CHENNAI, INDIA – Avalon Technologies Limited (Avalon), an Electronics Manufacturing Services (EMS) company, announced that it is now a strategic manufacturing partner for C-DAC (Centre for Development of Advanced Computing), a R&D organization of the Ministry of Electronics and Information Technology (MeitY). This, the company said, will enhance the indigenous manufacturing capability of High-Performance Computing (HPC) systems as part of the ‘RUDRA’ programme, which aims at designing and manufacturing of supercomputers in India.
The programme is poised to demonstrate India’s competency to design, develop, build and deliver as per nation’s multidisciplinary computing needs, and has critical strategic and national importance.
Avalon has been working as a strategic design and manufacturing partner to C-DAC since 2021, delivering PCB design & analysis, Prototype PCB assemblies, Cables, and Sheet metal chassis.
Kunhamed Bicha, Chairman & Managing Director, said, “We are proud to announce that we will be a key partner in assisting with the manufacturing of RUDRA HPC servers – India’s first ever natively designed server by C-DAC. We have been involved in the process of development of RUDRA server by providing advanced manufacturing solutions and are delighted to now take on a strategic role in bringing about the Make in India story. We believe this partnership will be a significant boost to the advancement of indigenous research, design, and manufacturing of HPC systems in India, and are proud to be in the forefront of this movement.”
E Magesh, Director General, C-DAC, said “Rudra Server, an outcome of National Supercomputing Mission is a Secure, Reliable, server with current generation of Intel Xeon scalable processor and supports accelerated computing also. With the provision of liquid cooling technology, it is aimed at achieving better energy efficiency, density, and architectural features to suit requirements of the various national missions. Addition of M/s Avalon Technologies is a welcome step to expand the competitive proliferation of this indigenously designed server. By doing this, we not only contribute to our nation’s technological self-reliance but also pave the way for innovation and growth”.
“We have been associated with Avalon technologies for the manufacture of Rudra Chassis as well as C-DAC’s high-speed switch for a couple of years. It will be an added advantage partnering with a company like Avalon Technologies for manufacturing of our indigenously designed server platform, Rudra,” added Col. A K Nath (Retd.), Executive Director, Corporate Strategy and C-DAC, Pune.
PENANG, MALAYSIA – ViTrox, which aims to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics packaging industries, is proud to announce the grand opening of its new office and demo center at Texas, USA. The unveiling took place on 1 January 2024, marking a significant milestone for the company's commitment to innovation and customer engagement, as well as a key step in ViTrox's global business expansion strategies, providing localized service and support coverage.
The newly established office is thoughtfully designed to enhance customer experience, featuring a meeting room for customer discussions and a dedicated machine demonstration area. The machine demonstrations area serves as the focal point of the facility, allowing visitors to witness firsthand the advanced features and exceptional performance of ViTrox's SMT PCB Assembly Solutions (Advanced 3D Solder Paste Inspection, Advanced 3D Optical Inspection, Advanced 3D X-ray Inspection, Advanced Robotic Vision, and Industry 4.0 Manufacturing Intelligence Solutions - V-ONE. With cutting-edge equipment and expert guidance, the demo center is poised to become a hub for technology customers, partners, and industry players to explore and interact with ViTrox's latest technologies and stay at the forefront of industry trends.
ViTrox Americas Inc. encourages customers and interested parties to take advantage of the demo center's capabilities by scheduling a personalized demonstration session with ViTrox experts at enquiry@vitrox.com. This opportunity allows individuals to gain valuable insights into the capabilities of ViTrox's solutions and explore how they can be tailored to meet specific business needs.
Mr. Wee Kah Khim, CEO of Board Inspection and Embedded Solutions (BIE), expressed his excitement, saying, "We are excited to open the doors of our new office and demo center, providing a dynamic space for collaboration, innovation, and hands-on exploration of our state- of-the-art SMT PCB Assembly Solutions".
"This centrally located facility underscores our commitment to delivering cutting-edge technology and fostering meaningful partnerships with our valued customers around the U.S.," added Richard Osborne, Sr. General Manager in the U.S. and Canada.
ViTrox is confident that this new facility will further reinforce its partnership with customers, aligning with its ongoing efforts for growth and excellence.
SAN JOSE, CA – SHENMAO Technology announces a strategic expansion initiative with the establishment of a new factory in Texas. The move reflects the company’s commitment to meeting the growing demand for its high-quality solder products, particularly in the automotive sector. SHENMAO anticipates that the new facility will significantly enhance its production capacity, catering to the needs of key clients, including major players in the electric vehicle manufacturing sector.
The state-of-the-art factory, strategically located near the US-Mexico border, positions SHENMAO to efficiently serve Mexican customers with automotive applications. As the automotive industry continues to evolve, SHENMAO recognizes the importance of proximity to key markets. The company aims to increase the monthly production capacity in North America by 2-3 times by the first quarter of 2024.
Despite challenges in the broader electronics manufacturing industry, SHENMAO remains optimistic about its growth trajectory. The company anticipates a slight revenue uptick in the last quarter, marking the third consecutive quarter of growth. This positive trend is attributed, in part, to a pivotal client in the electric vehicle manufacturing sector. SHENMAO has strategically positioned itself to integrate into the supply chain of this key player by expanding its production capabilities in Texas.
To ensure the success of this expansion and secure its position in the electric vehicle manufacturing supply chain, SHENMAO has invested in state-of-the-art equipment for the new factory. Trial operations are set to commence shortly, with full-scale production expected by the end of November. The new facility's primary focus will be on meeting the delivery targets for Mexican customers with automotive applications, with a vision of substantial revenue contribution within the current fiscal year.
Founded in 1973, SHENMAO has established itself as one of the world's top three solder product manufacturers. Celebrating its 50th anniversary last year, the company continues to demonstrate resilience and adaptability in a dynamic industry.
For more information, please visit www.shenmao.com
SINGAPORE – In a recent FutureScape report, IDC FutureScape: Worldwide Future of Work 2024 Predictions — Asia/Pacific (Excluding Japan) Implications, IDC predicts that by 2025, 60% of A2000 firms will upgrade hardware and software technologies to increase worker retention with personalized work experiences and enhanced collaboration by 2025. Collaborative applications are becoming more visual and will continue to develop characteristics not unlike a multiplayer game that enables a more personalized view of work and teams, better alignment to projects, and hands-on collaboration applications.
As GenAI takes center stage, its adaptive capabilities are set to streamline processes, automate tasks, and redefine the skillsets required for various roles. While this evolution brings forth unprecedented opportunities for upskilling and reskilling, it also underscores the imperative for organizations to adapt to this paradigm shift, ensuring the alignment of talent with the dynamic demands of the future workplace.
This prediction not only foretells a redefined professional landscape but also emphasizes the pivotal role of GenAI in driving organizational agility and competitiveness. In this dynamic environment, the significance of skill development cannot be overstated, as it becomes the essence of staying competitive and relevant. GenAI is not just a technological advancement but a catalyst for change in the skill landscape. The imperative for skill development is no longer a choice but a necessity in a landscape where GenAI is reshaping how we work.
Simultaneously, digital twins and sustainable office design are capturing attention, reflecting a growing focus on environmental consciousness in the region. Organizations are recalibrating priorities to balance technological innovation with a commitment to sustainability, showcasing a harmonious approach where cutting-edge technology aligns with ecological stewardship in APEJ's business narrative.
"As the benefits and applicable use cases of GenAI unfold, organizations are exploring the outcomes that GenAI can potentially bring to business operations and innovation. The focus on skill development becomes a necessity and a strategic imperative, as GenAI enables personalized development. Simultaneously, the reimagination of workplaces, with digital twins and sustainability stand out as key foci for companies," says Dr . Lily Phan, Research Director, Future of Work, IDC Asia/Pacific.
KISTA, SWEDEN – HANZA has decided to build a new factory section of 8,800 square meters in Töcksfors, Sweden. The new facility is a new and extension of HANZA's existing production facility in Töcksfors and will provide new areas for assembly in particular. The reason is a continued long-term good demand.
"This investment supports our concept of complete, regional manufacturing and creates a very strong offering in the manufacturing cluster Sweden," says Erik Stenfors, CEO of HANZA.
"We have a continuous increase in demand from many of our successful customer partnerships, such as the return management company Tomra, the heat pump company Thermia and Väderstad, which is one of the world's leading companies in tillage and seeding," says Morgan Sahlin, cluster manager in Sweden. "This is a significant investment for HANZA Sweden that makes it possible to follow our customers' needs."
Occupation of the new factory is planned for the turn of the year 2024/2025. In addition to the investment of SEK 75 million, the project includes specific investments in the machine park to support the increased assembly capacity.
The expansion will contribute positively to HANZA's sustainability work with energy efficiency improvements. In the new building, geothermal heat pumps will be installed to handle heating in both the new and existing premises, which means major energy savings.
HANZA has recently increased its capacity for circuit board manufacturing in Sweden through the acquisition of Orbit One with a factory in Ronneby.
CAMBRIDGE, UK – Semiconductor packaging technologies have evolved from initial 1D PCB levels to the cutting-edge 3D hybrid bonding packaging at the wafer level. This advancement facilitates single-digit micronmeter interconnecting pitches, achieving over 1000 GB/s bandwidth with high energy efficiency.
Four critical parameters shape advanced semiconductor packaging: power, performance, area, and cost:
2.5D and 3D packaging technology:
The 2.5D and 3D packaging technologies encompass various packaging techniques.
In 2.5D packaging, the choice of interposer material categorizes it into Si-based, Organic-based, and glass-based interposers, as illustrated in the figure above. Meanwhile, in 3D packaging, the evolution of microbump technology aims for smaller pitch dimensions. However, achieving single-digit pitch dimensions today is made possible through the adoption of hybrid bonding technology, a method that directly connects Cu-Cu, signifying a significant advancement in the field.
Advantages and drawbacks of each packaging type in both 2.5D and 3D configurations
2.5D
Si: There are two alternatives within this category: Si interposer, utilizing a full passive Si wafer, and Si bridge, which can take the form of a localized Si bridge in a fan-out based molding compound or in a substrate with a cavity. The Si interposer, commonly employed in 2.5D packaging for high-performance computing integration due to its ability to facilitate the finest routing features, faces challenges associated with its cost in both materials and manufacturing compared to alternatives like organic materials, and the packaging area limitation. To address this, the localized Si bridge form is gaining prominence, strategically utilizing Si where fine features are essential. Additionally, the Si bridge structure is expected to see increased use, particularly in scenarios where Si interposer faces limitations in area, pushing beyond the 4x or 5x reticle limit.
Organic: In the report, we specifically consider organic-based packaging that utilizes a fan-out molding compound rather than an organic substrate. Organic materials, with the capability to adjust their dielectric constant lower than silicon, contribute to lower RC delay in the package. Moreover, these materials present a more cost-effective alternative to silicon. These advantages drive the emergence of organic-based 2.5D packaging. However, a key drawback lies in the challenges associated with achieving the same level of interconnect feature reduction as Si-based packages.
Glass: The glass-based approach has gained significant interest following Intel's unveiling of its glass-based test vehicle package earlier this year. Glass possesses advantageous properties, including tunable Coefficient of Thermal Expansion (CTE), high dimensional stability, and a smooth, flat surface. These characteristics position glass as a promising candidate for serving as an interposer, with routing features that have the potential to rival those offered by silicon. However, the main drawback of glass lies in its immature ecosystem and a current lack of large-volume mass production capability in the packaging industry. Nevertheless, as the ecosystem matures and production capabilities advance, the use of glass-based technologies in semiconductor packaging may see further growth.
3D
Microbump: The well-established microbump technology, based on the Thermal Compression Bonding (TCB) process, has a longstanding presence across diverse products. Its roadmap involves ongoing scaling of bumping pitch. However, a critical challenge emerges as smaller solder ball sizes in this process result in heightened Intermetallic Compounds (IMCs) formation, diminishing conductivity and mechanical properties. Additionally, close contact gaps may lead to solder ball bridging, risking chip failure during reflow. With solder and IMCs exhibiting higher resistivity than copper, their use in high-performance component packaging faces limitations.
Hybrid bonding: Hybrid bonding involves creating permanent interconnections by combining a dielectric material (SiO2) with embedded metal (Cu). With Cu-Cu hybrid bonding achieving pitches below 10 micrometers (typically around one-digit µm), advantages include expanded I/O, increased bandwidth, enhanced 3D vertical stacking, heightened power efficiency, and reduced parasitics and thermal resistance due to the absence of underfill. Challenges encompass manufacturing complexities and higher costs associated with this advanced technique.
IDTechEx’s new report, "Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications", thoroughly explores the latest innovations in semiconductor packaging technology, covering key technical trends, analyzing the value chain, evaluating major players, and providing detailed market forecasts.
The report recognizes the crucial role of advanced semiconductor packaging as the foundation for next-generation ICs. It focuses on its applications in key markets such as AI and data centers, 5G, autonomous vehicles, and consumer electronics. Leveraging IDTechEx's expertise in these sectors, the report delivers a comprehensive understanding of the impact and future trajectory of advanced semiconductor packaging in these critical fields.