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SANTA ROSA, CA – At productronica 2023, Keysight will demonstrate its portfolio of solutions designed to accelerate innovation in electronic manufacturing. Keysight enables innovators to push the boundaries of engineering by quickly solving design, emulation and test challenges to create the best electronic manufacturing experiences. Whether you’re looking to empower IIoT networks for Industry 4.0, e-mobility or autonomous driving, test RF components, or digital compliance, Keysight accelerates innovation with intelligent insights that reduce risk and speed time-to-market.

When: November 14-17, 2023

Where: Keysight stand A1-576 Messe, München, Germany

Media: Contact Jenny Gallacher to schedule media briefings and solution demonstrations.

Keysight will also be holding an in-person media breakfast at productronica on Tuesday November 14 at 9:00am CET. Interested journalists and industry analysts can contact Jenny Gallacher to reserve a spot.

Info: https://www.keysight.com/br/pt/events/europe-middleeast-africa-india/tradeshows/productronica.html 

Keysight experts will be on hand to demonstrate:

  • In-circuit test and printed circuit board handling
    • The Keysight i3070 Series 7i E9988GL inline, high-density in-circuit test (ICT) features the latest Quad-Density pin cards that can provide up to 5760 test nodes in a slim footprint. This enables manufacturers to economically meet increasing test demands for large printed circuit board assembly (PCBA).
    • The Medalist i3070 In-Circuit Test (ICT) Systems is a 19” rack-type handler for parallel in-circuit tests on printed circuit boards that are routed through the handler on transport belts. The handler’s multi-functionality lies in the fact that the modular MFT 19 provides single lane, dual lane, single segment, dual segment, single well, and dual well configurations, enabling an increase of up to four times in throughput compared to a standard single lane tester.
  • Combining In-circuit Test (ICT) and Functional Test (FCT)
    • Offering customers the flexibility to combine and streamline test coverage of both ICT and FCT, The Keysight i7090 Board Test system provides a more efficient balance between throughput and test coverage to help customers drive improvements in the cost-of-test.
  • Test Automation Software
    • Product life cycle management (PLM) ecosystems are the backbone of product development, with many interconnected systems that make comprehensive testing a challenge. Eggplant excels in adapting to diverse CAD / PLM environments, comprehensively automating rich and thin client testing with customizations, and enabling unrestricted testing of 3D moving images and PLM functionality evaluation. Keysight will also demonstrate the PathWave Test Automation suite which delivers significant cost- and time-saving benefits over traditional test automation and analysis tools.
  • Big Data Analytics
    • Combining test and measurement expertise with data science and big data engineering, the PathWave Manufacturing Analytics platform provides actionable insights for every level of your organization in the smart factory of the future. Improve yield, lower retest and handling, and reduce the cost of poor quality with big data advanced analytics.
  • Digital compliance and RF testing
    • Experience a new level of speed with the most advanced oscilloscopes — the new Infiniium UXR-B and MXR-B Series.
    • Learn how to cover multiple measurement parameters with a single connection, including noise figure, error vector magnitude (EVM), adjacent channel power ratio (ACPR), and standard S-parameters.
  • Multi-channel SMU
    • New at the Keysight booth this year is the latest source measurement unit (SMU) solution that addresses growing footprint challenges. Solve design, test, and validation challenges with the PZ2100 SMU solution.
  • IoT device testing
    • The Keysight NB-IoT and LTE-M signaling tester can help solve manufacturing test challenges.
  • Next generation bench solutions
    • Keysight’s bench solutions are designed to provide the broadest range of power and measurement solutions, from dependable TrueVolt digital multimeters and MegaZoom technology in InfiniiVision oscilloscopes and compact multi-channel power supplies to versatile data acquisition systems with digitizers and solid-state multiplexer modules. See trusted solutions, such as the 6.5-digit multimeter, or discover Keysight’s latest battery test, profiler, and emulation solution.

AUSTIN, TX – EMS Solutions, a leading PCBA contract manufacturer based in Northern Utah, is thrilled to share its success story of adopting Cetec ERP to drive operational transformation and support its ongoing growth. With a team committed to pushing the boundaries of what's possible, EMS Solutions has harnessed the power of Cetec ERP to enhance its processes, boost efficiency, and create a foundation for traceability and project costing.

Streamlining Operations with Cetec ERP

EMS Solutions operates as a printed circuit board assembly contract manufacturer, where precision and efficiency are paramount. To align their operations with the evolving industry standards, the company embarked on the path to maximize the potential of Cetec ERP.

The adoption of Cetec ERP has revolutionized various aspects of EMS Solutions' workflow, enabling them to manage Bill of Materials, drawings, quoting, engineering, procurement, inventory management, kitting, and much more seamlessly. The software allows them to monitor and manage each phase of production, ensuring a comprehensive view of their operations.

One of the key features of Cetec ERP that EMS Solutions appreciates most is the robust traceability it offers. Jody Mecham, Controller at EMS Solutions, stated, “With Cetec ERP, we can track and analyze who is doing what, when, and why. This level of traceability enhances our ability to make data-driven decisions, effect corrections, and optimize operations in real-time.”

Supporting Ongoing Growth

EMS Solutions is experiencing continuous growth, and Cetec ERP has proven to be a scalable solution that can keep up with their expansion. The company is confident that Cetec ERP will not only support their current needs but also cater to their future requirements as they move forward.

The dedicated team at Cetec ERP has played a pivotal role in ensuring the success of this transformation. Their commitment to EMS Solutions' success goes beyond mere vendor-client relationships; it is built on the foundations of partnership and collaboration.

EMS Solutions is excited about the potential and the future that Cetec ERP offers. This transformative journey has been a testament to the power of technology, collaboration, and a shared commitment to success.

To learn more about Cetec ERP and their advanced manufacturing software solutions, visit www.cetecerp.com 

CLINTON, NY – Indium Corporation® is proud to showcase its proven advanced assembly materials for PCBA and power electronics, including those for the rapidly evolving electric vehicle manufacturing and e-Mobility market, at Productronica, November 14-17, in Munich, Germany.

With its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature its Rel-ion™ suite of electrical, mechanical, and thermal solutions to reduce electric vehicle (EV) manufacturers’ time to market.

More than four million EVs are on the road with Indium Corporation’s reliable, scalable, and proven Rel-ion products. Rel-ion materials solutions deliver reliability by:

  • Eliminating non-wet opens and head-in-pillow defects
  • Preventing dendritic growth by meeting stricter surface insulation resistance requirements
  • Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
  • Reducing hot spots-induced voiding through improved thermal efficiency

Some of the Rel-ion products featured at productronica include:

  • Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.
  • Award-winning InFORMS® – reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
  • InTACK™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.
  • QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. The portfolio includes the InFORCE™ range of pressure sinter pastes and the InBAKE range of pressure-less sinter pastes. Applications include die attach and substrate attach in power electronics.
  • Award-winning Durafuse® LT – a novel solder paste mixed alloy system with highly versatile characteristics that enable it for energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
  • Durafuse® HR – based on a novel alloy technology, delivers enhanced thermal cycling performance (-40/125°C and -40/150°C) and superior voiding performance for high reliability automotive applications.
  • Indium8.9HF Solder Paste Series – an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.

To learn more about why over four million electric vehicles are on the road with Indium Corporation’s innovative materials, visit booth #A4.309 or indium.com/emobility 

HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce a strategic partnership with Altus Group Ltd., a renowned distributor with over two decades of experience in supplying premium electronics production equipment and services. As part of this collaboration, Altus Group will serve as the exclusive distributor for PVA's cutting-edge solutions in Ireland.

Altus Group has been a trusted supplier of electronics production equipment and services in the UK and Irish markets for nearly 23 years. Their extensive experience and industry knowledge make them a valuable resource for clients seeking the best solutions for their manufacturing needs.

One of Altus Group's strengths lies in their ability to consult with clients, offering expert guidance based on years of experience in the field. This personalized approach ensures that each client receives tailored recommendations and support to enhance their manufacturing processes.

Altus Group boasts a robust national network of engineers dedicated to providing ongoing assistance and support, making them an ideal partner for addressing day-to-day queries and ensuring the seamless operation of capital equipment. The partnership between PVA and Altus Group brings together two industry leaders, each known for their commitment to excellence and innovation. Together, they will provide Irish manufacturers with access to PVA's state-of-the-art fluid dispensing and conformal coating solutions, enhancing precision, efficiency, and quality in electronics production.

For more information about PVA and Altus Group, please visit www.pva.net and www.altusgroup.co.uk

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

CAMBRIDGE, UK – Ensuring that sensitive electronic components are not adversely affected by radiated electromagnetic interference (EMI) is an essential part of circuit design. Where compactness and close component proximity are a priority, such as in smartphones and smartwatches, conventional board-level shielding with metallic enclosures is increasingly being replaced with conformal package-level shielding. This approach utilizes conductive coatings applied directly to semiconductor packages and, together with emerging deposition methods such as spraying and printing, creates new opportunities for functional materials.

When selecting a material for conformal package EMI shielding, a variety of factors need to be considered. Most important is the attenuation of incident electromagnetic radiation, which is a function of electrical conductivity and magnetic permeability. Often parametrized as shielding effectiveness (SE), higher values enable a thinner coating to be used, reducing weight and material consumption. Other material considerations include adhesion to the underlying epoxy molding compound of the package, thermal conductivity, density, chemical stability, and compatibility with the deposition method if solution processing.

Sputtered metal

Sputtering metal is a well-established incumbent technology for conformal shielding, in which high-purity blocks of solid metal are ablated and deposited with a beam of charged ions. Many conformal shielding coatings use multiple metal layers, easily achieved by switching sputtering targets. Cap and/or adhesion layers are typically made from titanium, chromium, or stainless steel, with the primary shielding layer typically being cheaper metals such as copper, aluminum, or nickel.

While sputtering is well established, there is still scope for innovation. One proposed strategy, inspired by optical anti-reflective coatings, utilizes destructive interference from a multilayer stack to increase the shielding effectiveness. However, this improvement is highly frequency-dependent, given the fixed material spacing.

Conductive inks

Depositing conductive materials from solution provides an alternative to sputtering, with much-reduced equipment costs since the process occurs under ambient conditions rather than a vacuum. A range of solution processing methods, including spraying and inkjet printing, have been developed for EMI shielding, with all requiring conductive ink. Despite the high metal price, silver inks currently dominate due to their high conductivity and chemical stability.

Although the underlying metal is the same, there is extensive scope for differentiation amongst conductive ink suppliers. Particle shape and size are key factors, with nanoparticles generally offering higher conductivity but requiring higher curing temperatures than flake-based inks. Particle-free ink, also known as molecular ink, is a compelling emerging alternative. Rather than a suspension of metal particles, the ink is instead a solution of organometallic species that are reduced in situ, producing a smooth metal layer. A key advantage of particle-free conductive ink is eliminating the risk of nozzle clogging, a significant factor for digital printing methods such as aerosol and inkjet that enable selective deposition. Another benefit is that they produce very smooth coatings, which can improve shielding efficiencies at high frequencies.

MXenes

The ideal EMI shielding material would have high electrical conductivity, low density, flexibility to accommodate thermal expansion, tunable surface chemistry for adhesion, and solution processability. The emerging material class of MXenes, a family of two-dimensional inorganic materials composed of a few layers of transition metallic carbides, nitrides, or carbonitrides, fit this description. MXenes are thus the subject of both academic and commercial research for applications across electronics, including EMI shielding, with efforts currently being made to scale up production.

Comprehensive coverage

IDTechEx’s report “EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications” provides a detailed overview of the ‘EMI shielding for electronics’ market, with a more detailed assessment of the outlined materials classes along with nanocarbon-containing composites, metamaterials and combined thermal interface/EMI shielding materials. Innovations that will support the increasing adoption of heterogeneous integration and advanced semiconductor packaging, along with the activities of key players, are evaluated. 10-year forecasts for both deposition method and conductive ink consumption are provided, drawing on consumer electronic device analysis to assess the semiconductor package area requiring conformal shielding. Forecasts are segmented across multiple application categories, including smartphones, laptops, tablets, smartwatches, AR/VR devices, vehicles, and telecoms infrastructure. For more information on this report, please visit www.IDTechEx.com/EMI, or for the full portfolio of related research available from IDTechEx please visit www.IDTechEx.com/Research/AM.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming Productronica 2023 Trade Fair taking place November 14-17 at Trade Fair Center Messe München, Germany.

AIM will highlight many of its innovative products, including halogen-free no clean solder paste H10. H10 offers exceptional fine feature printing, improved electrochemical reliability, transfer efficiency >90% on area ratios of 0.50, and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 also reduces voiding on BGA, BTC, and LGA. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.

In addition, expect some surprises, including a new, soon-to-be-announced product designed for ultra fine pitch printing.

To discover all of AIM’s products and services, visit the company at the Productronica Trade Fair, booth A3.339 November 14-17, or visit www.aimsolder.com 

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