Press Releases
PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is excited to announce that three of our Sales Channel Partners (SCPs), Bergen Group India (Booth #PE15), Kyoritsu Electric India Pvt. Ltd (Booth #PC11) and Blue Star Engineering & Electronics Ltd (Booth #PA11) will be showcasing ViTrox’s latest SMT PCB Assembly solutions at Hall 4, Bangalore International Exhibition Centre (BIEC), Bengaluru, India from 13th to 15th September 2023.
ViTrox will showcase its V510i 3D AOI solution at Bergen’s booth. This AOI solution is well-implemented with in-depth Artificial Intelligence (A.I.) Smart Technologies. Thanks to A.I. Smart Programming, our AOI is breaking free from reliance on humans, turbocharging programming speed, and ensuring unparalleled quality, precision, and consistency in inspections. Brace yourself for an astonishing up to 80% reduction in programming time, translating to soaring yields and lower operating costs. Our V510i 3D AOI has also successfully qualified for the IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification. Read more about our V510i 3D AOI Solution.
We will also be exhibiting our award-winning V9i ARV Solution that revolutionises flexible inspections for conformal coating and final assembly at Blue Star’s booth. Featuring a unique 6-axis COBOT design, it enables adjustable angle inspections up to 90°, guaranteeing convenience. With its Advanced Smart Learning Algorithm, V9i ARV detects various conformal coating defects and checks for screw, cosmetic, connector, and label defects in final assembly without requiring CAD information. Other than that, the solution provides better traceability in the back-end assembly process compared to human manual inspection. Read more about our V9i ARV Solution’s capabilities in conformal coating inspection and final assembly inspection.
Our technical and sales experts will also introduce our other solutions that cater to surface mount technology (SMT) printed circuit board assembly (PCBA) inspection, which are the V310i Advanced 3D Solder Paste Inspection (SPI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution and of course, our Industry 4.0 Manufacturing Intelligence Solutions - V-ONE. On top of this, they will also be sharing about our latest innovations that cater to the convergence between semiconductor packaging and SMT through advanced packaging and microelectronics inspections, which are the latest additions under our V310i SPI Solution and the V510i AOI Solutions.
Start your productivity-boosting journey with ViTrox's advanced solutions! Secure an appointment to meet our SCPs and experience live product demonstrations by clicking the registration link. If you want to know more about our solutions, feel free to reach out to us at enquiry@vitrox.com. Get ready to take your productivity to the next level!
MORRISVILLE, NC – The International Electronics Manufacturing Initiative (iNEMI) announces the availability of the Low Loss Dielectric Materials Characterization Roadmap, which is part of the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO).
MAESTRO, managed by iNEMI, is a joint industry/academia project sponsored by the NIST Office of Advance Manufacturing’s Advanced Manufacturing Technology (MfgTech) Roadmap Program. The MAESTRO team is developing a comprehensive 10-year hardware roadmap for mmWave materials development and electrical characterization and test, along with an implementation strategy to execute the vision of the roadmap and promote the growth of a strong U.S. workforce in radio frequency (RF) communication technologies. This first of two documents comprising the roadmap focuses on materials characterization of low loss dielectric materials. The second document will cover materials development and electrical test.
The Need for Low-loss Dielectric Materials Characterization and Traceable Standard Reference Materials
Several industry reports and roadmaps have identified development and characterization of materials for mmWave among the greatest technical challenges for 5G hardware implementations. Reliable, repeatable and fast low loss material characterization and testing are critical. Circuit designers need dielectric property data for materials at millimeter-wave (mmWave) frequencies to optimize device performance of new hardware and for quality assurance.
Furthermore, traceable standard reference materials are needed to accurately characterize materials. Manufacturers often must extrapolate low-frequency data to 5G mmWave frequencies when they accept new material from vendors. Such extrapolation can lead to disagreements between values specified by the vendor and values measured by manufacturers and can result in unpredictable performance of deployed hardware. A key root cause for these major discrepancies is the lack of traceable reference material for mmWave frequencies. This gap makes verification of measurement methods and laboratory techniques impossible in an industry setting.
Michael J. Hill, Principal Engineer at Intel, explains that 5G and beyond will utilize materials that are different from what the industry is using today, and development of new materials requires the ability to evaluate the performance of those materials at use condition. Semiconductor products, equipment suppliers, and material manufacturers have significant exposure if characterizations are incorrect, particularly for products that are manufactured in high volumes.
“Advanced low loss materials often come with significant cost adders,” says Hill. “If a new material is $2 per unit more expensive than an existing material, we must be able to accurately assess the performance benefit this $2 will provide. If metrology errors overestimate the benefit of this new material, we could incorrectly move to the new material and suffer a $40 million dollar error when this cost is applied to a product line shipping 20 million units.”
The MAESTRO roadmap looks at the needs, challenges, current technology capabilities and potential solutions for characterization of low loss dielectric materials. A summary of needs and challenges is shown in Table 1. Request a copy of the roadmap.
Characterization Needs and Challenges
| Technical Need | Challenge |
|
Higher frequencies for 5G result in requirements for lower dimensional variation and measurement errors |
Reliable, repeatable, fast low loss material characterization (dielectric constant, loss tangent) Lack of standard reference material (SRM) |
|
Dielectric characterization capability for anisotropic materials |
Limited techniques for extraction of anisotropic, wide band material characteristics |
|
Dielectric characterization capability for thin films |
Limited techniques for extraction of thin film, wide band material characteristics |
|
Dielectric characterization capability for assessing environmental impact on materials |
Limited compatibility with existing tool sets for characterizing across temperature and humidity (sample moisture absorption) |
CLEVELAND – Novagard, a woman-owned innovator and manufacturer of silicone sealants, coatings, lubricants, and foams announced that they received UL 746E certification on two of their conformal coatings.
A conformal coating is a layer of thin polymeric film that is applied to Printed Circuit Boards (PCBs) to protect circuits from moisture, dust, and other contaminants. PCBs are used in a broad spectrum of industries, including electronics, automotive & EV electronics, aerospace, renewable energy, LED lighting, medical devices, and telecommunications equipment.
“We’re extremely pleased that 800-505FC UV Alkoxy Dual Cure Sprayable Silicone and 500-210 General Purpose Conformal Coating passed the rigorous testing required to achieve UL 746E certification,” said Robert Duan, Ph.D., Novagard’s Vice President of R&D. “At Novagard, we are committed to delivering products that meet the highest standards our customers demand.”
UL 746E certification is obtained after the product passes a series of tests meant to evaluate whether a conformal coating can withstand sudden electrical surges and maintain its dielectric integrity. These are done in succession and include: voltage transient testing, dielectric withstand testing, and dielectric breakdown. There is also a vertical burn flammability test conducted as part of the UL 746E certification, and both coatings are rated V1.
800-505FC UV Alkoxy Dual Cure Sprayable Silicone cures in 3 – 5 seconds upon exposure to UV light. It has a secondary, neutral alkoxy moisture cure for shadow areas that begins immediately and develops full adhesion in hours.
500-210 General Purpose Conformal Coating is a clear moisture cured sprayable silicone that offers simple “dispense and forget” processing and tack free performance in as little as 10 minutes.
With the miniaturization and electrification of everything, silicones play a vital role in today’s manufacturing process. Novagard’s moisture cure and UV/dual cure silicones cure tack free in a fraction of the time needed for traditional conformal coatings. After the initial UV cure, the secondary cure ensures no unreacted coating remains in shadow areas.
Novagard electronics grade silicones offer superior performance in harsh and demanding environments. They combine increased flexibility and high temperature resistance, offering more versatility in the design and assembly process. Novagard silicones seal, bond, coat, gasket, and encapsulate to protect sensitive components and modules, enhancing and enabling their customers’ technological innovations. These high-performance materials contain NO added solvents (no isocyanates, benzene, toluene, ethylbenzene, or xylene), and are PFAS free.
Novagard will be demonstrating their UL 746E certified conformal coatings in booth 1845 at The Battery Show in Novi, MI (September 12 – 14).
AUBURN HILLS, MI – The Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, today announced their exciting partnership with Protektive Pak, a leading manufacturer of top-tier Electrostatic Discharge (ESD) Packaging Solutions. This collaboration is set to revolutionize the distribution side of the industry, enhancing the level of protection for electronic components while catering to the unique needs of customers.
Protektive Pak, with its rich history dating back to 1989, boasts an impressive array of ESD packaging solutions, including a distinctive impregnated, static dissipative corrugated material, conductive Plastek™ products, thermoforming, and ESD foams. The acquisition of the Protektive Pak line by Desco Industries, Inc. (DII) in 2002 further solidified its position as a frontrunner in the market.
“We are proud to say we distribute Protektive Pak,” said Mark Percival, Owner, VP, and Product Support Specialist of the Murray Percival Company. “Their dedication to providing high-quality ESD containers and material handling products aligns perfectly with our commitment to delivering excellence to our valued customers.”
Protektive Pak’s comprehensive range of stock static dissipative corrugated items stands as a testament to their continuous innovation and commitment to top-notch service. As a result, Protektive Pak has become the gold standard in the industry, consistently surpassing expectations and setting new benchmarks for competitors.
From custom ESD packaging to safeguarding products from Electrostatic Discharge (ESD), as well as physical and shock damage, Protektive Pak’s diverse lineup ensures that customers find precisely what they need to protect their valuable electronic components.
The Murray Percival Company, a recipient of numerous awards for its outstanding contributions to the electronics industry, acknowledges the ubiquitous presence of Protektive Pak’s offerings among their customers. Recognizing the multitude of options that Protektive Pak presents, The Murray Percival Company is thrilled to promote and distribute these innovative solutions, reaffirming their commitment to excellence in serving the electronics community.
To experience Protektive Pak’s cutting-edge ESD Packaging Solutions firsthand, visit www.murraypercival.com
SENAI, MALAYSIA – V.S. Industry Berhad Originating Summons for Inspection of Accounting Records Filed by VSIB and Datuk Beh Kim Ling Against Lim Chang Huat, Lim Chee Kon, Chow Chun Pooi@Chow Chan Leong and NEP Holdings (Malaysia) Berhad
1. Reference is made to the announcement dated 22 August 2022 made by the Company. The terms herein shall bear the same meaning a defined in the said announcement.
2. As announced by the Company, the High Court had on 10 June 2022 ordered NEP to:
2.1 open its Accounting Records (including its subsidiaries) for inspection by the Company and DB’s Auditor and/or by the Auditor’s colleagues within 8 working days from the date of being served with the inspection order and the said inspection shall be carried out on working days between 9:30am and 5:00pm and shall continue for the next 30 working days thereafter;
2.2 make available the Accounting Records for the Auditor and/or his colleagues to make copies and/or take extracts; and
2.3 supply to the Company and/or DB copies of the documents listed in Annexure B to the inspection order within the inspection period above.
["inspection Order"]
3. Pursuant to the Inspection Order, the Auditor’s colleagues commenced inspection of the Accounting Records of NEP and its subsidiaries in NEP’s premises on 1 July 2022 and the inspection ended on 12 August 2022.
4. However, the Company alleged that NEP has frustrated and/or stultified the Inspection Order by failing to comply with the terms of the Inspection Order as set out in paragraphs 2.1 – 2.3 above. LCH, LCK, CCP and Kong Kian Huat (“KKH”) as NEP’s officers have each failed to ensure that the Inspection Order is complied with by NEP.
5. The Company had therefore on 21 October 2022 filed for leave to initiate committal proceedings against NEP, LCH, LCK, CCP and KKH. Arising from the leave granted by the High Court on 13 December 2022, the Company commence committal proceedings on 27 December 2022 against NEP, LCH, LCK, CCP and KKH for breach and/or disobedience of the Inspection Order [“Committal Proceedings”].
6. On 19 June 2023, the High Court Judge heard the Committal Proceedings and reserved decision to be delivered on 17 August 2023.
7. The Company wishes to announce that the High Court Judge had on 17 August 2023 concluded that the charges of contempt brought by the Company have been proven beyond reasonable doubt and found NEP, LCH, LCK, CCP and KKH guilty of contempt of court as follows:
7.1 NEP has breached the Inspection Order by failing to comply with the terms of the Inspection Order as set out in paragraphs 2.1 – 2.3 above;
7.2 LCH, LCK, CCP and KKH as officers of NEP are guilty for contempt of court for failing to ensure the compliance of the Inspection Order by NEP;
7.3 The conduct of NEP, LCH, LCK, CCP and KKH has intrinsic tendency to interfere with the administration of justice.
[NEP, LCH, LCK, CCP and KKH are collectively known as “Contemnors”]
8. After finding that the Contemnors are guilty of contempt of court, the High Court Judge was supposed to proceed with hearing of mitigation factors and thereafter passing appropriate sentence against the Contemnors on 17 August 2023. This has been adjourned to 24 August 2023 arising from the Contemnors’ counsel’s application on the ground that LCH (who was present in Court) had to be sent to hospital due to breathing difficulties.
9. Any further development(s) of the above matters will be announced in due course.
SANTA CLARA, CA – Nokia today announced that it is the first telecom vendor to manufacture fiber broadband optical modules in the U.S. for use in the Broadband Equity, Access and Deployment (BEAD) program. Partnering with Fabrinet, a global manufacturer of highly precise optical products, Nokia will produce multi-rate optical modules at Fabrinet’s state-of-the-art facility in Santa Clara, California. Production will start in 2024 and brings additional high-tech jobs to the country. The announcement builds on Nokia’s previous decision to produce fiber-optic broadband network electronic products in Kenosha, Wisconsin.
Optical modules are a key high-tech component of fiber broadband networks. They convert electrical signals into light and vice versa, and are essential for connecting homes to high speed, multi-gigabit broadband. By manufacturing these optical modules in the U.S., Nokia continues to expand its list of products and solutions for networks rollouts using BEAD or other funding. States and infrastructure players seeking to participate in BEAD and the $42.45bn of available funding allocated for broadband rollouts to unserved and underserved communities are required to use equipment manufactured in the U.S.
Operators seeking to leverage BEAD funding to bridge the digital divide now have access to the latest cutting-edge technology for their deployments. Today, more than 70 percent of fiber broadband lines in North America are powered by Nokia. Using multi-rate optical modules and products allows operators to easily upgrade speeds from 1 Gig to Multi-Gig. Combined with Nokia’s award-winning 25G solutions and research into 100G technology, this ensures that operators are building fiber networks that will meet user requirements for generations to come.
Sandy Motley, President of Fixed Networks at Nokia, said: “Many in the industry have said that manufacturing optical modules in the U.S. was impossible. Today, we’re proving it can be done. Working alongside the Department of Commerce and Fabrinet, we’re excited to add optical modules to the list of technology solutions that will be produced here in the U.S. and become available to programs like BEAD which are so critical to bridging the digital divide.”
Harpal Gill, President and COO of Fabrinet, said: “Fabrinet specializes in manufacturing complex, precision optical and electro-optical products used in telecommunications networks and data centers. As a trusted partner of the world’s most demanding OEMs, we are excited to help bring the production of Nokia’s optical modules to the U.S. and support their efforts to bridge the digital divide. We’re pleased to partner with Nokia in order to help provide high-speed fiber broadband access to more people, homes and communities.”
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