NEUSS, GERMANY – Yamaha Robotics SMT section will exhibit at Electronica for the first time in 2024, showcasing precision inspection solutions. The booth, 462 in hall A3, will feature 3D AOI (automatic optical inspection) enhanced with AI and special features that improve inspection of tiny SMD chips and difficult components such as LEDs and WLCSP semiconductors.

Visitors will be able to see Yamaha’s YRi-V 3D AOI system with AI assistance for laborious tasks, enabling a significant boost to productivity for users. This technology significantly accelerates library creation and tuning. The standard YRi- V system comes with a 12Mpixel camera and offers 12µm, 7µm, and 5µm resolution options, and can integrate directly in surface-mount lines configured for single-lane or dual-lane operation.

The new YRi-V TypeHS 3D AOI system, with its 25Mpixel camera, increases inspection speed by more than 50% to 30.5cm2 per second at 7µm resolution to greatly increase production throughput. In addition, the optional 3D laser helps measure components with opaque or highly reflective surfaces, such as LED lenses and WLCSP packages, which are notoriously difficult to inspect. Both the YRi-V and YRi-V TypeHS feature Yamaha’s high-accuracy LED measurement capability, which cuts the time to check the alignment of LEDs arrayed in groups, such as multiple emitters in a smart headlamp assembly.

Also on the booth, Yamaha will demonstrate the new VP-01G-Y inline solder-paste inspection system, which provides high-speed, high accuracy 2D paste-on-pad inspection after screen printing and before component placement.

“The high-performance inspection systems we are presenting at Electronica this year highlight the importance of advanced quality control to support the rapid pace of electrification,” said Shuichi Imai, Sales General Manager for Europe at Yamaha Robotics. “We are excited to showcase the innovations in our YRi-V TypeHS system that support the demands of different markets. Our demonstrations of machines and software will show how cutting-edge technologies like AI can make engineers’ lives easier and accelerate new product introduction.”

In special focus areas, Yamaha specialists will describe the software that powers these high-speed, high-accuracy, flexible inspection systems. These software tools feature intuitive graphical user interfaces that help quickly program the machines, with an easy-to-use dashboard that helps interpret the results and monitor production status. Visitors can also see the YSUP-LINK software in action, which connects all Yamaha surface-mount equipment on the factory floor with enterprise systems such as manufacturing execution and resource planning, enabling intelligent factories.

YSUP-LINK is a part of Yamaha’s complete production support system, YSUP, which comprises powerful tools for setting up, monitoring, and remotely controlling all Yamaha equipment in the production line. In addition to the inspection systems on display at Electronica this year, Yamaha has a portfolio of high-speed, highly automated screen printers, placement machines, and component storage systems. Together comprising the 1 STOP SMART SOLUTION, they are designed to connect and communicate seamlessly throughout production lines and across factories to maximise productivity, and deliver flexibility, space efficiency, and scalability.

Yamaha Robotics will present its advanced inspection systems during Electronica 2024 at Messe München, booth 462, hall A3, November 12—15, 2024.

SAN JOSE, CA – Test Research, Inc. (TRI) is joining the upcoming SMTA International Exposition & Conference on October 22 – 24, 2024, at the Donald E. Stephens Convention Center, Rosemont, IL, USA.

Visit TRI at booth No. 3019 to experience TRI's inspection solutions for the electronics manufacturing industry. The SMTAI 2024 lineup includes the multi-camera 3D AOI TR7500QE Plus, the enhanced 3D SPI TR7007Q SII, and an Automated 3D X-Ray Inspection solution demo. TRI's solutions are ideal for multiple industry applications, including automotive, consumer, advanced packaging, and telecom electronics manufacturing.

TRI's Smart Factory innovations optimize the current inspection through AI- powered algorithms, multiple 3D technologies, precise metrology measurements, real-time SPC trends, and M2M communications. TRI solutions support the current Smart Factory Standards, including the IPC- CFX, IPC-DPMX, and The Hermes Standard (IPC-HERMES-9852).

Discover why the largest EMS businesses chose TRI as their Test and Inspection Partner at booth No. 3019.

DAYTON, OH – Libra Industries, a privately-held systems integration and electronics manufacturing services (EMS) provider, is excited to announce the opening of its new manufacturing clean room at the Dayton facility. This state-of-the-art clean room is set to enhance their capabilities, reflecting their commitment to technological advancement and operational excellence.

The ribbon-cutting ceremony, which was held on August 15, was not just a celebration of Libra's expansion but also a testament to the resilience and innovative spirit of our team. "Many manufacturing and tier 1 & 2 manufacturing supply companies struggled during COVID, and Libra was no exception," remarked Julie Sullivan, Executive Vice President of Regional Development at the Dayton Development Coalition. "However, the unique opportunities in the semi-conductor/lithography industry allowed the talented local team here at Libra to immediately pivot, giving way to new R&D processes with streamlined procedures in this industry. We’re grateful they were willing to work with DDC and JobsOhio to explore these opportunities."

"The opening of our new manufacturing clean room in Dayton marks a significant milestone in our commitment to advancing semiconductor fabrication capabilities in the region,” commented Andrew Williams, CEO of Libra Industries. “This investment not only reflects our dedication to innovation and growth but also underscores our role in contributing to the local economy. By creating new jobs and bringing cutting-edge technology to Dayton, we are reinforcing our long- standing tradition of excellence while looking forward to a bright future in the semiconductor industry. We’re proud to continue our journey with the support of our incredible team and the Dayton community."

This new facility marks a significant milestone in Libra Industries' strategy to support growth fueled by the burgeoning demands of the semiconductor sector.

With an investment of $2.1 million and the creation of 31 new jobs, this project not only amplifies our manufacturing capacity but also solidifies our presence in Dayton's tech-driven landscape.

Libra Industries continues to invest to provide customized manufacturing solutions for its customers’ complex product requirements. Through its broad range of capabilities, Libra offers its customers the most capable manufacturing team in the industry. For more information about Libra Industries, visit www.libraindustries.com  

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

In addition, AIM Technical Sales Manager for Southeast Asia, Mhanny Aguillo will be giving a presentation titled High Reliability: The Challenges of Soldering for Extremely Harsh Environments:

High reliability in electronics pertains to the quality of solder joints themselves as well as the electrochemical properties of the flux residue.​ Key characteristics of reliable solder joints include strength and ductility. These joints are often tested via thermal cycling, drop shock and more. Exact testing requirements are dependent on application. When it comes to flux, industry standards such as IPC and JIS define the electrochemical requirements of flux residues, which is particularly important in no clean processes. This presentation outlines the trends and challenges of high reliability application sin automotive, military & aerospace, and LED sectors. Test data comparing specially formulated high reliability alloys with SAC305 are presented along with a discussion of how key elements of the alloys aid in improved reliability.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Penang Expo & Tech Forum September 25-26th, or visit www.aimsolder.com