HAVERHILL, MA – Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires component tinning services for tin whisker mitigation, gold mitigation, and lead re-conditioning. The equipment is also used for automated, touch-less BGA component de-balling, required as part of converting BGA's with lead-free solder to tin-lead solder.
These state-of-the-art machines are high-volume, high-mix systems featuring auto load/unload, multi-component vacuum pickup heads, and dynamic solder waves. All process parameters are controlled, including immersion depths, dwell times, insertion and extraction speed, acceleration, solder pump speed, and temperatures, ensuring that the tinning process complies with stringent industry standards including GEIA-STD-006, J-STD-001, and IEC-TS-62647-4.
"For over 40 years, leading defense and aerospace companies have relied on Circuit Technology Center as the world leader in circuit board level modification, rework, and damage repair services," said Andy Price, Sales Manager. "We are thrilled to announce our increased capacity, offering our defense and high-reliability customers electronic component tinning and alteration services with the same exceptional quality and service that they have come to expect from our company."
OULU, FINLAND – Scanfil, a leading provider of advanced electronics manufacturing services, is proud to announce the approval of its near-term science-based targets by the Science Based Targets initiative (SBTi). This significant achievement underscores Scanfil’s commitment to sustainability and climate action.
The SBTi has validated that Scanfil’s greenhouse gas (GHG) emissions reduction targets align with the latest climate science and are consistent with the goals of the Paris Agreement. Specifically, Scanfil commits to:
“These ambitious targets reflect Scanfil’s dedication to driving meaningful change and contributing to a sustainable future. By setting and achieving these goals, Scanfil not only demonstrates leadership in environmental stewardship but also inspires other organizations to take bold steps towards reducing their carbon footprint”, says CEO Christophe Sut.
SBTi’s Target Validation Report highlights Scanfil’s comprehensive approach to GHG emissions management. In 2020, Scanfil reported a total of 16,901 tCO2e for scope 1 and 2 emissions. By 2022, the company reported 955,102 tCO2e across scopes 1, 2, and 3, with a significant portion (65.22%) attributed to purchased goods and services. The report confirms that Scanfil’s targets meet the SBTi’s stringent criteria and are aligned with a 1.5°C trajectory.
“We are thrilled to receive this validation,” says Mats Lindblad Director of Quality and Sustainability at Scanfil. “SBTi’s approval is a testament to our team’s hard work and our commitment to making a positive impact on the environment. We believe that by taking decisive action today, we can help create a better tomorrow for future generations.”
Scanfil’s sustainability journey is a continuous one, and the company remains dedicated to exploring innovative solutions and partnerships that will further enhance its environmental performance.
MANASSAS, VA – ZESTRON, the global leader in high-precision cleaning products, services, and training solutions for the electronics manufacturing industry, is excited to announce its participation in the upcoming SMTA International (SMTAI) (SMTAI) 2024. The event will occur from October 20-24, 2024, at the Donald E. Stephens Convention Center in Rosemont, IL, USA. ZESTRON will exhibit at booth #2920.
At SMTAI, ZESTRON will spotlight its state-of-the-art Manassas Technical Center, which houses a comprehensive range of cutting-edge cleaning equipment. This facility is designed to support the most demanding cleaning challenges in electronics manufacturing, offering advanced cleaning solutions tailored to ensure high reliability in electronic assemblies. Visitors to ZESTRON’s booth will have the opportunity to take a virtual tour of the Manassas Technical Center, gaining an inside look at the sophisticated equipment and technologies available to customers for testing and process optimization. This virtual experience will showcase the latest innovations in cleaning technology, including equipment for precision cleaning, environmental testing, and more, all designed to improve cleaning efficiency and product quality.
In addition to its exhibit, ZESTRON’s Senior Application Engineer, Ravi Parthasarathy, will present a technical paper titled “Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components.” This presentation, conducted in collaboration with Patrick Lawrence from ITW EAE and Evan Griffith from Indium Corporation, will take place on Wednesday, October 23, 2024, from 2:00 PM to 3:30 PM CDT in Room 48. The session will explore the latest strategies and innovations for optimizing cleaning processes in advanced packaging applications, highlighting the challenges and solutions associated with low standoff components.
Join ZESTRON at booth #2920 to learn how their products and services can enhance your cleaning processes and improve product reliability. For more information about ZESTRON’s participation at SMTA International 2024 or to schedule a meeting with their team, please visit https://pages.zestron.com/2024-smtai
AUSTIN, TX – Cetec ERP is proud to announce its partnership with Apex Instruments, a global leader in source emission testing, to modernize and streamline their operational systems. With a strong global footprint in over 85 countries and 36 years of industry expertise, Apex Instruments provides state-of-the- art equipment for testing smokestack emissions and ambient air quality. Apex sought a comprehensive ERP system to manage their complex inventory, customer service and reporting needs, and found the perfect solution with Cetec ERP.
As Apex Instruments grew and diversified its operations, the company faced significant challenges with its legacy ERP systems, leading to inefficiencies and data management problems. “We were more capable, more empowered, and had a better business literally two weeks after implementing Cetec than we did after five years of using our previous system,” said Miles Wright, CEO of Apex Instruments. Wright noted how Cetec ERP transformed the company’s inventory management, reporting capabilities, and ease of use, reducing the number of clicks and time it took to manage daily operations.
Apex Instruments selected Cetec ERP due to its user-friendly interface, browser-based functionality and customer-driven customization. The speed and flexibility of Cetec ERP enabled Apex to quickly solve problems, track inventory down to the penny, and generate accurate reports in real-time. “The switch to Cetec ERP was like waking up after double knee surgery and realizing the pain is gone – we wished we had done it years ago,” Wright remarked.
With Cetec ERP, Apex Instruments now has a reliable system that supports its entire operation, from quoting to inventory tracking to customer interaction. The ERP’s ability to provide real-time access to data has empowered Apex employees at every level, improving their overall productivity and enabling them to deliver better service to their global customers.
To learn more about Cetec ERP and their advanced manufacturing software solutions, visit www.cetecerp.com
Munich – In a significant step towards accelerating readiness for the Tata Electronics semiconductor assembly and test facilities in Vemagal, Karnataka and Jagiroad, Assam, Tata Electronics (a wholly-owned subsidiary of Tata Sons Pvt. Ltd.) signed a Memorandum of Understanding (MOU) with ASMPT to collaborate on establishing semiconductor assembly equipment infrastructure and solutions.
Through this partnership, ASMPT, the leading global supplier of hardware and software solutions for the manufacturing of semiconductors and electronics and Tata Electronics will collaborate with Tata Electronics for workforce training, advancing service engineering infrastructure, automation, spare supports and boosting R&D initiatives in the area of wire bond, flip chip, advanced packaging and integrated system packaging. This partnership shall also focus on energy and material efficiency to promote sustainable growth and strengthen the semiconductor supply chain ecosystem.
Dr. Randhir Thakur, Managing Director & CEO, Tata Electronics, said, "We have a bold vision to establish India as a leading electronics manufacturing hub by offering integrated solutions across the electronics manufacturing value chain to global customers seeking a resilient supply chain. This partnership will emphasize the development of essential training programs and advanced research and development, while also nurturing a vibrant ecosystem within the country.”
Robin Ng, Group CEO, ASMPT added, "We are excited to partner with Tata Electronics to realize their vision of establishing a global electronics supply chain in India. By leveraging our collective expertise and resources, we are well-positioned to drive significant progress in the semiconductor industry. This collaboration will not only propel technological innovation but also cultivate the talent required for sustained future growth."
Recently, India Prime Minister Narendra Modi laid the foundation stones for two Tata Electronics facilities, including a state-of-the-art semiconductor fab in Dholera, Gujarat, and a Semiconductor Assembly and Test (OSAT) Facility in Jagiroad, Assam.
ASMPT’s continuous investment in R&D will help to provide the cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.
OULU, FINLAND – Scanfil adjusts the composition of the management team to accelerate the growth journey and ensure decisions are made close to customers and businesses. The new management team is built around four regions: APAC, Central Europe, Northern Europe, and the Americas. Due to the change and to improve transparency, Scanfil will have four reporting segments as of 1 January 2025.
“New regional Vice Presidents are responsible for their region’s financial targets and operational performance. On top of P&L responsibility, regionality brings us valuable local expertise in M&A and new customer acquisition processes”, says CEO Christophe Sut and continues “This is a growth platform for the company on which we can build larger regional operations. I want to congratulate all the new Management Team members and wish them success in their new positions.”
“I would also like to express my warmest thanks to Timo Sonninen, who has decided to leave the company, after 11 years at Scanfil and wish him a happy retirement”, says CEO Christophe Sut.
Timo Sonninen leaves his COO position in the Management Team on 30 November 2024 and acts as a transformation advisor to the CEO throughout December 2024.
Management Team effective as of 1 January 2025:
Christophe Sut, Chief Executive Officer, will continue in his current role.
Kai Valo, Chief Financial Officer, will continue in his current role.
Anette Mullis, Chief People Officer, announced 28 June 2024
Christina Wiklund, Chief Commercial Officer, will continue in her current role
Riku Hynninen, Chief Technology Officer, responsible for supply chain, sustainability and technology.
Steve Creutz, Vice President of Northern Europe
Christian Kesten, Vice President of APAC
Markku Kosunen, Vice President of Central Europe
Christophe Sut, acting Vice President of Americas
Comparison figures for new reporting segments will be disclosed during the first quarter of 2025 in a separate stock exchange release.