DALLAS, TX – Justin Worden, the dynamic Global Sales and Marketing Director at Austin American Technology (AAT), is no stranger to creating a buzz in the electronics industry. Known for his engaging presence on social media platforms, Worden and AAT have gained recognition for their unconventional marketing strategies. This reputation was once again validated at the recent Surface Mount Technology Association (SMTA) - High Reliability Cleaning and Conformal Coating Conference in Dallas, TX.

The High Reliability Cleaning and Conformal Coating Conference, held biennially, features personal development and educational presentations by some of the electronics industry's foremost cleaning and conformal coating specialists. Worden joined the ranks of these experts as a presenter, accompanied by AAT President Todd Rountree and AAT Founder & CTO Steve Stach.

Worden's presentation diverged from the conventional format typically seen at such events. Instead of a solo presenter clicking through a PowerPoint, attendees experienced a unique and engaging session. The presentation began with a touch of humor, courtesy of technical difficulties with not one, but three malfunctioning microphones. Worden transitioned into an interactive style reminiscent of a late-night talk show host. The audience was treated to an energetic panel discussion, resembling a celebrity interview with Rountree and Stach.

Initial feedback from attendees was appreciation for hosting such an enthusiastic and memorable presentation. For many young engineers in the audience, the highlight of their week in Dallas, TX, was the opportunity to interact with Steve Stach, a pioneer in the industry. Others enjoyed the chance to reconnect with old friends.

As anticipated, Worden delivered a highly impactful experience during his inaugural SMTA presentation. His ability to engage and inspire left a lasting impression on all in attendance, further solidifying his reputation as a forward-thinking industry influencer.

HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce the appointment of Aaron Fensterer as the new Regional Sales Manager for the Mountain Territory.

Fensterer's journey at PVA has been marked by dedication and a commitment to excellence. He initially joined the company as a Systems Programmer, showcasing his technical prowess. His exceptional skills and dedication soon led to a promotion as a Manufacturing Project Manager. Fensterer's background in Computer Science, backed by his degree from the University at Albany, SUNY, brings a unique blend of technical expertise and production experience to his new role.

In this new capacity, Fensterer will be a valuable asset to PVA's customers in the Mountain Territory, delivering exceptional service and support. While he will initially be based at PVA Headquarters, he plans to relocate to the Mountain Territory to better serve his customers in person.

As part of this organizational change, PVA has recently restructured its sales territories to enhance customer support and engagement. The Western Territory now encompasses California, Nevada, Oregon, Washington, Alaska, Hawaii, and British Columbia, managed by Shashank Prakash. The newly created Mountain Territory lead by Mr. Fensterer encompasses Idaho, Montana, Wyoming, Utah, Colorado, Nebraska, North Dakota, South Dakota, Minnesota, and Alberta, Saskatchewan and Manitoba.

Fensterer's appointment reinforces PVA's commitment to providing outstanding service and expertise to its customers across the United States and Canada. PVA looks forward to the positive impact Aaron will undoubtedly bring to the Mountain Territory.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

WESTWOOD, MA – HumiSeal a leading conformal coating manufacturer and innovator, is pleased to confirm its recent collaboration with Bob Willis and SMTA Europe enabling the release of Bob’s extensive training resources as a donation to the SMTA. HumiSeal’s sponsorship agreement also includes contributions to two well known causes/charities.

The training resources that have been made available for free cover a wide spectrum topics including solder, inspection, cleaning and conformal coatings amongst other relevant technologies. Webinars, Training videos and other related material can be accessed via the SMTA website (https://smta.org/).

David Greenman, Director at HumiSeal Europe said, “Our sponsorship has allowed these training resources to be available free of charge on the SMTA web site and for contributions to two worthy causes, the Charles Hutchins Educational Grant and Prostate Cancer UK.”

This joint effort between SMTA and HumiSeal Europe Ltd aims to not only advance professional development within the industry but also contribute to the betterment of society. Bob Willis, Keith Bryant (Chairman of SMTA Europe) and David Greenman recently visited Prostate Cancer UK and meet with Jade Dyer (Community Fundraising Executive) of Prostate Cancer UK, for a tour of their London headquarters and a discussion how the Bob Willis/SMTA contribution will help the research and support provided by Prostate Cancer UK.

Following the visit Bob Willis commented “It was wonderful to hear how our contribution will help Prostate Cancer UK with their work, meet Jade and see the excellent facilities they have at the London HQ. Also have a chance for a photo shoot.”

For access to the training resources visit www.smta.org, more information on HumiSeal protection of electronics can be found at www.humiseal.com, or e mail europetechsupport@chasecorp.com on SMTA Europe go to https://smta.org/group/europe 

TAIPEI – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its enabling impact on some of the most demanding package designs used in the automotive, industrial, and high-performance computing sectors.

“As the SEMICON Taiwan show organizers have emphasized,” comments Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran Trichur, “the semiconductor industry is central to nearly all technology development and to solving some of the world’s biggest challenges. Henkel is a key contributor to this progress, delivering cutting-edge semiconductor packaging materials for high reliability automotive packaging, AI and high-performance computing, and evolving industrial applications.”

As a leader in die attach pastes and films and having engineered several groundbreaking advanced packaging formulations, Henkel’s objective at SEMICON Taiwan is to introduce invited guests to materials that are helping semiconductor technologists respond to microelectronics advancement, including:

Automotive Electrification, Responsiveness, and Reliability– From power ICs to microcontrollers to sensors, the devices that make modern vehicles more electrified, safe, and connected require materials with robust processing capability and exceptional in-field performance. Henkel high thermal die attach adhesive Loctite Ablestik 6395T and pressure-less sintering material Loctite Ablestik 8068TI deliver the highest standard automotive grade 0 reliability and are compatible with various leadframe finishes, including Cu.

In addition, Henkel’s pioneering work in conductive die attach film materials is embodied in two of its top products, Loctite Ablestik CDF 200P and Loctite Ablestik CDF 600P. Both formulations offer the inherent benefits of conductive die attach film – tight bondline control, consistent fillet formation, no die tilt, and no resin bleed – and are distinguished by their different thermal and electrical conductivities, as well as die size compatibility. Henkel’s conductive die attach film materials are widely used for automotive microcontroller unit packages such as QFPs and TSSOPs.

High-Performance Computing and Mobile Processing Solutions– Next-generation processors are integrating the most advanced Si node flip chips, and protecting them against thermomechanical stress is vital to their reliability. Last year, Henkel introduced a breakthrough capillary underfill, Loctite Eccobond UF 9000AG, that balances high filler loading and fast flow capability. This combination helps packaging specialists meet volume production while ensuring excellent protection of chip interconnects. Lid and stiffener attach materials, also part of the Henkel portfolio, further protect high-value 2.5D and 3D packages by securing lids and peripheral stiffeners to reduce warpage, maintain coplanarity, and in some cases, may provide grounding and shielding capability.

“The converging demands of miniaturization, high performance, functionality, and extremely high reliability make semiconductor device innovation more complex than ever. We are helping our customers meet the challenges head-on with materials that allow them to confidently push the reliability envelope.” comments Ramachandran Trichur.

To learn more about Henkel’s semiconductor packaging materials, the company’s global R&D capabilities, and its application engineering expertise, visit this resource.