solutions for the electronics manufacturing industry, is excited to announce its upcoming webinar, "Electrifying Reliability: Advanced Cleaning and Coating Solutions for Enhanced Performance in E-Mobility," which will take place on October 17, 2024, at 2:00 PM EDT.

As the future of transportation moves toward electrification, ensuring the reliability of electronic components in the rapidly growing E-Mobility sector is more critical than ever. This webinar will bring together industry experts Jeff Kennedy from ZESTRON Academy and Brent Frizzell from Specialty Coating Systems to discuss the latest cleaning and coating technology advancements that enhance performance and reliability.

The session will give attendees an in-depth look at cleaning and coating solutions to mitigate common failure causes in E-Mobility applications such as electrochemical migration (ECM) and creep corrosion. As electric vehicles (EVs) and other e-mobility innovations push the boundaries of performance, maintaining the integrity of electronic components is essential to ensuring their long-term success. This is a must-attend event for engineers, manufacturers, and industry professionals who want to stay at the forefront of E-Mobility innovations and ensure the long-term reliability of their electronic systems.

Don't miss this opportunity to learn from the experts and stay ahead in the electrified future of transportation.

Register For The Webinar: https://pages.zestron.com/2024-electrifying-reliability-advanced-cleaning-and-coating-solutions-for-enhanced-performance-in-e-mobility  

SANTA CLARA, CA – Absolute EMS, Inc., a four-time award-winning EMS provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to announce its enhanced printed circuit board assembly (PCBA) capabilities tailored to the fast-growing artificial intelligence (AI) industry. As AI continues to transform various sectors, Absolute EMS is positioned today to meet the increasing demand for high-reliability manufacturing by offering specialized PCB assembly capabilities, including large BGA assembly (up to 5,300 ball), fine pitch BGA assembly (down to 0.25mm pitch) and very small capacitor & resistor placement capabilities (down to 008004 passives).

Certified to ISO13485, AS9100 and ISO 9001, Absolute EMS manufactures to the highest industry quality standards, ensuring that the PCB assembly process for AI applications exceeds all rigorous quality and industry requirements. The company specializes in fully automated, touchless contract manufacturing, which includes advanced nitrogen reflow systems to optimize soldering processes for components, like large 4,096+ ball BGAs to as small as Imperial code 008004—some of the smallest in the world—ensuring optimal reliability for complex AI systems. Absolute EMS also offers box build services for final AI products and sub-systems. Box builds range from simple additions of heat sinks and cold plates, to complex system box builds like full rack servers. Expediting AI OEMs time-to-market.

“AI technology demands precision and reliability, and our Silicon Valley-based facility is fully equipped to deliver that,” said Doug Dow, COO at Absolute EMS. “With our Class 3 IPC-A-610 and J-STD-001 certifications, alongside UL registration, we ensure that AI PCB assemblies meet the highest standards, particularly for medical manufacturing, military manufacturing and other high-reliability applications.”

Absolute EMS is also a trusted EMS provider for advanced, AI driven, satellite manufacturing and other mission-critical aerospace programs. Absolute EMS’s capabilities, which include PCB assembly for complex AI hardware, position them as an ideal partner for companies seeking a high-reliability, AS-9100 certified, manufacturing solutions supplier in Silicon Valley and beyond.

With AI continuing to revolutionize industries such as healthcare, autonomous vehicles, and consumer electronics, Absolute EMS is committed to providing the highest levels of precision manufacturing, quality, and innovation to meet the complex demands of AI-driven hardware.

For more information about Absolute EMS and its manufacturing solutions for the AI industry, visit www.absolute-ems.com 

CLINTON, NY – As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.

Indium Corporation will showcase the following among its featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength. Indalloy®301 LT Alloy for Preforms/InFORMS® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.

Indium Corporation’s innovative solder and alloy technologies are designed to meet the stringent requirements of the electric vehicle market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry's drive towards sustainability and longer-lasting products. By offering advanced materials solutions like Durafuse® and Indalloy®, Indium Corporation helps automakers and battery manufacturers tackle the challenges of electrification and develop next-generation EV technologies.

To learn more about Indium Corporation’s solutions, visit our experts at the Detroit Battery Show in hall A-C, booth #733.