CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Utah Expo & Tech Forum taking place on September 19 at Salt Lake City Marriott University Park in Salt Lake City, Utah. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Utah Expo & Tech Forum on September 19th, or visit www.aimsolder.com 

EL DORADO HILLS, CA – As part of an effort to demonstrate Occam’s superiority over conventional assemblies, Eagle Circuits, Dallas TX, has been selected to build the first set of Occam test assemblies. These assemblies will be subjected to a battery of reliability and environmental tests in order to establish Occam’s viability and superiority over incumbent methodologies. This project is being funded by the DOD Executive Agent in cooperation with the Naval Surface Warfare Center, Crane.

“Occam component assemblies provide a giant leap forward for U.S. manufacturing,” said Ray Rasmussen, Occam managing partner. “Using existing equipment, fabricators and their EMS partners are able to construct Occam assemblies today. Once companies give Occam a spin, they will begin to see the possibilities.” Eagle CEO, Nilesh Naik added, “in going through this process we began to see, what Ray calls, the Occam Opportunity for Eagle and the industry. The possibilities are almost endless. Instead of driving the industry to more and more complex configurations, Occam simplifies the process, allowing us to do much more with a lot less.”

Occam’s solderless methodology lowers cost while greatly improving reliability. Occam addresses many of the stated concerns from DOD regarding the reliability of electronic assemblies as well as a world-leading path forward for the domestic industry. Occam is home- grown, U.S. based, highly reliable, with thermal management, EMI/ESD, security built in. Occam greatly reduces the need for UHDI giving the industry a pathway to achieve world leading performance without the complexity.

POOLE, UK – Europlacer, a leading provider of SMT assembly solutions, is pleased to announce the appointment of Realize SMT Canada Inc. as its new manufacturers' representative in Canada. Realize SMT Canada Inc., under the leadership of Dave McAtee, will be responsible for covering the regions of Ontario, Manitoba, Saskatchewan and Alberta.

Dave McAtee, the founder and principal of Realize SMT Canada Inc., brings a wealth of experience and expertise in the electronics manufacturing industry. His deep understanding of SMT processes and commitment to providing top-tier customer support aligns perfectly with Europlacer's values and mission.

"We are excited to welcome Dave McAtee and Realize SMT Canada Inc. to the Europlacer family," said Chris Merow, Director of Sales at Europlacer Americas. "Dave's reputation and his dedication to the SMT community make him the ideal representative to help us grow and strengthen our relationships with Canadian customers."

Realize SMT Canada Inc. is dedicated to providing exceptional service and support to the SMT and electronics manufacturing industries. With a focus on delivering innovative solutions and building lasting partnerships, Realize SMT Canada Inc. is well-positioned to represent Europlacer's advanced SMT placement systems and technologies.

For more information about Realize SMT Canda, contact Dave McAtee at dave@realizesmt.com or by phone at 647-463-1799.

For more information about Europlacer, visit www.europlacer.com 

CRANSTON, RI –AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming MicroLED Connect Conference and Exhibition taking place September 25-26 in the Conference Center at High Tech Campus Eindhoven in The Netherlands.

AIM’s Director of Product Management, Timothy O’Neill, will be giving a presentation titled Addressing Concerns of Ultra-Miniature Assembly for Mini/MicroLEDs:

The rapid implementation of Mini and MicroLED lighting technologies has promoted innovation in every aspect of the SMT assembly process. Printing, placement, and reflow are all impacted when these assemblies are performed. The main challenge posed by this type of assembly is simply the scale of the components. The dimensions involved are below the visual threshold for most human beings. One of the biggest challenges for assembly in this sector involves the printing of solder paste. Tens, if not hundreds of thousands of ultra-miniature deposits must be made with micron precision in a single stroke of a squeegee. Furthermore, his needs to be accomplished at production speed and scale without room for error. In this presentation, we share our knowledge and solutions acquired as one of the largest solder suppliers in the world to the Mini and MicroLED market.

Mr. O’Neill will give his presentation during MicroLED Connect on September 26th at 12:20pm.