CLINTON, NY – As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs), that are driving AI advancements, at SEMICON Taiwan, September 4-6, in Taipei, Taiwan.

Indium Corporation’s SiPaste® series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporation’s Heat-Spring® solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporation’s reclaim and recycle program.

The GalliTHERM® portfolio of gallium-based liquid metal solutions draws on Indium Corporation’s more than 60 years of experience manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:

• High thermal conductivity for end-product longevity and reliability
• Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
• Extraordinary wetting ability on both metallic and non-metallic surfaces

To learn more about how Indium Corporation’s HIA and TIM products are helping to drive the AI revolution, visit our experts at booth #L0330 at SEMICON Taiwan.

MILWAUKIE, OR – ECD and its partner Maxim SMT Technologies today announced plans to showcase the latest soldering process control technology from stand H15.E15 at Productronica India 2024 to be held at the India Expo Mart ( IEML ), Greater Noida, India from September 11-23, 2024.

The electronics manufacturing sector in India has seen rapid growth in recent years as significant investment accelerates and numerous multinationals continue shifting production capacity to the region. Ensuring operators are adequately trained and production processes refined will be challenging given the pace of growth. As new sites scale up to meet demand, tools like ECD’s soldering control portfolio can play a key role in improving productivity, reducing operator training requirements, and ensuring high-quality yields.

ECD’s latest innovation, the M.O.L.E.® EV touchscreen thermal profiler platform, allows reflow soldering profile viewing on the production line. This capability saves time, simplifies profiling routines, and helps operators at all skill levels perform vital product profiling tasks with confidence and ease. Available in 6-, 12-, and 20-channel models, M.O.L.E. EV delivers handheld, lineside access to calculation templates, KPI tables, thermal profiles, and pass/fail results. Eliminating the requirement for offline PC viewing allows corrective actions to be managed immediately, improving productivity and ensuring timely quality outputs. The six-channel M.O.L.E. EV6 also integrates with ECD’s machine quality management pallets – OvenRIDER®, WaveRIDER®, and SelectiveRIDER® -- to verify soldering equipment performance. These technologies, along with ECD’s V-M.O.L.E. 2 four-channel thermal profiler, will be demonstrated at Maxim SMT stand H15.E15 during Productronica India 2024.

“India’s expanding electronics manufacturing sector is a promising and exciting development,” says Mark Waterman, ECD Electronics Division Manager. “The soldering process is where defects often surface, so ensuring tight process control and leveraging operator-friendly tools can dramatically improve quality and yield. We look forward to sharing the latest profiling technology with electronics manufacturers serving the Indian market.”

To learn more about ECD’s complete range of M.O.L.E., SmartDRY, continuous monitoring, and machine quality management technologies, visit www.ecd.com 

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce an upcoming webinar titled “Surface Reliability: Overcoming Challenges in SMT PCB Manufacturing and Determining Root Causes for Improved Performance.” The webinar will occur on September 5, 2024, at 2:00 PM EDT. It will provide attendees with the tools and insights needed to optimize their manufacturing processes, enhance product quality, and maintain a competitive edge in the market.

Dr. Denis Barbini, Technical Solutions Manager at ZESTRON, is a distinguished expert in the electronics manufacturing industry and will lead this informative session. As the electronics industry continues to evolve, ensuring the reliability and performance of SMT PCBs is paramount. Join Dr. Barbini as he investigates the critical factors affecting surface reliability in SMT manufacturing and gain valuable insights into overcoming these factors and optimizing processes to ensure optimal performance.

To register for this free webinar, please visit our registration page.

CLINTON, NY – Indium Corporation Senior Area Technical Manager Jason Chou will present on the timely topics of AI and EV technology at SEMICON Taiwan on September 5 in Taipei, Taiwan. Chou’s presentation will highlight cutting-edge, high-reliability, and low-temperature solder solutions for these rapidly evolving markets.

As AI and EV technologies demand higher performance, increased reliability, and more complex package and assembly requirements, Chou will examine a novel, mixed-alloy solder technology. This innovative solution leverages the combined strengths of each constituent solder powder in the paste. Specifically, variations of this mixed alloy technology have been optimized as a low-temperature drop shock solution and high-reliability alloy technology, uniquely suited for specific assembly challenges.

“We are confident that this new, award-winning mixed-alloy solder system provides timely and innovative solutions to many of the challenges posed by the emergence of EV and AI technologies,” said Chou. “I look forward to sharing more about this cutting-edge material with my industry colleagues at SEMICON Taiwan.”

As the Senior Area Technical Manager in Taiwan, Chou provides technical support to customers focusing on the semiconductor industry. He has 10 years of industry experience, specializing in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in chemistry from National Tsing Hua University and a bachelor’s degree in chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, in Tainan, Taiwan, where he collaborated with university professors and industry professionals on semiconductor manufacturing projects.