BOSTON, MA – As an established contract design and manufacturing partner for leading medical & life science, tech industrial, and aerospace & defense OEMs, Creation has developed the LEAP program to enhance New Product Realization.

LEAP, Launch with Excellence to Advanced Production, is Creation’s proprietary Stage Gate process that covers all aspects of the product lifecycle from engineering prototypes for new designs through to ramp to full production volumes.

The Stage Gate model is designed to improve the quality of product launch activities as well as burn down risk, refine costs and reduce variation at each stage gate. The process puts a heavy focus on planning, DFx and requirements gathering and helps teams prepare the right information, with the right level of detail, at the right time to deliver value to the customer.

“Creation Technologies is committed to exceeding our customer expectations throughout the Product Development & Lifecycle Process,” said Diana Ferrari, SVP of Customer Engineered Solutions. “We developed this program to give our partners the opportunity to lean on Creation with early engagement to provide excellent guidance and risk avoidance advice.”

Creation’s stage gate process was initially developed through a series of kaizen events with NPI thought leaders from each of our sites and all functions represented. It also included a thoughtful Voice of the Customer exercise. Many of our customers provided their insights into what would make Creation their trusted partner of choice for NPI.

The LEAP Stage Gate process was piloted and refined in 2021. Each of our sites were individually trained, including Program Management, Engineering, Quality and Supply Chain teams – a total of over 500 trainees!

Over 200 NPIs have been launched through LEAP and feedback from our customers has been clear – the results show products launching with a faster time to ramp and better quality. Here’s what our customers are saying:

"Creation identified what was needed to onboard us as a customer and followed up when we were holding things up. Creation was proactive in identifying risks and offering mitigation options….it allowed us to take on appropriate risks with our eyes wide open.”

“The team was heavily involved in cross-functional coordination in moving the business from one location to another. The communication was great.”

Across the enterprise, we have over 30 LEAP Bronze Certified Leaders ready to help launch your next new product. In 2024, all NPI, including new designs and existing design transfers, are running through the LEAP stage gate process.

Additional information about the LEAP Program or Creation’s Product Realization Capabilities, visit https://www.creationtech.com/solutions/prototyping-and-npi 

CLINTON, NY – Indium Corporation is proud to announce the addition of Sales Engineer Meik Fratzel to its European team.

Fratzel assists the Senior Sales Manager in promoting Indium Corporation’s soldering products—including solder paste, solder wire, technical soldering materials, and thermal management materials—in the DACH regions (Germany, Austria, and Switzerland). He also expands the regional sales force through business development and customer service, in collaboration with internal departments.

Fratzel brings a wealth of customer experience to his new role. Prior to joining Indium Corporation, he was an Area Sales Manager for a global system supplier to the electronics industry. He has also held client-facing roles in the automotive sector and in the high-voltage industry. Fratzel is a German state-certified mechanical engineer, specializing in automation technology. He also holds certifications in Lean Production Management and Quality Management.

MINNEAPOLIS – Nortech Systems, Inc., (Nasdaq: NSYS), a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products announced today Andrew LaFrence has been named CFO and Senior Vice President of Finance.

"We are delighted to welcome Andy to the Nortech Systems team," said Jay D. Miller, President and CEO of Nortech Systems. "Andy brings a wealth of experience and knowledge to the role, and I am confident he will be a great asset to our organization. Andy brings strategic expertise well beyond finance and accounting. The Nortech leadership team and board of directors are thrilled to have him on the Nortech team."

In his new role, LaFrence will be responsible for overseeing the company’s financial operations, including Nortech’s financial planning and accounting practices as well as its relationship with lending institutions, shareholders, the financial community and external auditors and tax advisors. LaFrence will work closely with Nortech’s senior leadership team and board of directors to direct the strategic focus, manage risk plus identify areas of opportunity and investment for the organization. LaFrence brings extensive strategic business planning experience and has provided executive leadership to the finance function with two public and several private companies.

In recent years, Nortech's strategic investments in the U.S., Mexico and China coupled with important measures to focus on growing EBITDA while developing research and innovation have diversified the company's capabilities and improved efficiencies to enhance profitability and support future growth. Nortech specializes in complex cable harnesses, printed circuit board assemblies (PCBAs) and box builds for low-volume, high-mix global manufacturing.

"I am excited to join Nortech Systems and help the company continue to grow and expand its capabilities," said LaFrence. "I look forward to working with the company’s exceptional team to ensure its financial success."

Nortech's 30-year history and rapidly growing expertise in digital connectivity and data management helps its customers stay competitive today and well into the future. With the addition of Mr. LaFrence to the team, Nortech Systems is well-positioned to continue its success and growth.

LYON, FRANCE – China’s semiconductor sector is on the rise as a global contender, propelled by progress in advanced node manufacturing. The Chinese industry occupies a strategic foothold in the memory market and is intensely active in the SiC race. This ecosystem is also developing core expertise in the advanced packaging field and has made substantial investments in cutting-edge manufacturing equipment.

Come and be part of Yole Group’s thrilling virtual event poised to ignite enthusiasm and curiosity within the semiconductor industry!

For one hour, the market research and strategy consulting company invites you to discover the status of the semiconductor industry in China, its underlying ecosystem, and related business opportunities.

This program welcomes six Yole Group experts to deliver their vision of the industry and highlight China’s market and technology assets:

“China is a key market for NAND and DRAM suppliers, as described in detail in Yole Group’s 2023 Status of the Memory Industry report,” explains Simone Bertolazzi, Principal Technology & Market Analyst, Memory at Yole Intelligence. “China strategically targeted this segment to reduce dependency on foreign suppliers. Key players, including Yangtze Memory Technologies Co. (YMTC), have invested significantly in technology development, positioning China as a potential major player in the global memory market.”

“China’s determination to dominate strategic semiconductor segments is evident in the SiC race,” asserts Poshun Chiu, Senior Technology & Market Analyst, Compound Semiconductor & Emerging Substrates at Yole Intelligence. “Chinese players are gaining market share, with plans for substantial capacity growth in the coming years. Companies like Cree and BYD are leading in developing SiC technologies, aiming to secure a significant share of the growing SiC market.”

“Advanced packaging has become a focal point, with companies like JCET emerging as key players,” explains Yik Yee Tan, Ph.D., Senior Market & Technology Analyst, Semiconductor Packaging & Assembly at Yole Intelligence. “By integrating advanced packaging capabilities, Chinese companies deliver innovative solutions for industries like 5G, AI , and IoT , strengthening China’s position in the global semiconductor supply chain.”

WEBINAR’S PROGRAM

• Power SiC
  The electrification of China’s automotive park is skyrocketing, with more than 20% of vehicles produced based on BEV platforms. Chinese players are gaining market share at the SiC wafer and epiwafer levels, and significant capacity is planned in the coming five years. For example, more than 40% of the total SiC wafer capacity in 2027 will be from China. Many regions in China are currently developing SiC businesses. More than US$1.5 billion in investments has been announced in SiC in China since 2022.
  Speaker: Poshun Chiu, Senior Technology & Market Analyst, Compound Semiconductor & Emerging Substrates at Yole Intelligence
• Computing
  The automotive ADAS/AD processor market is rapidly growing, with a CAGR of around 20%, and China is eager to be part of it. Tesla FSD HW4, Apple A17, HiSilicon 9000s: advanced computing chips are providing incredible performance with advanced nodes, and China intends to stay in the game. In a more than US$180 billion processor market, whether for consumer, automotive, or data center, China is investing heavily to reduce its dependence on foreign semiconductor technologies.
  Speakers: Ying-Wu Liu, Technology & Cost Analyst, Yole SystemPlus, and Adrien Sanchez, Senior, Technology & Market Analyst, Computing & Software
• Memory
  Combined stand-alone NAND and DRAM sales to China were worth around US$138 billion in 2022, corresponding to around 32% of all NAND and DRAM sales worldwide. Chinese players are developing and adopting hybrid bonding interconnection technology as an alternative to dimensional scaling. DRAM-Logic Integration: logic die and DRAM die bonded together through copper-to-copper hybrid bonding to increase chip bandwidth.
  Speaker: Simone Bertolazzi, Principal Technology & Market Analyst, Memory at Yole Intelligence.
• Semiconductor packaging
  The total revenue of the top ten Chinese OSATs grew 8% from 2021 to 2022, from US$11.4 billion to US$12.2 billion. Chinese OSATs are mainly focusing on mid-end Advanced Packaging platforms and targeting high-end technologies for the future. Significant investments by mainland China’s OSATs of more than US$4 million have been announced.
  Speaker: Yik Yee Tan, Ph.D., Senior Market & Technology Analyst, Semiconductor Packaging & Assembly at Yole Intelligence.
• Wafer Fab Equipment
  Substantial WFE revenue growth is expected in the areas where China invests: mature foundries, specialty and advanced packaging/OSATs. In terms of technology for >28 nm production, several WFE makers can already replace international equipment, but production capacities are limited.
  Speaker: Taguhi Yeghoyan, Senior Technology & Market Analyst, Semiconductor Equipment, Subsystems, and Testing

Register for the webinar here.