NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Tampa Bay Expo & Tech Forum, scheduled to take place Monday, October 30, 2023 at the St. Petersburg Marriot Clearwater and SMTA Space Coast Expo & Tech Forum, scheduled for Wednesday, November 1, 2023 at the Melbourne Auditorium in Melbourne, FL. The KYZEN clean team will highlight both AQUANOX A4618 and the KYZEN Process Control System (PSC) during the event.

Concentrations of AQUANOX A4618, KYZEN’s latest game-changing cleaning solution, can be effectively monitored and controlled by the KYZEN Process Control System (PCS) to provide proven and cost- effective options in electronics cleaning processes. AQUANOX A4618 is a groundbreaking aqueous cleaning chemistry designed to address the challenges of cleaning contemporary lead-free flux residues, including no-clean residues, while achieving immaculate, mirrored solder finishes. A4618 boasts a long tank life and outstanding materials compatibility in addition to high efficacy at lower concentrations and temperatures.

The KYZEN Process Control System controls, monitors and automatically reacts to the dynamic changes in wash concentrations. KYZEN has continuously improved and advanced the capabilities of KYZEN PCS from its introduction more than 20 years ago and it remains the only complete concentration monitoring and control system available in the world. For more than 30 years, KYZEN has developed innovative chemistries that go hand-in-hand with your cleaning process. The KYZEN PCS and solutions such as AQUANOX A4618 combine to create an efficient and worry-free process.

For more information, visit www.kyzen.com 

IRVINE, CA – TopLine’s CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company’s exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.

For nearly 30 years, TopLine has been a developer and supplier of enabling technologies to international customers. These technologies have included (and still include) Bonding Wire for welding IC and Batteries, CCGA and BGA Solder Columns for military and aerospace, Daisy Chain Dummy components for testing PCB and assembly processes, JEDEC IC Chip Trays, Zero Ohm PCB Jumpers, PC Spacers, Flip Chips, Wafer Level Daisy Chain, and more.

In making the announcement, Martin Hart, CEO, stated, “We’re reaching out at the show to introduce our international customers to new products in the global market that we’re especially excited about; these include CCGA and our large BGA package solutions.”

TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.

Hart adds that “Currently, the largest Field Programmable Gate Array (FPGA) BGAs are 45mm x 45mm in size. But there is a movement trending to produce larger BGAs such as 50mm x 50mm and even 60mm x 60mm. But the ‘super-sized’ BGAs of 70x70mm to 100x100mm exhibit additional stress, resulting in warpage and other difficulties.” Hart adds that “Industry leading suppliers of semiconductor and infrastructure software products are beginning to produce ‘super giant’ BGA packages with multiple die inside that have accompanying stability issues. At TopLine, we maintain that these larger BGAs can benefit by using solder column technology instead of BGA solder balls. This is our solution to stress-related stability issues.”

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming SMTA Arizona Expo & Tech Forum taking place on November 14, 2023, at the Double Tree by Hilton in Mesa, Arizona. AIM will highlight their newest halogen-free no clean solder paste, H10.

H10 offers exceptional fine feature printing, improved electrochemical reliability, and powerful wetting in AIM's brand-new halogen-free no clean solder paste. H10 solder paste is capable of transfer efficiency >90% on area ratios of 0.50 and a stencil life >8 hours.

H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical reliability on all low stand-off devices. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.

To discover all of AIM’s products and services, visit the company at the SMTA Arizona Expo & Tech Forum taking place on November 14, or visit www.aimsolder.com 

TOKYO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will highlight its Total Inspection Line Solutions range of world-class SPI, AOI and X-ray inspection machines at Productronica 2023 in Munich, Germany from November 14-17 on booth #259 in hall A2. PCB assembly and semiconductor manufacturing customers are invited to experience unrivaled inspection accuracy and speed, as well as the comprehensive software and hardware interconnectivity solutions that are enabling today’s efficient cost-effective Smart Factories.

With live demonstrations of its innovative high-speed and high-accuracy SPI, AOI, and AXI machines, as well as bottom-side 2D AOI and X-ray inspection capability for back-end PCB assembly, booth visitors will experience first-hand Saki’s innovative range of quality assurance machines with superior M2M communication for streamlined product inspection. Latest soft- and hardware optimization features ensure even lower maintenance, operator efficiency and easy on-site upgrades for flexible and futureproof production planning.

With an emphasis on total inspection line solutions that offer reliability, speed, quality, and value for applications across key sectors including automotive, EMS, and industrial markets, the show line-up on booth #259 will feature:

Inspection Machines

The 3Di-LS2 and 3Di-LS3 are powerful 3D-AOI models equipped with 12μm and 15μm camera heads, perfect for today's SMT line manufacturing process requirements. They are designed to increase productivity, efficiency, and quality. Closed-loop technology, dual servo motor drive, high-resolution linear measurement, and sturdy gantry design ensure pinpoint precision and repeatability. Both AOI machines are equipped with Saki's innovative Z-axis control head and side camera feature to demonstrate the Saki Total Inspection Line Solution concept's versatility and flexibility. The latest award-winning 3D-AOI 3Di-LS3 machine provides high-speed, high-performance inspection. It offers increased height measurement and resolution with its updated camera system and accurately inspects extremely small and tall components. As well as achieving the industry's fastest cycle time, Saki’s latest AOI solution offers highest scalability, quality assurance, and productivity.

3Xi-M110 v3 - Saki's latest 3Xi-M110 v3 X-ray inspection solution features Saki's optimized Planar CT software, which was developed in-house for the industry's fastest cycle times. With highly accurate void measurement and detection for both PCBs and components, this 3D-AXI machine delivers excellent quality assurance.

3Si-LS2 - The 3Si-LS2 SPI machine with 12μm camera head is designed to support large PCB sizes up to 500 mm x 510 mm. With unified hardware and software, machine operators enjoy a seamless transition between platforms, resulting in a superior experience that reduces costs and increases overall satisfaction.

2Di-LU1 - Representing Saki's 2D AOI range, a 2Di-LU1 machine will be on show featuring bottom-side inspection for increased line productivity and Saki's distinctive line scan technology.

Smart Factory

Smart automation with Saki’s products improves quality assurance accuracy, lowers maintenance time, and improves operator performance. Productronica Visitors will be able to experience Saki’s latest Smart Factory innovations:

QD Analyzer v4 - The latest version of Saki’s software is key to a smart factory solution. Operators can intuitively monitor the machine status, record inspection results, and perform statistical analysis on data obtained from each machine within the production line. QD Analyzer plays a crucial role within the Saki inspection range, offering extensive reporting capabilities and providing real-time data.

Full Line Control Software Solutions

Saki's software suite & line control systems demonstrate the company's data-driven approach to continuous productivity improvement. Visitors to the Saki booth will experience the full IPC-CFX certified machine-to-machine connectivity capability, full line control enabled by Saki’s Offline Teaching station (BF2-Editor), Verification station (BF2-Monitor) and Multi Process View (MPV).

Further live demonstrations will highlight the power of Saki’s BFX Software for the 3Xi-M110 and 3Xi-M200 AXI machines by presenting the ability to greatly enhance product quality and production efficiency, improve process troubleshooting and determine root causes.

“Productronica visitors will see first-hand how our advanced AOI, SPI and X-ray inspection platforms help customers quickly identify the right solutions for their application and get to market ahead of the competition,” said Jaroslav Neuhauser, General Manager Saki Europe. “Particularly for our automotive and EMS customers in Europe and the Americas, flexibility is key for the future of inspection. Our latest range allows for rapid on-site equipment upgrade of components, such as the camera, ensuring inspection machines have improved uptime and state-of-the-art performance with minimal maintenance for superior customer value.”

For more information about Saki visit www.sakicorp.com/en/