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AUBURN HILLS, MI – The Murray Percival Company, an award-winning manufacturer’s rep in the Midwest and a leading distributor of electronics assembly solutions, is excited to announce the addition of Teknek, the global leader in bare board contamination removal, to its product lineup. This strategic partnership brings Teknek’s revolutionary BC-40 board cleaner to the North American market, offering manufacturers cutting-edge solutions for reducing defects and optimizing production yields.

Teknek’s advanced contact cleaning technology is globally recognized for its ability to remove even the tiniest particles — down to sub-micron levels —ensuring unmatched contamination control. With over 40 years of experience and more than 30 key patents, Teknek continues to set the standard for reliability and innovation in electronics manufacturing.

Contamination is a leading cause of defects in surface mount technology (SMT) assembly, particularly at the solder print stage, which accounts for over 60% of defects according to SMTA studies.

Teknek’s BC-40 is designed to eliminate particles that can cause:

  • Blocked stencils
  • Tombstoning
  • Insufficient solder joints
  • Opens and bridges
  • Misplaced components

The Tek-BC-40 meets ANSI ESD s20.20. This low- static, low-strain board cleaner ensures the highest levels of contamination removal. Fully compatible with Industry 4.0 standards, it delivers precision cleaning while maintaining process safety and reliability. The Tek-BC-40 is the latest innovation in Teknek’s lineup. The BC-40 takes contamination control to new heights, providing enhanced cleaning performance for manufacturers aiming to meet zero-defect goals.

Tek-BC-40 is ideal for use before solder paste application and after laser marking, ensuring that boards are production-ready at critical stages in the assembly process.

Teknek’s proprietary technology combines precision elastomer rollers and tailored adhesive systems to effectively capture and remove contamination. This reduces costly defects while extending the life of stencils and other production equipment.

“Adding Teknek to our line card underscores our commitment to providing best-in-class solutions for our customers,” said Murray Percival III, Sales Manager at the Murray Percival Company. “These cleaners will help manufacturers reduce defects and increase yields, we look forward to introducing this product line to companies that are quality driven.”

For more information or to request a demo of the Teknek BC-40, visit www.murraypercival.com or contact (800) 405-1730 or info@murraypercival.com 

SAN JOSE, CA – Test Research, Inc. (TRI) will join the IPC APEX EXPO 2025 held at Anaheim Convention Center on March 18 – 20, 2025. Visit TRI at booth #2905 to experience TRI's latest test and inspection solutions for the electronics manufacturing Industry.

TRI's lineup will include the enhanced 3D SPI TR7007Q SII and 3D AOI TR7700Q SII with a new optical configuration of a 21MP Camera and 9.8um Resolution. TRI will also highlight the latest multi-angle 3D AOI, TR7500QE Plus, for hidden solder joint defects. TRI will also showcase the High-Speed 3D Inline Automated X-Ray Inspection TR7600 SIII and the High-Resolution 3D CT AXI TR7600F3D SII. TRI's Optical Inspection Solutions are powered by AI-Algorithms and Metrology measurement capabilities.

The IPC APEX 2025 lineup also includes the Multi-core ICT TR5001Q SII INLINE with up to 4,096 test points and can handle boards of up to 510x510 mm in size. With over 35 years in the market, TRI Board Tester ATE Solutions range from MDA and Functional Tests to High-End High-Pin Count ICTs, making them ideal for Multiple Electronics Manufacturing Industries.

The AI-powered solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI solutions comply with the latest Smart Factory standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.

Visit TRI's booth No. 2905 at IPC APEX 2025 to discover why the top EMS businesses chose TRI as their Test and Inspection Partner.

POOLE, UK – Europlacer, a global leader in flexible SMT assembly solutions, is thrilled to announce a new collaboration with Scheiber for the successful integration of the new ii-N2 SMT placement machine from Europlacer’s advanced iineo range. This state-of-the-art machine marks an important step in modernizing Scheiber’s production capabilities, strengthening its competitive edge while upholding its commitment to local industry and innovation.

Since its founding in 1965, Scheiber has transitioned from transformer manufacturing to designing and producing advanced electronics, specializing in home automation and on-board systems for boats, motorhomes, emergency vehicles, and professional applications. Under the leadership of Franck Scheiber for over 25 years, the company has grown into a powerhouse with a €7 million annual turnover, serving major clients like Beneteau and Fountaine-Pajot.

Europlacer has been a trusted partner for Scheiber since the early 1990s, evolving from a traditional supplier relationship into a true collaboration. Scheiber’s designation as a Beta-testing site for Europlacer's cutting-edge machines and software illustrates the depth of their partnership.

According to Mr. Scheiber, the investment in the ii-N2 was a natural evolution to meet new market demands. “The iiCo machine served us well but had reached its limits. The ii-N2 ensures technological continuity, improves quality, and aligns perfectly with our ambitions to remain competitive while preserving local jobs.”

The ii-N2 placement machine addresses critical productivity and quality challenges for Scheiber while maintaining the flexibility necessary for small and medium production runs. Its ability to handle a range of components has already provided new opportunities, positioning the company for continued success.

Key features provided by the ii-N2 that are important to Scheiber include:

  • Enhanced Quality Control: Integrated electrical testing of components on the machine eliminates errors early in the process.
  • Digital Ecosystem: Advanced stock management, MSL tracking, and production traceability tools provide real-time oversight and scalability for future growth.
  • Generational Compatibility: Seamless integration with existing feeders ensures cost-effective, phased upgrades.

“For us, it's more than just a machine; it's a complete ecosystem that adapts as we evolve,” shared Géraldine Mary, Scheiber’s Operations Manager.

Despite space constraints, the installation of the ii-N2 was successfully executed with Europlacer's support. Results included a substantial boost in production capacity, faster installation times, and reduced changeover times. “We’ve gained in both quality and flexibility, which are critical in our industry,” noted Mr. Scheiber.

The collaboration between Europlacer and Scheiber goes beyond the acquisition of ii-N2. Both companies are committed to leveraging advanced technologies to achieve even greater precision and efficiency.

Looking ahead, Scheiber intends to explore additional features of the ii-N2’s ecosystem to drive continuous improvement. “This partnership exemplifies innovation and local commitment, paving the way for sustained growth and competitiveness,” added Ms. Mary.

For more information about Europlacer, visit www.europlacer.com

NEW BRITAIN, CT – MicroCare, LLC, a global leader in critical cleaning solutions, is excited to announce that Greg Gascon has joined the team as a Strategic Account Executive. With over 15 years of experience in sales and business development within the industrial and safety markets, Greg brings a proven record of driving growth and building strong customer relationships.

Greg’s extensive career spans leadership roles with globally recognized companies, including 3M, Bosch USA, and Graco. Most recently, he served as Regional Product Specialist for 3M’s Industrial Tapes and Adhesives Division, where he excelled in driving sales strategies and exceeding performance goals across multiple territories.

“I am thrilled to join the MicroCare team,” said Greg. “The MicroCare commitment to innovation, quality, and sustainability aligns perfectly with my own professional values. I look forward to collaborating with the team to deliver solutions that help our customers achieve their goals.”

In his new role, Greg will be responsible for managing and growing relationships with distributors and end users. His strategic expertise in industrial cleaning equipment and cleaning fluids aligns with the MicroCare mission to provide best-in-class cleaning solutions across diverse industries.

“Greg’s wealth of experience and leadership in the industrial sector make him an exceptional addition to our sales team,” said Vince Libercci, National Sales Manager at MicroCare. “We are confident that his customer-focused approach and industry knowledge will further enhance the MicroCare reputation for excellence and drive our growth in key markets.”

Greg holds a Bachelor of Science in Business Administration with a focus on Management Information Systems from Alfred University, where he was also a member of the Men’s Varsity Lacrosse team.

REDDITCH, UK – Altus Group, a leading distributor of capital equipment in the UK and Ireland, emphasises the importance of reducing voids in reflow soldering to improve manufacturing efficiency and product reliability. As one of their key suppliers, Heller Industries, a global provider of electronic manufacturing reflow solutions, has developed multi-stage controlled vacuum technology that reduces void rates to below 1%. This technology is especially beneficial for industries like semiconductor and surface-mount technology (SMT) assembly, where maintaining high-quality solder joints is crucial.

With the increasing demand for high-performance electronics, reducing voids in solder joints is essential for ensuring long-term reliability. Heller’s vacuum-assisted reflow soldering process has proven to significantly reduce void rates by up to 99% while addressing substrate and wafer warpage, critical challenges for the electronics manufacturing industry.

Heller’s vacuum technology creates a controlled vacuum environment during the reflow process, allowing gas bubbles to escape, reducing void formation. This results in improved heat dissipation, better product stability, and enhanced performance, particularly in high-frequency applications. Additionally, the technology helps eliminate solder splatter and prevents solder bridging, further improving manufacturing efficiency.

Joe Booth, CEO of Altus Group, said: "We are lucky to have suppliers that are dedicated to developing solutions that make a real difference for our customers and voiding is top of mind for many globally. Heller's multi-stage controlled vacuum technology advancements are a perfect example of a supplier addressing a trend, offering manufacturers a way to improve solder joint quality and eliminate issues like voiding whilst mitigating warpage. By helping customers optimise their reflow soldering processes, we’re enabling them to achieve higher quality products and more efficient operations.”

Heller’s vacuum-assisted reflow technology, now widely implemented across customer installations in production, offers manufacturers a cost-effective solution with high efficiency and low unit per hour (UPH) rates, making it ideal for optimising production without compromising quality.

Altus in partnership with Heller are a significant force in the electronics manufacturing industry, helping manufacturers address key convection reflow process related challenges. Through its ongoing collaboration with Heller Industries, Altus is supporting over 200 manufacturing sites in the UK using Heller to improve process reliability, product quality, and operational efficiency, further reinforcing its role as a trusted industry partner.

SAN DIEGO, CA – PARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce the appointment of Equipment Sales Southeast as its new representative for the Southeastern United States. This partnership will cover the territories of Georgia, Tennessee, Alabama, Mississippi, and Florida.

Founded in 2005, Equipment Sales Southeast has built a strong reputation as a premier manufacturers’ representative for the electronics assembly industry. With a team of highly skilled professionals with engineering expertise in the Printed Circuit Assembly (PCA) sector, Equipment Sales Southeast delivers tailored solutions that align with PARMI's commitment to quality.

“Equipment Sales Southeast is an ideal partner for PARMI,” said Juan Arango, Head of Sales and Business Development at PARMI USA, INC. “Their deep industry knowledge, customer-first approach, and strong relationships in the region make them the perfect choice to represent our cutting-edge 3D inspection technologies. We are confident that this collaboration will enhance our ability to serve customers and drive success across the Southeastern United States.”

With a full portfolio of advanced 3D inspection equipment for the SMT, Micro-electronics and Semiconductor packaging industries, PARMI is dedicated to helping manufacturers achieve superior quality and efficiency. PARMI is committed to expanding its reach and providing localized support to customers in key territories.

For more information about Equipment Sales Southeast, visit www.equipmentsalessoutheast.com 

For more information about PARMI USA and its suite of advanced 3D inspection systems, visit www.parmi.com 

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