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iNEMI Packaging Tech Topic Series Webinar
LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design
Guest Speaker: Kazunari Koga, Zuken Inc.
November 28, 2023

Chips and packages have different manufacturing methods and data sizes, so the design tools are also different. This webinar will introduce new software technology that can handle — in one tool —two types of design data. This technology connects design data for different technologies in a hierarchical structure and allows all data to be edited simultaneously. It also addresses the issues of designing a package that implements chiplets. This includes the challenges of large-scale design data (due to increasing nets between chips), device implementation of heterogeneous technologies with a mixture of substrate and silicon, and I/O design complexity.

About the Speaker
Kazunari Koga
Zuken Inc.

Mr. Koga has been working with development of an LSI/package/board (LPB) co-design environment since 2007. He joined the JEITA LPB working group in 2010, and participated in the development of LPB formats, which became an IEEE standard in 2015. He was also involved in the Semiconductor Technology Academic Research Center’s (STARC’s) development of a design methodology for 3D ICs, and the New Energy and Industrial Technology Development Organization’s (NEDO’s) development project for a 3D integrated design and verification platform.

Registration

This event is open to industry; advance registration is required (see link below). If you have any questions or need additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).

November 28, 2023
8:00-9:00 a.m. EST (US)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)
Register for this webinar

SAN JOSE, CA – Zero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Silicon Valley Expo and Tech Forum. It will be held at Building 3 on the FLEX campus located at 727 Gibralter Drive, Milpitas, CA. Expo time and date: 8:30 AM, Thursday December 7th.

Foremost among the PCBA test and inspection products to be shown will be Viscom's AOI, X-Ray and SPI inspection equipment. The Viscom display will include updates on the very latest enhancements for each of these products. Also, ZDI will have information on their flying-probe test services as well as their reverse engineering and failure analysis services. Additional ZDI partners, for which information will be available, include Europlacer [PCBA assembly equipment], Velan [PCB and PCBA engineering services], Tagarno [digital microscopes], Epoch International [PCBA functional test fixtures] and Pacific Trinetics Corporation [smart component storage and inventory control cabinets]. ZDI personnel will be in attendance along with Europlacer and Viscom sales management representatives.

MUNICH – The decision has been made. The winners of the productronica innovation award 2023 have been chosen just in time for the start of the world’s leading trade fair for electronics development and production. An independent panel has decided on the winners from among 70 submissions in the six categories.

Messe München is already presenting the productronica innovation award for the fifth time since its premiere in 2015. CEO Reinhard Pfeiffer is delighted with the high level of participation: “Almost 70 submissions are a clear sign that both the award and productronica as a trade fair are highly regarded in the industry. Numerous companies specifically adjust the publication of their new products to fit in with the submission period.”

Winner in the “Cables, Coils & Hybrids” Cluster: Frisimos Technologies
Tal Pechter, CEO Frisimos: “I feel honored to receive this innovation award for our fully automated cable and connector assembly lines.
This award is a testament to the hard work and dedication of our team, and confirmation of our vision for the future of the cable assembly industry.”

Winner in the “Future Markets” Cluster: ASYS Group
Drazenko Trkulja, Product Manager: “We are very proud to be launching another solution on the market that helps our customers have a full overview of the performance of the entire store floor at a glance, in a uniquely simple way.”

Winner in the “Inspection & Quality” Cluster: budatec
Dirk Buße, Managing Director: “We are delighted to receive this award and see it as confirmation of our work on innovative solutions for the soldering and sintering process. The budatec team, together with the Dresden University of Technology, and Krauss Hardware, developed a completely new test method for quality assurance in production and brought it to process maturity.”

Winner in the “PCB & EMS” Cluster: SUSS MicroTec Solutions
Robert Wanninger, Senior Vice President Advanced Backend Solutions: “It is a great honor for us to have won the productronica innovation award 2023 for our SUSS JETxSM 24. We thank the jury wholeheartedly for recognizing our commitment and passion for innovation.”

Winner in the “Semiconductors” Cluster: AP&S International
Tobias Bausch, CMO & CTO: “Winning the productronica innovation award for the second time in a row is not only recognition of our hard work, but also a commitment to continue pursuing excellence in all that we do. Moreover, it also acknowledges the outstanding team performance of our employees. With the new NexAStep wet bench, we have once again successfully taken a major step in the right direction, which this award confirms.”

Winner in the “SMT” Cluster: smartTec
Uwe Geisler, Managing Director: “This award is both confirmation that we have embarked on the right path, and motivation to continue to pursue it. I would like to thank the entire team for what has been achieved so far, and for the commitment they have shown.”

The individual submissions were assessed by an independent jury comprising the following members:

Dr. Sandra Engle, VDMA
Sebastian Glatz, ZVEI
Dr. Maik Hampicke, Fraunhofer IZM
Dr. Andrej Novikov, Rostock University
Prof. Lothar Pfitzner, University of Erlangen-Nuremberg
Helge Schimanski, Fraunhofer ISIT

The productronica innovation award is the first independent award in the electronics manufacturing sector and is organized in close cooperation with the trade journal productronic (publisher: Hüthig).

Click here for all the information about the winners and their products.

CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is thrilled to welcome James Doyle to the team as Chief Executive Officer of NEOTech’s Aerospace & Defense division, effective immediately.

In his new role, Mr. Doyle will take the helm of NEOTech’s Aerospace & Defense operations and business units, ultimately responsible for continued and aggressive growth of the division’s footprint in a rapidly evolving market segment. Mr. Doyle was appointed CEO of the Aerospace & Defense division following the exhaustive and extensive search process for a candidate with the combined experience of leading large-scale manufacturing, building successful business relationships, and demonstrable expertise facilitating top-quality products through the stringent requirements of aerospace and defense OEMs.

Kunal Sharma, President and Chief Operating Officer of NEOTech, commented on the appointment, stating, “James stands out above everyone as a versatile, experienced, and respected executive known throughout the electronics manufacturing industry and by aerospace and defense OEMs. We are thrilled to have him join our team. His strategic vision and track record of leadership for complex products ensures NEOTech’s future success for our Aerospace & Defense division.”

Mr. Doyle’s selection became evident following a comprehensive evaluation of his past successes. As a highly accomplished executive leader with exceptional critical thinking skills, Mr. Doyle has a proven track record of exceeding business objectives. Throughout his 25-year career, he has specialized in building high-performance sales organizations, managing process improvements and initiatives to drive manufacturing centers-of-excellence, and creating operational leadership teams for a multitude of high-technology industries. Most recently, Mr. Doyle worked as an advisor for Artemis Capital providing specialized counsel to industrial tech companies. Before that, as a Group Vice President and General manager at American Superconductor, he led a multi-site large scale manufacturing operation accomplishing over $100 million in revenue growth. For several years prior to this, Mr. Doyle held the position of President and CEO of East Coast Microwave.

Mr. Doyle commented on joining NEOTech, enthusiastically stating, “I couldn’t be more excited about the chance to join NEOTech as the CEO of the Aerospace & Defense division after years of competing against it and watching the organization grow to the well-respected industry leader it is today. I have dedicated my years of career growth to navigating complex business environments and making a meaningful impact as a leader to everyone in the organization. NEOTech’s cultural values align right alongside my own, so I am more than confident as a team we are heading towards unprecedented future growth. The aerospace and defense industries are always evolving towards the latest technological advancements, and NEOTech has the innovative people to lead the way for OEMs demanding product requirements.”

With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the Aerospace and Defense industry, Medical Products, and High-Tech Industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech services, visit the company’s website at www.NEOTech.com

REDDITCH, UK – Altus Group, a leading distributor of capital equipment in the UK and Ireland, is pleased to announce a significant addition to their team with the appointment of a new Applications Engineer. This strategic move underscores Altus's commitment to providing exceptional customer support in the UK.

Nick Hurrell has joined the Inspection Team and brings a wealth of experience and an understanding of electronics production and the industry landscape. His professional journey is marked by an impressive track record in the production environment, encompassing all aspects of electronics production, including Surface Mount Technology, Through-Hole Technology, and testing procedures. He has previously held roles that entailed machine selection, implementation, and process improvement, showcasing his proficiency in optimising production processes for maximum efficiency.

Nick has already built a strong relationship with Altus, working with the company on past projects. He is also well-versed in the diverse range of brands within the Altus portfolio, such as Koh Young, Kolb, YJ Link, and Heller. This knowledge positions him as an ideal addition to the team due to his comprehensive understanding of customer pain points, industry dynamics, and the unique pressures of those operating in the field.

Jiri Kucera, Altus Operations Director, said: "We have been very strategic and fortunate with our recent recruiting efforts, bringing on talented individuals who deliver immediate impact and share our vision for the future.

"Nick is precisely the high-calibre engineer we seek - someone with the experience, mind-set, and drive to provide complete solutions, not just support equipment. His in-depth knowledge of the full production environment will allow us to focus on the big picture and truly add value for our customers. I'm eager to see the contributions he'll make to our team."

Nick Hurrell added: "With years of experience collaborating with Altus from the customer perspective, I'm pleased to join the team to take on this exciting new challenge.

"It's clear Altus has an ambitious vision and a stellar reputation that keeps growing. The extensive portfolio of best-in-class products and processes is very impressive. I'm eager to leverage my knowledge of these solutions to further enhance the company's standing and continue elevating our support to customers."

As Application Engineer, Nick will work closely with Anthony Oh, Operations Manager - Inspection Products at Altus Group. His appointment significantly bolsters Altus's Inspection Team, which is paramount in ensuring comprehensive support for customers across the southern region of the UK.

SALEM, NH ― Emerald EMS, an innovative solutions provider, announces the successful acquisition of Ascentron, Inc., based near Medford, Oregon. This strategic move reinforces Emerald EMS' dedication to expanding its capabilities and geographic presence, enabling the company to better serve its customers and foster continued growth.

Ascentron has an extensive customer base within the Life Sciences and Aerospace sectors. With its FDA registration, Ascentron has established itself as a trusted and reliable partner in the highly regulated healthcare industry. This acquisition not only broadens Emerald EMS' customer base but also adds a wealth of expertise in the specialized fields of Life Sciences and Aerospace.

Emerald named Amanda Brewer to lead the newly acquired operation.

In a statement, Brewer expressed her enthusiasm for this new chapter, saying, "Ascentron has established a strong reputation and a highly regarded team in the Pacific Northwest. I am humbled and honored to be part of this esteemed group and to have this revered team join the Emerald family. Together, we anticipate exciting opportunities, and I am eager to uphold our tradition of delivering exceptional service and quality to our valued customers."

Ascentron CEO Hartmut Liebel emphasized, "This addition to the Emerald family of companies expands our geographical footprint through the addition of a facility in Southern Oregon, thereby reinforcing our commitment to serving our customers in the western United States."

This acquisition complements Emerald EMS's established network of engineering services and manufacturing facilities, including domestic locations in California, Michigan, and New Hampshire, as well as international facilities in Shenzhen, China, and Penang, Malaysia.