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AUSTIN, TX – S and Y Industries, a leading contract manufacturer for printed circuit board assemblies and electro-mechanical assemblies, has successfully implemented Cetec ERP, transforming their manufacturing operations. The collaboration with Cetec ERP and CalcuQuote has brought significant improvements, streamlining processes and enhancing productivity.

S and Y Industries, based in Wichita, Kansas, with over 120 employees, has been navigating the challenges of the global parts shortage while maintaining a strong position in their industry. The need for efficient and agile solutions led them to explore Cetec ERP as their ERP software of choice.

With a global parts shortage impacting the purchasing operations, the company faced difficulties in managing confirmations, adjusting purchase orders, and reordering parts efficiently. S and Y Industries recognized the need for an automated solution to address this challenge.

The collaboration between Cetec ERP and CalcuQuote offered a comprehensive solution to the parts shortage issue. By implementing a new purchasing integration, S and Y Industries has reduced the time required to process 4,000 lines of demand from six weeks to just four hours. This change enables their purchasing team to focus on more strategic tasks, such as material management and supplier relationships.

S and Y Industries General Manager, Matt Miers expressed his enthusiasm about the partnership with Cetec ERP and CalcuQuote, “The instant confirmations and significant reduction in data entry is expected to eliminate over 100,000 lines of data entry annually.” He also pointed out the broader benefits of Cetec ERP in terms of improving receiving processes, kitting processes, and providing the ability to go entirely digital. Miers added, “Cetec ERP's APIs enable seamless communication between various systems and streamline operations on the shop floor.”

Additionally, S and Y Industries commended Cetec ERP's software-as-a-service model, which aligns perfectly with their requirement for a dynamic and constantly evolving solution. They emphasized Cetec ERP's dedication to introducing new features and offering a forward-thinking approach that aligns with their growth goals.

The team at S and Y Industries envisions that this software will play a pivotal role in their journey toward full digitization, enhancing their scalability and competitiveness.

To learn more about Cetec ERP and their advanced manufacturing software solutions, visit www.cetecerp.com

IRVINE, CA – When it comes to the combination of price, scale, component availability, quality, and short lead times, China continues to be the most popular destination for overseas PCBA and contract electronics manufacturing and will continue to be so for decades to come. In fact, Chinese manufacturing recently reached a record high in 2023. Here is why:

Cost-effectiveness: China is known for its lower manufacturing costs compared to many other countries, including Southeast Asia, North Africa, and Eastern Europe due to lower labor costs, economies of scale, and access to a vast network of suppliers. This can help reduce costs by 30% to 80%, depending on the labor intensity of production.

Manufacturing expertise and capabilities: China has developed extensive manufacturing expertise, technical capabilities and infrastructure to handle large-scale manufacturing projects.

Supply chain integration: China has a well-established and extensive supply chain ecosystem with numerous Component OEMS and Distributor suppliers right in its own backyard, so manufacturers like Ark Electronics can efficiently source raw materials and components. This integration within the supply chain helps streamline production processes and reduce lead times by up to 70%.

Flexibility and scalability: As a top-rated contract and PCBA manufacturer, we are accustomed to handling varying production complexities and volumes and can quickly scale up or down based on demand fluctuations. Ark is equipped to handle your requirements whether you need a small prototype batch or large-scale production runs.

Strong engineering and technical capabilities: Ark offers comprehensive engineering support, including design review, prototyping, and testing services. This technical expertise ensures that your PCBA meets the required specifications and quality standards.

Speed to market: With its efficient manufacturing processes and infrastructure, Ark can offer faster time-to-market for products. Our efficient supply chain and well-established logistics infrastructure enable faster turnaround times for PCBA manufacturing to produce and deliver goods in a relatively short timeframe, enabling businesses to respond quickly to market demands and gain a competitive edge.

Quality control: While it's essential to exercise due diligence when selecting a manufacturer, many Chinese PCBA manufacturers adhere to international quality standards. Ark Electronics' reputation for implementing stringent quality control processes to ensure the reliability and performance of the assembled PCBs is unequaled.

Global market access: With our deep relationships in China, Ark can provide businesses a gateway to reach global markets efficiently. We are experienced in navigating international regulations, logistics, and shipping processes, facilitating smooth export operations.

Ark Electronics is a full-service EMS (Electronics Manufacturing Services), and ita North American and European leadership, offers assistance beyond production in a wide array of value-added services, including support with design, design for manufacture, NPI bring-up, supply chain management, configure-to-order, testing, outbound logistics, repair elements, and more.

Visit our website for more information at www.arkelectronics.com 

NEWMAN LAKE, WA – Hentec Industries/RPS Automation is pleased to announce that TE Connectivity has ordered a Hentec/RPS Odyssey 1750 robotic hot solder dip component lead tinning system for installation in their Mount Joy, Pennsylvania facility.

The Odyssey 1750 is a MIL spec complaint high-volume, high-mix component lead tinning machine equipped with auto load/unload functionality and is capable of processing dual solder alloys. Designed to tin component leads for re-conditioning, gold removal and re-tinning applications, including high reliability and military applications including DIP, SIP, QFP, BGA, axial and radial components as well as BGA de-balling. The Odyssey 1750 complies with all applicable GEIA-STD-006, MIL-PRF-38535, MIL- PRF-38524E and ANSI-J-STD-002 standards.

SANTA ROSA, CA – At productronica 2023, Keysight will demonstrate its portfolio of solutions designed to accelerate innovation in electronic manufacturing. Keysight enables innovators to push the boundaries of engineering by quickly solving design, emulation and test challenges to create the best electronic manufacturing experiences. Whether you’re looking to empower IIoT networks for Industry 4.0, e-mobility or autonomous driving, test RF components, or digital compliance, Keysight accelerates innovation with intelligent insights that reduce risk and speed time-to-market.

When: November 14-17, 2023

Where: Keysight stand A1-576 Messe, München, Germany

Media: Contact Jenny Gallacher to schedule media briefings and solution demonstrations.

Keysight will also be holding an in-person media breakfast at productronica on Tuesday November 14 at 9:00am CET. Interested journalists and industry analysts can contact Jenny Gallacher to reserve a spot.

Info: https://www.keysight.com/br/pt/events/europe-middleeast-africa-india/tradeshows/productronica.html 

Keysight experts will be on hand to demonstrate:

  • In-circuit test and printed circuit board handling
    • The Keysight i3070 Series 7i E9988GL inline, high-density in-circuit test (ICT) features the latest Quad-Density pin cards that can provide up to 5760 test nodes in a slim footprint. This enables manufacturers to economically meet increasing test demands for large printed circuit board assembly (PCBA).
    • The Medalist i3070 In-Circuit Test (ICT) Systems is a 19” rack-type handler for parallel in-circuit tests on printed circuit boards that are routed through the handler on transport belts. The handler’s multi-functionality lies in the fact that the modular MFT 19 provides single lane, dual lane, single segment, dual segment, single well, and dual well configurations, enabling an increase of up to four times in throughput compared to a standard single lane tester.
  • Combining In-circuit Test (ICT) and Functional Test (FCT)
    • Offering customers the flexibility to combine and streamline test coverage of both ICT and FCT, The Keysight i7090 Board Test system provides a more efficient balance between throughput and test coverage to help customers drive improvements in the cost-of-test.
  • Test Automation Software
    • Product life cycle management (PLM) ecosystems are the backbone of product development, with many interconnected systems that make comprehensive testing a challenge. Eggplant excels in adapting to diverse CAD / PLM environments, comprehensively automating rich and thin client testing with customizations, and enabling unrestricted testing of 3D moving images and PLM functionality evaluation. Keysight will also demonstrate the PathWave Test Automation suite which delivers significant cost- and time-saving benefits over traditional test automation and analysis tools.
  • Big Data Analytics
    • Combining test and measurement expertise with data science and big data engineering, the PathWave Manufacturing Analytics platform provides actionable insights for every level of your organization in the smart factory of the future. Improve yield, lower retest and handling, and reduce the cost of poor quality with big data advanced analytics.
  • Digital compliance and RF testing
    • Experience a new level of speed with the most advanced oscilloscopes — the new Infiniium UXR-B and MXR-B Series.
    • Learn how to cover multiple measurement parameters with a single connection, including noise figure, error vector magnitude (EVM), adjacent channel power ratio (ACPR), and standard S-parameters.
  • Multi-channel SMU
    • New at the Keysight booth this year is the latest source measurement unit (SMU) solution that addresses growing footprint challenges. Solve design, test, and validation challenges with the PZ2100 SMU solution.
  • IoT device testing
    • The Keysight NB-IoT and LTE-M signaling tester can help solve manufacturing test challenges.
  • Next generation bench solutions
    • Keysight’s bench solutions are designed to provide the broadest range of power and measurement solutions, from dependable TrueVolt digital multimeters and MegaZoom technology in InfiniiVision oscilloscopes and compact multi-channel power supplies to versatile data acquisition systems with digitizers and solid-state multiplexer modules. See trusted solutions, such as the 6.5-digit multimeter, or discover Keysight’s latest battery test, profiler, and emulation solution.

AUSTIN, TX – EMS Solutions, a leading PCBA contract manufacturer based in Northern Utah, is thrilled to share its success story of adopting Cetec ERP to drive operational transformation and support its ongoing growth. With a team committed to pushing the boundaries of what's possible, EMS Solutions has harnessed the power of Cetec ERP to enhance its processes, boost efficiency, and create a foundation for traceability and project costing.

Streamlining Operations with Cetec ERP

EMS Solutions operates as a printed circuit board assembly contract manufacturer, where precision and efficiency are paramount. To align their operations with the evolving industry standards, the company embarked on the path to maximize the potential of Cetec ERP.

The adoption of Cetec ERP has revolutionized various aspects of EMS Solutions' workflow, enabling them to manage Bill of Materials, drawings, quoting, engineering, procurement, inventory management, kitting, and much more seamlessly. The software allows them to monitor and manage each phase of production, ensuring a comprehensive view of their operations.

One of the key features of Cetec ERP that EMS Solutions appreciates most is the robust traceability it offers. Jody Mecham, Controller at EMS Solutions, stated, “With Cetec ERP, we can track and analyze who is doing what, when, and why. This level of traceability enhances our ability to make data-driven decisions, effect corrections, and optimize operations in real-time.”

Supporting Ongoing Growth

EMS Solutions is experiencing continuous growth, and Cetec ERP has proven to be a scalable solution that can keep up with their expansion. The company is confident that Cetec ERP will not only support their current needs but also cater to their future requirements as they move forward.

The dedicated team at Cetec ERP has played a pivotal role in ensuring the success of this transformation. Their commitment to EMS Solutions' success goes beyond mere vendor-client relationships; it is built on the foundations of partnership and collaboration.

EMS Solutions is excited about the potential and the future that Cetec ERP offers. This transformative journey has been a testament to the power of technology, collaboration, and a shared commitment to success.

To learn more about Cetec ERP and their advanced manufacturing software solutions, visit www.cetecerp.com 

CLINTON, NY – Indium Corporation® is proud to showcase its proven advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.

With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature its Rel-ion™ suite of electrical, mechanical, and thermal solutions to reduce electric vehicle (EV) manufacturers’ time to market.

More than four million EVs are on the road with Indium Corporation’s reliable, scalable, and proven Rel-ion products. Rel-ion materials solutions deliver reliability by:

  • Eliminating non-wet opens and head-in-pillow defects
  • Preventing dendritic growth by meeting stricter surface insulation resistance requirements
  • Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
  • Reducing hot spots-induced voiding through improved thermal efficiency

Some of the Rel-ion products featured at productronica include:

  • Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.
  • Award-winning InFORMS® – reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
  • InTACK™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.
  • QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. The portfolio includes the InFORCE™ range of pressure sinter pastes and the InBAKE range of pressure-less sinter pastes. Applications include die attach and substrate attach in power electronics.
  • Award-winning Durafuse® LT – a novel solder paste mixed alloy system with highly versatile characteristics that enable it for energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
  • Durafuse® HR – based on a novel alloy technology, delivers enhanced thermal cycling performance (-40/125°C and -40/150°C) and superior voiding performance for high reliability automotive applications.
  • Indium8.9HF Solder Paste Series – an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.

To learn more about why over four million electric vehicles are on the road with Indium Corporation’s innovative materials, visit booth #A4.309 or indium.com/emobility 

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