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FARNBOROUGH, UK – Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, announced its participation at productronica India, the International Trade Fair for Electronics Development and Production, taking place from Sept. 13-15, 2023, at the Bangalore International Exhibition Centre (BIEC) in Bengaluru, India on booth number PE 51 in Hall 4.

At the event, Gen3 will showcase its groundbreaking CM+ Series, representing the latest advancements in the testing and inspection industry.

Visitors can experience the 6 Sigma verified CM+ Series, the world's first combined ROSE (Resistivity of Solvent Extract) and Process Ionic Contamination Tester (PICT). A recipient of global awards, this industry-leading system measures ionic contamination in accordance with all existing test methods, including ROSE and PICT. Available in five different models and tank sizes, the CM+ Series offers versatility for various circuit assembly testing needs. Gen3 will be providing an inside tutorial on ionic contamination, offering attendees a unique opportunity to understand the CM+ Series’ capabilities. They will be able to see Gen3’s CM+ Series in action, showcasing how the system can operate for you and PCB boards.

Andrew Naisbitt, CEO of Gen3 who will attend the upcoming show, commented, “Productronica India 2023 is shaping up to be an exciting and pivotal event that holds the potential to reshape electronics manufacturing in India. There is an extensive lineup of seminars, workshops, and keynote speeches. I, for one, am looking forward to meeting Prime PCI’s customers, our Distributor for the Indian market, and catching up with fellow colleagues in the industry.”

Gen3’s commitment to providing comprehensive testing solutions is evident through its newly launched Objective Evidence website. This platform details the requirements from the latest J STD 001 Rev H, which can be efficiently met through the combination of AutoSIR and PICT testing. The AutoSIR performs the initial qualification, while the PICT test demonstrates ongoing conformity to the primary setup using the SIR technique.

Visitors are encouraged to visit Gen3's stand to explore the AutoSIR2+™ and CM+ Series demonstrations and gain insights into the revolutionary testing technologies.

NASHVILLE – KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Long Island Expo and Tech Forum, scheduled to take place Wednesday, September 13, 2023 at the Marriott Melville Long Island in Melville, New York. The KYZEN clean team will focus on both AQUANOX A4626 and the KYZEN Process Control System (PSC) during the event.

Concentrations of AQUANOX A4626 can be effectively monitored and controlled by the KYZEN Process Control System (PCS), providing proven and cost-effective options in electronics cleaning processes.

AQUANOX A4626 is a next generation aqueous cleaning agent that quickly and effectively removes the latest polymeric no-clean flux residues while also providing excellent results on traditional lead-free and eutectic tin-lead residues. A4626 is easy-to-use and control, adding to its capabilities in cleaning a wide range of boards, components and metallic surfaces during a long tank life.

The KYZEN Process Control System controls, monitors and automatically reacts to the dynamic changes in wash concentrations. KYZEN has continuously improved and advanced the capabilities of KYZEN PCS from its introduction more than 20 years ago and it remains the only complete concentration monitoring and control system available in the world. The KYZEN team will also have information available regarding chemistries ideal for understencil cleaning needs in electronic assembly. KYZEN’s understencil cleaning solutions improve overall cleaning efficacy while also proving cost-effective.

For more information, visit www.kyzen.com

TOKYO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at Productronica India 2023 at the BIEC in Bengaluru. From 13 to 15 September, visitors to booth #PF11 in Hall 4 will discover Saki’s state-of-the-art total inspection line solutions machine range and latest hard- and software innovations that demonstrate its Full SMT Line, Smart Factory and M2M capabilities.

Saki will offer booth visitors a first-hand look at the unique features of the latest hardware and software releases with an emphasis on total inspection line solutions that offer reliability, speed, quality, and value for applications across key sectors including automotive, EMS, and industrial markets.

The show line-up on booth #PF11 will feature:

3D-AOI

Underlining the versatility and flexibility of the Saki Total Inspection Line Solution concept, a 3D-AOI machine model 3Di-LS2, equipped with the innovative Z-axis control head feature, will show the industry’s highest level of inspection capability with a height-measurement range in 3D mode up to 40mm. The focus height in 2D is also increased to 40mm. With these capabilities, Saki’s 3Di-AOI Series fulfills inspection capabilities and flexibility far beyond standard SMT inspection processes with accuracy, speed, and ease.

Full Line Control Software Solutions

Saki's software suite & line control systems demonstrate the company's data-driven approach to continuous productivity improvement. Visitors to the Saki booth will experience the full IPC-CFX certified machine-to-machine connectivity capability, full line control enabled by Saki’s Offline Teaching station (BF2-Editor) and Verification station (BF2-Monitor).

Further Highlights 

Alongside some 2D machine examples, for the first time at the India show the Saki booth will feature a direct real-time link to inspection machines located in the Saki Thailand Solutions Center which will further enhance the booth visitor experience. Live demonstrations will highlight the power of Saki’s BFX Software on a 3Xi-M110 AXI machine. The QD Analyzer and Multi Process View (MPV) demo station will also connect to the Thailand Solutions Center to present the ability to greatly enhance product quality and production efficiency, improve process troubleshooting and determine root causes.

“Saki takes pride in not only having an expansive distributor network spread across the Indian subcontinent, but also in excelling in offering direct technical service support. This support is strategically dispensed from dedicated centers located in the major cities of Bengaluru, Chennai, and New Delhi. This dual approach ensures seamless delivery and immediate, expert assistance, reinforcing the robustness of our customer service framework for our Indian customers,” said Jayson Moy, General Manager Saki Asia Pacific.

For more information about Saki visit www.sakicorp.com/en/

TOKYO – TANAKA Kikinzoku Kogyo K.K. (Head office: Chiyoda-ku, Tokyo; Group CEO: Koichiro Tanaka), which develops industrial precious metals products as one of the core companies of TANAKA Precious Metals, announced today that it is promoting business strategies in each country with the aim of establishing a "Global Recycling Network" to promote the widespread recycling of precious metals.

TANAKA will encourage the recycling of precious metals in each country at its main recovering and refining bases: Ichikawa Plant and Shonan Plant for Japan and Southeast Asia, Hukou Plant for Taiwan, Marin Plant for Europe, and North Attleborough Plant for North America.

As part of this expansion, Chengdu Guangming Paite Precious Metal Co., Ltd., TANAKA affiliate company in China, will establish a new company, Ya'an Guangming Paite Precious Metal Co., Ltd., in Sichuan Province, China, which will begin full-scale operations in the summer of 2024 or later. This new company will manufacture precious metal compounds for various catalysts and plating and will also recover and refine precious metals from production scrap and used catalysts by introducing TANAKA's precious metal recycling technology.

Of the approximately 5 billion yen invested in the establishment of Ya'an Guangming Paite Precious Metal, TANAKA Kikinzoku Kogyo will invest 40%.

Background of Precious Metal Recycling Business Development in China

Unlike in other countries and regions, the precious metals business in China should ideally be completely integrated with the recovery and refining of precious metals and the manufacture of industrial precious metals products. Until now, the cooperation between TANAKA Kikinzoku Kogyo and Chengdu Guangming Paite Precious Metal has allowed for limited integration, but some recoverable precious metals are still not being recovered. This new company will introduce the recycling process that TANAKA has cultivated over many years in the precious metal business in Japan to establish a system capable of recovering precious metals that have not been recovered up to now. Through the new company, TANAKA will establish a one-stop precious metal recycling scheme that can be completely integrated within China, further developing its precious metal recycling business.

TANAKA will contribute to sustainability by effectively utilizing limited precious metal resources in various businesses. TANAKA also believes that precious metal recycling will help reduce the use of mined precious metals in industrial products, thereby helping to reduce environmental impact.

LOUISVILLE, KY – LogicMark, Inc. (NASDAQ: LGMK) (the “Company”), creator of innovative personal safety and security technology for the care economy, today announced an agreement with All Quality and Services, Inc. (AQS) to engineer and manufacture new hardware devices, the first product of which is scheduled to launch next year.

“Having an additional contract manufacturer based in the U.S. helps us diversify our risk and minimize supply chain disruptions, ensuring our customers have the products they need. Our customers are also requesting products that are ‘Made in USA’. With existing tariffs on imported products, manufacturing in the USA is now more competitive, which allows us to increase the number of cost effective customer solutions. We look forward to partnering with AQS to help us introduce new products into the marketplace, which will supplement life saving products already in our pipeline expected for launch in 2023 and 2024,” said LogicMark CEO, Chia-Lin Simmons.

“For more than three decades, we’ve provided our customers with a one-stop solution for all their needs in high-quality electronics manufacturing and engineering services so that they can thrive in any dynamic competitive environment,” said Bruce Lee, Vice President of Operations with AQS. “We’re looking forward to working with LogicMark to deliver the most innovative personal safety and security technology to the aging population, in a timely manner.”

Today’s aging population deserves fast and reliable access to the most innovative personal safety and security technology available. AQS – which is ISO 13485 certified – is one of the most highly respected and experienced full-service contract manufacturers in the electronics manufacturing sector. The LogicMark partnership with AQS is expected to provide added flexibility to the Company’s product manufacturing operations as well as capacity to fulfill the needs of a growing care economy.

For more information about LogicMark’s devices and accessories, visit logicmark.com

FARNBOROUGH, UK – Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimization equipment, is excited to announce its participation at the 24th European Microelectronics & Packaging Conference (EMPC) taking place Sept. 11-14, 2023 at the Wellcome Genome Campus, Hinxton, near Cambridge, UK.

At the conference, Sascha Lohse, from Finetech, Gen3's principal will be presenting a paper titled 'Fine Pitch Micro Indium Bump Interconnect Flip Chip Bonding.' The presentation will delve into the challenges faced in producing large format, high-density IR thermal imaging FPA devices, Quantum processors, and micro LED displays using fine pitch micro Indium bump array interconnections that meet the rigorous industry requirements of today.

Lohse is an esteemed expert in microsystems technology, having graduated in the field in 2006 from the University of Applied Science in Berlin. He has acquired extensive experience in both frontend and backend processes while working at the Hahn Schickard Gesellschaft and the Fraunhofer IZM. Presently, Sascha leads the product management, application, and technical documentation teams, and he serves on Finetech's executive board. His profound knowledge of multiple bonding technologies has allowed him to tackle various packaging challenges throughout his career.

The EMPC conference provides an ideal platform for Gen3 to showcase its advanced microelectronics solutions to a diverse audience of industry professionals, researchers, and decision-makers. Gen3's cutting-edge technology addresses the industry's evolving needs, enabling customers to achieve exceptional results in their microelectronics projects.

Gen3 looks forward to engaging with conference attendees, networking with industry peers, and demonstrating its commitment to advancing microelectronics technologies.

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