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INGLESIDE, IL – IDENTCO – a manufacturer of high-performance labeling solutions for the power equipment, electronics, transportation, and general industrial sector – will present the challenges associated with cleaning- and heat-related PCB label adhesion and legibility issues during the SMTA High Reliability Cleaning & Conformal Coating Conference (CCCC), which takes place in Dallas from August 29-31. Shahela Ali, Director of Global Marketing for IDENTCO, will present PCB Labels & Cleaning Agents: Critical Compatibility on August 30 at 3pm.

Despite frequently being overlooked, the ways in which labels and labeling components interact in cleaning and coating environments is crucial. In electronics manufacturing, the relationship between these two distinct disciplines is both symbiotic and fundamental. Printed circuit boards must be clean – and must also be clearly marked and reliably traceable.

Ms. Ali’s presentation will explore this mission-critical topic, including an overview of labeling materials best suited to withstand powerful cleaning agents and harsh SMT environments. It also will discuss the need for conformal coaters and cleaning agent providers to work more synergistically with labeling experts to collectively serve electronics customers.

IDENTCO was selected to present largely due to its prowess in this niche. At Booth #4, the company will showcase one of its latest series of labels for PCB applications, featuring a substrate developed exclusively for IDENTCO by a prominent industry materials and coating supplier. Called TT413, the labels easily withstand prolonged, repeated exposure to the chemicals and high temperatures typical to post-production washing processes. Helpfully, the series is designed for on-demand thermal transfer printing of variable information – a plus for electronics companies incorporating serialization and/or anti-counterfeiting coding into their production practices.

During her presentation, Ms. Ali will elaborate on the broad range of factors that commonly impact PCB labeling durability.

“PCB labels can experience any number of critical failures due to cleaning agents or high temperatures, from fading and flaking to smearing and even complete detachment or disappearance,” said Ms. Ali. “I look forward to discussing solutions to these pitfalls, including the importance of real-world scenario testing and equipping PCB labels with materials-science based endurance and protection.”

SANTA CLARA, CA – Promex today said it has promoted VP of Engineering David Fromm to chief operating officer.

The Santa Clara, California-based subsystems supplier hired Fromm in March. Promex said Fromm will also remain VP of engineering and lead the operations, engineering, and business development teams.

“Dave has walked in the shoes of OEM engineers, project leads, and procurement decision-makers. He is uniquely qualified to bring a customer-focused perspective to every aspect of the Promex business,” Promex CEO Richard Otte said in a news release. “He understands how to partner for turnkey, vertically integrated approaches to creating the smallest, most complex medical devices that are enabled with microelectronics.”

Before joining Promex, Fromm worked with the company as a customer for nearly 10 years. He was previously director of instrument research at Cepheid, where he led hardware and technology R&D for next-generation platforms. He collaborated with Promex on the development and construction of subassemblies for a point-of-care molecular diagnostics device.

“I needed a partner capable of iterating and building out the vision, from a blank piece of paper through design maturity, for very complex projects,” Fromm said in the news release. “My leadership at Promex is shaped by what appealed to me as a customer – the company’s capabilities, flexibility, and problem-solving skills. Promex can take early, abstract requirements and scale them into successful production and commercialization.”

Fromm holds a PhD in physical chemistry from Stanford University and a B.A. in biochemistry from the University of Colorado-Boulder. He also has patents for molecular diagnostics systems and high-speed atomic force microscopy.

Fromm will oversee technical developments for high-quality, scalable assembly and manufacturing of complex medical devices that incorporate microelectronics, Promex said. Promex offers microelectronic component assembly, process design and packaging for medtech and biotechnology firms.

SANTA CLARA, CA – Absolute EMS, Inc., an award-winning EMS provider of turnkey contract manufacturing services, reaffirms its dedication to continuous improvement by investing in the training of its touchup, quality control, and final quality assurance operators to J-STD-001 Class 3 standards. The comprehensive onsite training, conducted over a span of five days, demonstrates Absolute EMS’ ongoing commitment to delivering exceptional contract manufacturing services.

J-STD-001, developed by the IPC (Association Connecting Electronics Industries), is a widely recognized industry standard for soldering and assembly of electronic components. The training equips operators with the knowledge and skills required to perform soldering and assembly processes to the highest quality standards, ensuring reliable and consistent results across manufacturing operations.

The training agenda encompassed a comprehensive range of topics, including proper soldering techniques, understanding various solder alloys, component identification, inspection criteria, and quality assurance practices. The rigorous curriculum was meticulously designed to empower operators with the proficiency to meet the stringent requirements of J-STD-001 and deliver products that surpass industry expectations.

“We are delighted to announce the successful completion of J-STD-001 training for our touchup, QC, and final QA operators,” stated Ray Amirkiai, Quality Manager at Absolute EMS. “This achievement reflects our unwavering dedication to providing our customers with products of the highest quality and reliability.”

The training was facilitated by Circuit Technology Inc., a renowned provider of electronics assembly training solutions. The collaboration with such a respected industry partner ensures that Absolute EMS’ operators receive the latest knowledge and insights in electronics manufacturing practices.

Certified to ISO13485:2016, AS9100 Rev D, ISO 9001:2015 and J-STD-001 Class 3 standards, including the Space Addendum, Absolute EMS sets the bar high in terms of precision and reliability. With the additional distinction of being UL Registered and operating under NAICS code 334418, Absolute EMS establishes itself as a trusted partner across diverse sectors. Absolute EMS continues to set new standards in electronics manufacturing by embracing opportunities for improvement and nurturing a skilled and knowledgeable workforce. This commitment enables the company to provide clients with high-quality, reliable, and innovative solutions that meet and exceed industry expectations.

Absolute EMS is a leader in end-to-end electronic manufacturing services solutions that help its customers rapidly introduce innovative new technology by facilitating speed-to-market in their marketplace. Based in Silicon Valley, the company provides world-class Printed Circuit Board Assembly (PCBA).

For more information about Absolute EMS and its comprehensive electronics manufacturing services, please visit www.absolute-ems.com

TOKYO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces the opening of its new Mexican office in Zapopan, Jalisco. Perfectly situated in the manufacturing hub of the Guadalajara Metropolitan Area, the new office is the home for Saki’s subsidiary, Saki America de México S.A. de C.V. With direct links for customers across the North and South American continents, Saki’s modern facility offers an important location for service, sales, and demonstrating of its world-class range of electronics manufacturing inspection machines. The opening ceremony was held on August 8, 2023.

With its new Mexican subsidiary and dedicated facility, Saki improves further on its impressive global sales and distribution network. For customers across Mexico, as well as those in the US, Canada, and South America, the new center provides a location for demonstrations and further understanding of Saki’s Total Inspection Line Solution - a range of top-quality inspection machines with integrated software and hardware that offers unparalleled efficiency for smart factories.

Saki’s portfolio of quality assurance equipment includes 3D solder printing automatic inspection (3D-SPI), 2D automatic visual inspection (2D-AOI), the latest next-generation 3D-AOI, and cutting-edge 3D-AXI machinery for superior x-ray inspection of PCBs and components. Saki hardware and software is developed in tandem for seamless M2M integration with both sister equipment and third-party production line machines.

With an office in the Guadalajara Metropolitan Area, Saki has carefully selected a location to provide local service to one of the greatest electronic manufacturing regions in the Americas. Both established customers in the area and those who are considering Saki’s equipment for the first time will benefit from local support and the ability to discuss Saki’s range with experienced specialist engineers and sales advisors. Plans for the office include demonstrations and technical training with some of the most knowledgeable Saki engineers in the world.

Customers can visit Saki’s new office in Zapopan to better understand how to solve their manufacturing quality assurance issues and develop future-looking smart factories with lower maintenance overheads, reducing staffing costs and superior product delivery.

“Opening an office in the key region of Guadalajara shows how Saki both values and provides for its international customers,” said Norihiro Koike, President and CEO of Saki Corporation. “Saki products represent the pinnacle of electronics quality assurance, and we are excited to serve the Americas from this important central location.”

Ricardo Fuentes, Sales Manager at Saki’s regional distribution partner PAC Mexico S.A. de C.V. added: “We are delighted to have strong backing from Saki with its new office in Mexico, in order to boost sales of Saki equipment in the Mexico region and strengthen technical support for our customers.”

The new address for the Saki America de México S.A. de C.V. office is:
Av Vallarta 6503-F67, Col. Ciudad Granja
Zapopan, Jalisco
México CP 45010
Phone: +52 3338576488

For more information about Saki visit www.sakicorp.com/en/

CAMBRIDGE, UK – With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of interconnected dies on a package, the system's performance relies heavily on the signaling that happens within the package. Two key metrics, bandwidth and power efficiency, play a pivotal role in determining the success of these advanced semiconductor packaging solutions. In this article, we will focus on the materials requirement for achieving higher bandwidth, one of the essential factors for improved communication between dies.

Bandwidth is a critical performance metric in advanced semiconductor packaging. It refers to the amount of data that can be transmitted or communicated between the dies on the package. Higher bandwidth allows faster and more efficient communication, enabling devices to process data at incredible speeds. Two primary factors are considered to measure bandwidth: IO/mm and Datarate/IO. IO/mm represents the density of I/O connections available on the die edge, while Datarate/IO refers to the data transfer rate of each I/O terminal measured in bps. By multiplying IO/mm by Datarate/IO, we calculate the bandwidth per millimeter of the die edge, which represents the total data that can be transmitted between dies. In simpler terms, bandwidth density indicates the number of bits transmitted and received between dies per mm (for 2D) or per mm2 (for 3D packaging).

The performance of IO/mm and Datarate/IO heavily relies on the redistribution layer (RDL) within the package. Essential features of the RDL, such as Line/Space (L/S), via, and pad dimensions, play a crucial role in achieving optimal performance and data transmission within the package. The dielectric constant of materials used in the redistribution layer (RDL) directly impacts the datarate/IO. Currently, the finest L/S of RDL can be attained using inorganic dielectrics like SiO2, but the material's relatively high dielectric constant (Dk=3.9) makes it unsuitable for high-speed communication. Additionally, the process is also challenging and costly. As a result, researchers are actively exploring alternative dielectric materials, particularly organic options, which offer the advantages of lower dielectric constants and reduced costs. When selecting organic dielectric materials, several key parameters must be considered to ensure their suitability for the packaging process. IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report identifies five key parameters crucial for organic dielectrics used in advanced semiconductor packaging.

Dk (Dielectric Constant) and Df (Loss Tangent):
A material's dielectric constant (Dk) determines its ability to support higher data rates without compromising signal integrity. Materials with low Dk are preferred for advanced semiconductor packaging as they reduce wire capacitance and allow for shorter interconnects between dies. Low-loss characteristics also minimize transmission loss in high-frequency communication devices, further enhancing bandwidth.

Elongation to Failure:
For multi-layer RDL (Redistribution Layer) with a higher copper coverage on each layer, a higher elongation to failure is favorable. This property ensures the material can withstand the stresses and strains associated with the packaging process and device operation without mechanical failure.

CTE (Coefficient of Thermal Expansion):
To ensure package reliability, the dielectric material should have a CTE similar to that of the copper metal layer. However, achieving this is challenging due to the inability to use filler particles that increase the dielectric permittivity of the polymer. SiO2 fillers, commonly used in polymer dielectrics, do not aid in reducing the Dk value as they need to be loaded in high volume. Additionally, the presence of fillers hinders the scaling of microvias, which are essential for advanced packaging technologies.

Young's Modulus:
For a reliable microvia design with a diameter of less than 5 µm, utilizing a polymer material with a low Young's modulus is crucial. A low modulus helps minimize the stress exerted on the copper, leading to enhanced overall package reliability.

Moisture Absorption:
Moisture absorption of the polymer material is crucial for long-term system reliability. High moisture absorption can lead to delamination and negatively impact both mechanical and electrical performance.

In conclusion, as technology continues to advance, the demand for even higher bandwidth and power efficiency in advanced semiconductor packaging will persist. Organic dielectrics have garnered significant interest due to their potential in offering low dielectric constant (Dk) characteristics, enhanced defect tolerance, and cost-effectiveness. However, it is crucial to acknowledge that selecting the appropriate material always involves trade-offs. For instance, while low dielectric constant polymers offer advantages, they may come with a higher coefficient of thermal expansion (CTE), which can adversely affect device reliability and packaging architectures. Therefore, it becomes imperative to carefully consider and adhere to the five key features and their requirements to ensure the successful development of advanced semiconductor packaging solutions.

IDTechEx's "Materials and Processing for Advanced Semiconductor Packaging 2024-2034" report offers a structured approach to understanding advanced semiconductor packaging. The report is divided into four main parts. The first part provides a comprehensive introduction to technologies, development trends, key applications, and the ecosystem of advanced semiconductor packaging. The second part focuses on 2.5D packaging processes, including dielectric materials, RDL fabrication techniques, and material selection for EMC and MUF. The third part delves into the innovative Cu-Cu hybrid bonding technology for 3D die stacking, offering insights into the manufacturing process and material selection. The report also includes a 10-year market forecast for the Organic Dielectric Advanced Semiconductor Packaging Module, providing valuable perspectives on market growth and trends for the coming decade.

To find out more about this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/MatsforASP

SINGAPORE – Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company") announced its collaboration with TSMT (Taiwan Surface Mounting Technology Corp), a worldwide leading LCD SMT (Surface Mount Technology) solutions provider, to advance mini LED backlight and direct emissive displays for high-volume adoption.

Mini LED technology in displays is anticipated to increase rapidly over the coming years, providing new opportunities for Kulicke & Soffa's advanced display portfolio. TrendForce, a world leading market intelligence provider, anticipates mini LED wafer shipments will increase at a CAGR of 38%, to over 8M four-inch equivalent wafers, through 2027. During this period, LED die size is expected to be reduced significantly in both backlighting and direct emissive applications, accelerating the transition from more typical semiconductor die-attach approaches, to dedicated advanced display approaches. The Company's dedicated advanced display solutions – PIXALUX™ and LUMINEX™ – support demanding market requirements with new-levels of throughput and high-accuracy placement capabilities. Leveraging these innovative dedicated solutions as well as the collective process knowledge of both K&S and TSMT, this collaboration seeks to overcome today's process challenges to accelerate the mass adoption of advanced display technology.

PIXALUX™ quickly became the largest installed base of ultra-fast dedicated mini LED placement equipment shortly after its 2018 introduction. Today, LUMINEX™ extends K&S leadership by providing a dedicated laser-based mini and micro LED transfer solution that enhances flexibility, yield and productivity for panel and display manufacturers. LUMINEX is designed to transfer small die with high accuracy and throughput.

"We are excited to enhance our long-term relationship with K&S to deliver high-volume manufacturing solutions for mini LED backlighting and direct emissive displays. Through joint efforts, LUMINEX™ has achieved an impressive production throughput of 540K units per hour (UPH) at 15µm 3-sigma accuracy, broadening the market reach for this technology. We are currently working on improving the yield from 99.99% to 99.999%," said John Wu, TSMT's President.

"Our comprehensive advanced display portfolio directly serves the technology needs of major display markets rapidly transitioning to advanced display technology. Key markets transitioning include high-volume televisions, IT displays, as well as both large and small format direct-emissive displays. Today, LUMINEX™ is the most compelling high-volume manufacturing solution for mini-LED transfer and we are extending its capability to micro LED," said Chan Pin Chong, Kulicke and Soffa's Executive Vice President, Products and Solutions.

The throughput of LUMINEX™ is scalable through its various modes of operations – Precision Correction Mode (PCM), Multi-pattern Placement (MPP) and SCAN Mode. In the scan mode, it is capable of throughput of over 30M UPH. While LUMINEX™ is preparing to move into high-volume adoption for mini-LED applications, initial micro LED development results are encouraging and the Company has achieved 4µm 3-sigma accuracy for direct die placement of 40µm x 80µm die. This solution is also suitable for Micro LED in Package (MIP) applications.

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