PHARR, TX ― ROCKA Solutions proudly announces the addition of Global SMT award-winning Rep of the Year, PIT Equipment Services, LLC, led by Don Dennison, as its first representative in the United States. This strategic partnership marks a significant milestone in ROCKA Solutions’ expansion plans and reinforces the company's commitment to building a robust sales team. Dennison will represent ROCKA Solutions on the east coast in the states of New York, Pennsylvania, New Jersey, Maryland and Virginia.

ROCKA Solutions is experiencing remarkable growth and expansion, and the collaboration with Equipment Services aligns with the company's vision to establish a strong presence in the USA. As the demand for innovative stencil cleaning solutions continues to rise, ROCKA Solutions is strategically positioning itself to meet the evolving needs of the electronics manufacturing industry.

Don Dennison, founder and CEO of PIT Equipment Services, LLC, brings a wealth of experience, dedication, and positive energy to the ROCKA Solutions team. His extensive knowledge of the electronics industry, coupled with a commitment to staying abreast of industry changes, distinguishes him as a highly competent and unique professional.

Established in 1988, PIT Equipment Services has been a trusted partner to electronic assembly companies in the New York/New Jersey/Eastern Pennsylvania metropolitan area. Dennison’s leadership has been instrumental in the company’s mission to provide unparalleled assistance, leveraging extensive product knowledge and cultivating strategic customer relationships.

As ROCKA Solutions continues to expand its reach, the addition of PIT Equipment Services is a strategic move to enhance customer support and accessibility in the United States.

SUWANEE, GA – The SIPLACE TX micron is the answer to the challenges manufacturers face in SiP (system-in-package) production. The flexible platform combines the speed of SMT assembly with the complexity of die processing. The new version of the pick-and-place machine has been significantly improved by market and innovation leader ASMPT in terms of speed and placement accuracy as well as transport and processing options. The hybrid system offers electronics manufacturers greater flexibility and thus significant competitive advantages for their Intelligent Factory.

A SiP (system-in-package) combines active and passive electronic components into compact functional groups for things like radio modules in smartphones, wireless earphones or smartwatches. The advanced packaging technology required for this assembles dies, bare semiconductor chips, as well as classic SMT components. The high demand for such modules can only be satisfied with machines that process dies with the same high speed that is common in the SMT world and with the level of precision that is common in die processing. It involves the placement of passive SMD components, which must often be positioned very close to each other, with exceptional precision.

Two worlds and three precision classes in one machine

The SIPLACE TX micron from ASMPT fully meets these tough industrial requirements of the industry. After a further increase in the machine’s precision, three accuracy classes are now available for advanced packaging applications in a single machine: 10, 15 and 20 microns, each with a process stability of 3 sigma. Despite its improved basic accuracy from 25 to 20 microns, the machine achieves a placement speed of 93,000 cph – an increase of 14 percent compared to the previous 20-micron class of the SIPLACE TX micron. With its maximum placement accuracy of 10 microns, the machine can process an unprecedented 62,000 components per hour even in mixed SiP applications.

Larger components and boards

Thanks to its larger vacuum tooling, the SIPLACE TX micron can now process substrates measuring up to 300 by 240 millimeters with an accuracy of 15 microns @ 3 σ. New as well is the high-resolution SST54 circuit board camera with improved lighting performance for smaller structures, fiducials, and barcodes.

With the Long Board Option, the SIPLACE TX micron can process PCBs measuring up to 590 by 460 millimeters (23.2 by 18.1 inches). Also new is an optional multi-purpose conveyor system that allows regular PCBs, PCBs with carriers up to 20.5 mm high or curvatures as well as J-boats and JEDEC trays to be used as carriers. And customers who manufacture for highly demanding customers like those in the automobile industry will appreciate the optional level of traceability directly from the tape.

Now compatible with SIPLACE Tray Unit

As an added benefit for fast and uninterrupted production, the SIPLACE TX micron can now also be operated with the SIPLACE Tray Unit, which accommodates carriers that can each hold two JEDEC trays. Depending on the size of the components, up to 82 JEDEC trays or 41 wide trays measuring up to 355 by 275 millimeters fit into the unit. As a special feature, new trays can be added without having to interrupt the production because the magazine is split into a buffer zone for the continuous supply and the main storage area, which can be refilled with new trays.

Proven quality

Unchanged in the new version are established features such as the cost-saving detection of damaged or unusable components and the high-resolution component vision system with blue light that improves the image contrast for especially fine structures and balls. The SIPLACE TX micron is also certified in accordance with ISO Class 7 cleanroom requirements and Semi S2/S8.

A safe investment

“ASMPT’s product portfolio covers a wide range of areas for processing dies as well as SMT components,” explains Sylvester Demmel, Senior Product Manager at ASMPT. “To meet the changing market requirements, it was only logical for us to combine these two worlds in one machine, thus giving electronics manufacturers the opportunity to benefit from more flexibility and economic advantages for their Intelligent Factory. With its high precision and maximum placement speeds, the new SIPLACE TX micron is a future-proof investment that is profitable.”

GENEVA, SWITZERLAND – To drive the global chemical industry on a path to net-zero emissions by 2050, the Low-Carbon Emitting Technologies (LCET) initiative, incubated and hosted by the World Economic Forum for more than three years, has now officially launched as the independent Global Impact Coalition.

With a suite of leading-edge projects, the CEO-led coalition, founded by BASF, SABIC, Covestro, Clariant, LyondellBasell, the Mitsubishi Chemical Group, and Solvay will focus on accelerating the development and upscaling of low-carbon emitting technologies for chemical production and related value chains. With a focus on innovation, partnerships, and the development of net-zero production methods, the new Coalition can make an important contribution to carbon neutrality and sustainable growth.

“After over three years of incubation within the World Economic Forum and led by tangible results in the decarbonization space, we are delighted to witness the Global Impact Coalition emerge as an independent legal entity,” said Børge Brende, President, World Economic Forum. “We are dedicated to nurturing our strong relationship, bolstering sustainability and innovation within the chemicals sector.”

Leading Demonstration Projects

The Coalition will incubate projects with a proven approach pioneered by the LCET. Example projects coming from Coalition member companies:

The R&D Hub for Plastic Waste Processing - which will focus on developing new technologies for waste processing with a lower CO2 footprint and greater levels of plastic waste recycling.

Electrically Heated Steam Cracker Furnace - collaboration to construct the world’s first demonstration plant for large-scale electrically heated steam cracker furnaces.

Marking a milestone

The Coalition is a collaboration of incubation of low carbon emittance technologies in the chemical industry, supported by an expert community of more than seventy senior chemical industry executives. Its transition from a World Economic Forum initiative into the new, independent Coalition marks an important milestone and has been made possible by its founders.

“I see immense potential in reshaping the chemical industry's impact on our planet. One of our goals is in forging new pathways to achieve this, through collaboration, business model transformation, and solid partnerships that create true value in our drive to a net zero future. I am extremely excited to lead the charge, focused on less talk, more results”, said Charlie Tan, Global Impact Coalition’s Chief Executive Officer.

At the cornerstone of the global economy, the chemical industry provides essential materials, technologies and building blocks for 95% of all manufactured goods. As a crucial part of almost all sectors, sourcing and using alternative and sustainable sources of carbon will have an important impact in the fight against climate change.

TAIPEI – On November 23, Foxconn Industrial Internet (601138: SH) officially released the first "Industrial Fortune SDGs Strategy White Paper", announcing that it responded to the United Nations' Agenda 2030 for Sustainable Development, incorporated SDGs into the company's development strategy, and explicitly proposed SDG "3C Response Strategies" with Industrial Fortune's characteristics as well as 16 action objectives, drawing up a blueprint for the comprehensive advancement of sustainable development work.

Zheng Hongmeng, Chairman of the Board of Directors and Chairman of the Sustainable Development Committee of Foxconn Industrial Internet, expressed that, "Foxconn Industrial Internet attaches great importance to sustainable development, and while adhering to the 'EPS+ESG' sustainable management formula, the company will further focus on SDGs in the future, as an important part of the strategy of 'deeply cultivating in China, laying out the global', and maximize the response to the Agenda 2030."

In 2015, all United Nations Member States unanimously adopted the 2030 Agenda for Sustainable Development, which contains 17 goals and 169 specific actions to address climate change, reduce inequality, eradicate poverty, etc., and covers various aspects of the economy, society, and the environment, i.e. the United Nations Sustainable Development Goals (SDGs). In 2023, at the midpoint of the implementation of the 2030 Agenda, Foxconn Industrial Internet officially launched the SDG Response Initiative, aiming to utilize its corporate strengths to focus on and solve social development issues, while creating new business value. In the white paper, Foxconn Industrial Internet disclosed for the first time its SDG "3C Response Strategy". Specifically, it is supposed to creat corporate competitiveness, assist industrial transformation and upgrading, and promote social prosperity and win-win situation, fully taking into account the company's development strategic plan. This strategy takes into full consideration the company's strategic development plan, core competitiveness and the sustainable development needs of the locations where it operates. In order to effectively implement the SDG "3C Response Strategy", the company has further put forward "9 visions, 16 action goals and 30 specific indicators" to carry out SDG actions in a targeted manner, focusing limited resources on the SDG goals most relevant to the company's operational activities and value chain. SDG targets, and maximize its contribution to global sustainable development while realizing its own growth.

As a leading enterprise in intelligent manufacturing, the operation and development concepts of Foxconn Industrial Internet in dual-carbon practice, scientific and technological innovation, employment promotion, employee care, safe production, and social activities are highly compatible with the United Nations's SDGs, and Foxconn Industrial Internet has been encouraging all units to actively carry out sustainable development practices.

In terms of green and low carbon, Foxconn Industrial Internet actively responds to the national "dual-carbon" strategy and clearly puts forward carbon neutral action targets and specific plans, committing to reduce operational carbon emissions by 80% by 2030 compared with the base year of 2020, achieve operational carbon neutrality by 2035, and realize net-zero emissions in the value chain by 2050; by 2022, Foxconn Industrial Internet will achieve an annual carbon reduction of 15 percent; and by 2020, Foxconn Industrial Internet will achieve an annual carbon reduction of 15 percent. IFE has achieved an annual carbon reduction of 153,000tCO2e, a gramatic 300% year-on-year increase in emission reduction; at present, IFE has built 12 green factories across the country, of which 7 are national and 5 provincial and municipal, and the number will increase to 16 by 2025, and plans to achieve green factory certification for 100% of its key carbon-emitting units by 2030.

From the perspective of digital transformation and sustainable industry, Foxconn Industrial Internet is deeply committed to the digital economy industry, providing more green transformation solutions for the society through technological innovation, and helping to build an inclusive and sustainable industry. For five consecutive years, it has been selected as a national "double span" platform, and has empowered the creation of six world-class lighthouse factories and more than 30 smart factories, serving more than 1,500 digitally transformed enterprises, continuing to polish the new competitive advantage for the high-quality development of China's manufacturing industry, and helping the industry's digital transformation.

In terms of employee care, with nearly 200,000 employees globally, Foxconn Industrial Internet adheres to the principle of people-oriented and insists on advocating a workplace culture of diversity, equality, and integration; creates a healthy workplace through the establishment of a sound employee health management system, with the Employee Mental Health Program covering 100% of the domestic and overseas factories by 2030; and continues to provide a major disease relief program and assistance in medical treatment for diseases, with 100% coverage for both domestic and overseas.