CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Upper Midwest Expo & Tech Forum taking place on June 4 at Union Depot in St. Paul, Minnesota. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Upper Midwest Expo & Tech Forum on June 4th, or visit www.aimsolder.com 

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX ® MX2123 Multi-Process Power Module Cleaner.

MICRONOX MX2123 is a cutting-edge, aqueous, multi- phase chemistry meticulously crafted to eliminate flux residues from various IGBT module devices employing a combination of copper, silver and nickel DBC substrates, alongside PCBs. With its precisely balanced formula, MX2123 ensures exceptional surface conditions for subsequent wire bonding and potting processes, while safeguarding base metals with its retention of anti- oxidation materials like Organic Solderability Preservative (OSP) post-cleaning.

Renowned for its effectiveness at low temperature and concentration levels, MX2123 can be effortlessly monitored in both in-line SIA cleaning systems and Ultrasonic Immersion cleaning systems.

PCIM Europe is a premier event for power electronics and its applications, offering a platform for industry leaders to showcase the latest innovations and technologies. For more information about KYZEN and its advanced packaging solutions, stop by Hall 5, Stand 100 or visit www.kyzen.com 

NORTH BILLERICA, MA – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce its participation in SMTconnect 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. The company will exhibit its latest innovations in reflow technology at the booths of its manufacturers' representatives, ANS answer elektronik Service- & Vertriebs GmbH and Stratus Vision GmbH.

ANS, located at Hall 4, Booths 245-345, and Stratus Vision, located in Hall 4 Booth 247, will host BTU International's advanced reflow solutions. BTU will feature its Pyramax 100A unit in the ANS booth and the Aqua Scrub™ Flux Management unit in the Stratus booth, offering attendees firsthand experience with state-of-the-art thermal processing equipment.

The Pyramax 100A reflow oven integrates advanced features, including closed-loop convection control and the Wincon oven control system, to deliver superior performance and reliability within a compact footprint. Designed to meet the evolving demands of modern electronics manufacturing, the Pyramax 100A ensures precise temperature control and uniform heating for optimal soldering results.

In the Stratus Vision booth, BTU International will highlight its Aqua Scrub™ Flux Management Technology. This next-generation solder reflow flux management system is engineered to significantly reduce operational costs compared to traditional condensation systems. Aqua Scrub's patent-pending design utilizes aqueous-based scrubber technology compatible with a wide range of paste and flux types, offering enhanced efficiency and productivity while drastically lowering scheduled downtime. The Aqua Scrub flux management system is designed within the new Aurora platform of reflow ovens and can also be retrofitted to current Pyramax units.

Company representatives will discuss how the new Aurora platform is guiding the way to the lights out Industry 4.0 factory of the future by seeing reflow in a new light. Implementing the industry’s first factory configurable heating and cooling zones provides the flexibility to customize your reflow oven for specific product/process characteristics including very heavy boards, slow cooling constraints, or increased throughput requirements.

For a hands-on view of the BTU equipment and its portfolio of thermal processing solutions, please visit ANS at Hall 4, Booth 245-345 and Stratus Vision at Hall 4, Booth 247 at SMTconnect 2024.

To learn more visit www.btu.com 

SAN DIEGO – KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation at the upcoming SMTconnect exhibition, taking place June 11-13, 2024 in Nuremberg, Germany.

Find KIC at the SmartRep booth 4A.225 where the company will showcase its latest innovation, Contact-less Thermal Analysis™. This groundbreaking technology enables real-time monitoring of temperature and convection changes by directly measuring board temperatures during production. With Contact-less Thermal Analysis™, manufacturers can achieve unmatched accuracy in reflow profiles, ensuring optimal quality and reliability in the production process.

Moreover, KIC will introduce its new profiling software platform, the Thermal Analysis System, featuring the addition of a cutting-edge recipe optimization search mode called Common Recipe Finder™. The Thermal Analysis System software offers a state-of-the-art User Interface, providing flexibility in reflow and wave recipe setup with a user experience akin to browsing. Common Recipe Finder™ simplifies changeover time by identifying a single recipe for multiple assemblies, thereby enhancing equipment utilization and Overall Equipment Effectiveness (OEE).

"We are excited to unveil our latest innovations at SMTconnect 2024," said Miles Moreau, General Manager at KIC. "With Contact-less Thermal Analysis™ and Common Recipe Finder™, we continue to push the boundaries of thermal process control, empowering manufacturers to achieve unprecedented levels of precision and efficiency in their production processes."

Visit KIC at the SmartRep booth 4A.225 during SMTconnect 2024 to experience its Contact-less Thermal Analysis™ and Common Recipe Finder™.

Learn more about KIC's Contact-less Thermal Analysis TM and Convection Detection at www.kicthermal.com/reflowheattransfer 

For more information about KIC and its revolutionary solutions, please visit www.kicthermal.com