DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is excited to announce its participation at SMTA International, where it will be exhibiting the new StenTech BluPrint™ vapor deposition coating technique at Booth 3025. The event is scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

The SMT industry has long faced challenges with the degradation and disintegration of stencil coatings caused by various cleaning solutions, squeegee pressures, and manufacturing processes. Recognizing these issues, StenTech has developed a coating that overcomes these obstacles without requiring changes to established processes.

Introducing the StenTech BluPrint™ vapor deposition coating technique, a groundbreaking solution that is virtually indestructible and consistently delivers high-quality results across different SMT lines, especially in high-volume printing. This exclusive coating allows engineers to design PCBs with area ratios significantly below 0.6, increasing surface area for components. This advancement leads to less frequent cleaning, with some contract manufacturers experiencing a 50% boost in efficiency, cleaning once every four prints instead of every two, and others seeing up to a 67% efficiency increase by cleaning once every six prints. Additionally, the coating enhances transfer efficiency from 84% to an impressive 98%.

StenTech BluPrint™ is designed to enhance existing manufacturing processes, making them more efficient and cost-effective. This results in reduced quality control time, as the company’s stencils ensure that fully assembled PCBs are more likely to pass inspection. From the first print to the 50,000th, StenTech stencils maintain their integrity, eliminating bottlenecks in the initial steps of PCB assembly.

Visit Booth 3025 at SMTA International to see how StenTech BluPrint™ can transform your SMT production lines. StenTech’s team will be available to demonstrate the technology's capabilities and discuss how it can be customized to suit your specific needs.

JALISCO, MEXICO ― SMarTsol Technologies, the largest technical services and equipment provider for North and South America, is pleased to announce its participation in SMTA International 2024, taking place from Oct. 22-24, 2024 in Rosemont, IL. At the premier event, SMarTsol will highlight its collaboration with Nordson T&I, showcasing advanced equipment and innovative solutions in Booth 2729.

At SMTAI 2024, SMarTsol will feature Nordson T&I’s Quadra 7 Pro, the highest-resolution MXI system available, providing exceptional visibility of the tiniest details and immediate defect detection, along with non-destructive CT functionality through X-Plane technology. Additionally, the SQ3000 SPI/AOI/CMM will be exhibited, demonstrating unmatched accuracy with revolutionary Multi-Reflection Suppression (MRS) technology. This technology meticulously identifies and rejects reflections caused by shiny components, making it an ideal solution for applications with very high-quality requirements.

SMarTsol will present other advanced equipment, including the TMRobot, showcasing the advantages of the most powerful cobot in the industry. The TMRobot features an embedded vision system, a payload capacity of up to 30Kg, AI capabilities, auto alignment functions, and multiple communication ports.

In addition, SMarTsol will exhibit its Inline and Tabletop Soldering Robots and handling equipment. All of these products are available for immediate delivery within the US from the company’s warehouse in El Paso, TX.

For additional information about SMarTsol Technologies’ products and services, visit www.SMarTsolamerica.com  

MALDEN, MA – actnano, Inc., a global leader in surface protective technologies for automotive, consumer and industrial electronics, pleased to announce its participation in SMTA International 2024, scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. The company will showcase its award-winning Advanced nanoGUARD™ coatings in the ROCKA Solutions booth 2947, a game-changing innovation in the protection of electronic components.

This revolutionary nanocoating offers unmatched water and environmental resistance, ensuring the utmost protection for your electronic components. Unlike traditional coatings, actnano’s gel-state coatings are PFAS-free and can be applied directly to connectors, antennas, LEDs, and high heat- generating components, setting a new standard in the industry.

Advanced nanoGUARD™ harnesses the power of nanotechnology to deliver exceptional safeguarding capabilities, significantly enhancing the durability and longevity of electronic devices. This scalable, turnkey solution empowers manufacturers to elevate the reliability and performance of their products, meeting the rigorous demands of leading automotive and consumer electronics industries.

Join actnano at booth 2947 to discover how the Advanced nanoGUARD™ can revolutionize your product protection strategy. Experience firsthand the cutting-edge technology that is redefining the standards of electronic component protection.

For more information about actnano, visit actnano.com

WALTHAM, MA – Essemtec is excited to exhibit at the SMTA International Expo, happening October 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. We invite you to visit us at Booth 2959 for live demonstrations of our latest technologies, including our innovative reballing solutions, the all-new Tarantula Underfill system, and the Fox all-in-one machine featuring the new Integrated Inspection System (I2S).

Fox All-in-One Machine:

Experience the Fox all-in-one machine’s impressive versatility and efficiency. This compact powerhouse integrates the Integrated Inspection System (I2S) 2D AOI and 2D SPI capabilities, offering comprehensive inspection and quality control in a single platform. Designed for high-mix production, the Fox supports up to 200 feeder lanes and fits perfectly in space- constrained production areas.

New Tarantula Underfill System:

Discover the Tarantula Underfill system, engineered to deliver superior underfill solutions for a variety of applications. This system enhances reliability and protection for electronic components, especially in high- stress environments. With its non-contact heating capability and adaptability for double-sided populated boards, the Tarantula handles various PCB sizes (up to 560x610mm) and dispensing needs, including solder paste jetting, SMT glue dispensing, LED encapsulation, epoxy dispensing, and more.

Live Demonstrations:

Reballing Solutions:

Watch our advanced reballing technology in action. Our demonstration will cover:

• Flux Paste Dispensing: Accurate dispensing of soldering flux is crucial for successful reballing.
• Solder Ball Placement: See how our specialized equipment applies solder balls precisely in one go with the flux dispensing, ensuring optimal connections and functionality.

Integrated Inspection System: I2S

See the I2S in action within our Pick-and-Place and Dispensing solutions. This system inspects dispensed and jetted materials, as well as placed SMT components, ensuring only high-quality products enter the reflow ovens. It also features an automated repair function and is already in use at various production sites.

Join us at Booth 2841 during SMTA International to explore these cutting-edge solutions and witness Essemtec’s commitment to advancing SMT technology.