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Press Releases

CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.

Tuesday, June 11

Moving to Pb-Free for Power Discrete Die-Attach by Product Manager – Semiconductor Dean Payne
- Pb-based solder has been the standard material for power discrete die-attach for decades. This session will focus on the various Pb-free alternatives, their pros and cons, and the challenges faced when switching from Pb-based solder to Pb-free solder.

Wednesday, June 12

Solder Material Optimization that Enables Reliable Power Module Heat Dissipation by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch
- As power densities continue to increase for power module devices, there is a corresponding need for improved thermal management. This presentation will explore thermal interface and soldering material technologies that can be leveraged for improved thermal performance and extended lifecycle reliability in these applications.
- The presentation will be given in German.
Power Electronics Materials and Process Optimization by Product Manager – ESM/Power Electronics Joe Hertline
- This presentation will explore the design criteria for materials selection in SiC molded package-attached applications, balancing cost, performance, and manufacturability. An emerging solder alloy technology will be highlighted, which can mitigate package warpage and delamination in the package and enable soldering as a thermal interface material in these applications.
- Solder Preform Technology for Improved Thermomechanical Performance in Molded Power Module Package-Attach poster session by Hertline This SAC-In alloy technology reduces peak temperatures, removing the risk of delamination with molded package power modules. This Bi-free alloy provides favorable mechanical properties to achieve reliability performance comparable to SnSb5 for thermal shock testing -40°C/125°C.

All presentations will be given in English unless otherwise noted.

Andreas has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his innovative LED automotive lighting patent as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.

Joe is responsible for driving the power electronics product line’s growth by developing and implementing marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

Dean is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit our experts at PCIM in hall 6, stand #466.

BOCA RATON, FL – Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is pleased to announce its participation at the upcoming SMTconnect exhibition, scheduled to take place June 11-13, 2024 in Nuremberg, Germany.

In booth 4A.225, hosted by SmartRep, Inovaxe will unveil its newest advancements in inventory management, highlighting the state-of-the-art SREX Racks. These cutting-edge racks redefine efficiency in inventory management with an impressive storage capacity of up to 880 7" reels or 480 13" reels. Equipped with intelligent sensors, integrated lighting for part identification, and lightning-fast retrieval and return times, SREX racks streamline kitting processes, reducing time from hours to mere seconds. Seamlessly integrating with ERP, MES, MRP and Pick-and-Place software, these racks provide real-time inventory visibility and are available in various sizes and widths. ESD- compliant and equipped for Wi-Fi and internet connectivity, Inovaxe's SREX racks offer a typical ROI realized in just 3 to 6 months, making them an indispensable investment for manufacturers.

In addition to the SREX Racks, Inovaxe will display the IA Series Smart cart, designed to store up to 1,120 reels in less than 4.75 square feet of space. With a sleek and modern design, this series offers both full-size and half-size carts for increased mobility and flexibility. Featuring doors to secure reels and optional electronic locks for added security, these carts are equipped with ESD-conductive casters and can be made fully mobile with the addition of a battery.

Furthermore, Inovaxe will showcase its revolutionary InoBar, designed to retrofit shelves and pallet racks, converting existing storage locations into intelligent storage solutions. Compatible with Inovaxe’s InoAuto software, InoBar offers a wide range of use cases, from dispensing bulk components to storing and locating boxes, pallets, and more.

Finally, the LineSide Cart LS700 series is designed to further optimize SMT material handling processes. With four rows of 7" reel storage, the LS700 model offers a maximum capacity of 320 7" reels, all within a compact footprint of less than 2.5 square feet. For enhanced capacity, the LS700-1 model adds an extra half row of reel storage, accommodating up to 368 7" reels. Equipped with an integrated display and standard InoAuto software, these carts boast features tailored for lineside usage, along with a built-in 1D/2D barcode scanner. Whether used as standalone storage or integrated into an InoAuto system, LS700 racks offer seamless interfacing with pick-and-place machines and MES systems, automating production operations. With the option for mobility through battery integration, these carts ensure flexibility in material handling, promising streamlined processes and improved efficiency on the production floor.

Visit Inovaxe at the SmartRep booth 4A.225 during SMTconnect 2024 to experience the company’s inventory management solutions.

To learn more about Inovaxe and their advanced material handling solutions, visit their website at www.inovaxe.com

HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is excited to announce its participation in the upcoming SMTconnect exhibition, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. PVA will be exhibiting in the SmartRep booth 4A.225, where Pieter Van Der Vorst, the company’s Europe Sales Manager, will be on hand to present the latest innovations in conformal coating technology.

At the event, PVA will highlight its flagship Delta 8 Four-Axis Conformal Coating Machine, featuring state-of-the-art components including the FC100-CF Non-Atomized Filming Coating Valve with Continuous Film Calibration, FCS300-ES-UF Ultra-Fine Extended Spray Valve, and FCM100 Front Closing Micro Dispense Valve. These cutting-edge valves ensure precise and uniform application of conformal coatings, enabling manufacturers to achieve superior results with efficiency and reliability.

In addition to its advanced hardware offerings, PVA will demonstrate its latest software innovation, the PathMaster X Programming Software. PathMaster X is specifically designed for PVA's Direct Series Delta 6 and Delta 8 Automated Conformal Coating and Dispensing Systems, providing manufacturers with enhanced control, precision, and efficiency in their production processes. This groundbreaking software introduces a range of advanced features, a unified programming and production environment, and tools to streamline programming for conformal coating, dispensing, and custom applications.

One of the key features of PathMaster X is the introduction of the X-PAD multi-function controller and a modern touch-screen monitor. This intuitive control system offers users a seamless and efficient programming experience, consolidating all controls within a user-friendly interface. The touch-screen monitor enhances usability, allowing operators to navigate through the software with ease and precision.

Attendees of SMTconnect 2024 are invited to visit the SmartRep booth 4A.225 to learn more about PVA's innovative conformal coating solutions and experience live demonstrations of the Delta 8 Four-Axis Conformal Coating Machine and PathMaster X Programming Software.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

ATLANTA – ECIA is pleased to announce the following new members of the Manufacturers’ Council:

Russ Dzielak, Phoenix Contact
Dawn Manhart, Knowles
JN Corman, Renesas
Josiah Haas, Bud Industries

ECIA has three councils reporting directly to the Board of Directors. The Distributor, Manufacturer and Independent Manufacturers’ Rep Councils are made up of up to 15 members and have oversight responsibility for their specific priorities and agenda items. The council meetings are a forum for the groups to discuss their individual constituent needs and issues. All members are invited guests to the appropriate council meetings. Tom Wichert, TDK-Lambda Americas Inc. Is currently chair of the Manufacturers’ Council.

These recently added new member will strengthen the council leadership team’s breadth of industry knowledge (semi vs passive vs electromechanical), as well as improve the diversity of the council,” noted Manufacturers Council Chair Tom Wichert, TDK-Lambda Americas Inc. “These changes will better enable the council to represent the constituents within our electronic component industry.”

PENANG, MALAYSIA – ViTrox, which aims to be the world’s most trusted technology company, is pleased to announce its participation as an exhibitor and Platinum sponsor at SEMICON Southeast Asia 2024! Join us from May 28th to 30th at Booth #1504 in Malaysia International Trade and Exhibition Centre (MITEC), KL, to experience our advancement in technology and manufacturing.

ViTrox is gearing up for SEMICON SEA 2024, showcasing cutting-edge technologies designed to elevate manufacturing processes. Our interactive demos will feature the TH3000i Tray- based Vision Handler, VR20i G2 Post Seal Vision Handler, V510i Advanced 3D AOI for Advanced Packaging & Microelectronics, Integrated Industrial Embedded Solutions, and the all-new VisionXpert Smart Code Reader (XS Series), alongside other innovations.

What Visitors Will Experience at ViTrox's Booth #1504

1. Enhanced Inspection Solutions

Explore the TH3000i Tray-based Vision Handler for precise inspection across diverse IC packages.
Discover the VR20i G2 Post Seal Vision Handler with advanced vision technology for reel-to-reel inspection.
Experience the AI-driven V510i Advanced 3D AOI for Advanced Packaging & Microelectronics for comprehensive quality control.

2. Industry 4.0 Manufacturing Intelligence Solutions

Unleash peak production with V-ONE 4.0, our smart manufacturing solution offering real- time insights and intelligent control.
Simplify data collection and analysis with V-ONE MARS, ensuring seamless connectivity and easy data management.
Experience digital transformation with V-ONE DIMo, optimising processes and driving efficiency in manufacturing.
Empower production with Manufacturing Execution System (MES), unlocking real- time insights and control for peak performance in smart manufacturing.
Real-time data and analytics are the hallmarks of Enterprise Resource Planning (ERP) systems, driving operational efficiency and informed decision-making by integrating key manufacturing functions.

3. Innovative Integrated Industrial Embedded Solutions

Dive into the world of VisionXpert Smart Code Reader (XS Series) for superior accuracy and efficiency in code reading.
Enhance the production line's automation foundation with the extensive capabilities of our solutions, including Stepper Motor Controller & Driver Solutions, Light Source Controllers, High-speed I/O Cards, Light Source Customizations, and many more.

Furthermore, we're thrilled to announce that our technical experts will be participating in the following Technical Sharing Sessions to unveil our cutting-edge innovations during the event:

Smart Enterprise Forum on May 29th (Wednesday), presented by Mr. Gary Leong, discussing Manufacturing Intelligence Solutions (V-ONE)
Advanced Product Testing Forum on May 30th (Thursday), presented by Mr. John Wong, focusing on Tray-based Vision Handler
TechStage on May 30th (Thursday) featuring Mr. Ooi Jia Yik presenting VisionXpert Smart Code Reader

Never allow manufacturing hurdles to hinder your progress! Our ViTrox experts will be available to assist with enquiries and provide live product demonstrations. Book an appointment using this LINK or scan the QR code above to experience our solutions firsthand. Feel free to reach out via email at enquiry@vitrox.com to join in the excitement.

We look forward to meeting you there!

CAMBRIDGE, UK – Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector. These automotive meta-trends are driving drastic changes in electronic component requirements and present a high-volume opportunity for printed electronics to capitalize on.

Historically, printed electronics technologies have nurtured a close relationship with the automotive sector, with printed force sensors pioneering passenger safety through seat occupancy and seatbelt detection. As such, the automotive sector continues to represent the lion's share of the global printed and flexible sensor market, which IDTechEx’s report on the topic evaluates as worth US$421M in 2024. However, if the automotive sector is to continue to be a reliable revenue stream, printed electronics technology providers must adapt to address the emerging technical challenges facing future mobility.

Augmenting autonomous vehicles with printed electronics

As vehicle autonomy levels advance, the increasing number and distribution of spatial mapping sensors required will need continuous performance improvements to ensure passenger safety. Emerging printed electronics technologies can augment these sensors, extending detection bandwidth and maximizing reliability during operation.

Transparent conductive films (TCFs) are being developed to heat and defog LiDAR sensor panels, ensuring the function is unperturbed by external environmental conditions. Properties such as high transparency and low haze are important for defogging. These properties can be easily tuned using the wide variety of material options available for TCFs, including carbon nanotubes and silver nanowires.

IDTechEx identifies printed heating as a leading application of transparent conductive films. This is attributed to diminishing growth prospects in capacitive touch sensing applications. Innovations in thin film coating techniques have enabled indium tin oxide (ITO) to dominate touch sensing applications, all but displacing TCFs completely.

Looking towards the future, printed electronics technologies could play a more active role in advanced autonomous driving. Emerging semiconductive materials, such as quantum dots, printed directly onto conventional silicon image sensor arrays can extend detection range and sensitivity deeper into the infrared region. Augmenting existing image sensor technology with enhanced spectral range could facilitate the competition of hybrid silicon sensors with established InGaAs detectors.

Printed sensors promise granularized battery health monitoring

Vehicle electrification is driving the sustained development and evolution of electronic management systems, particularly in the battery and electric drivetrain. A strong market pull exists for technologies that increase vehicle efficiency, range, and lifetime while reducing recharge times.

Printed pressure and temperature sensors measure battery cell swelling and thermal profiles, providing granularized physical data that can be used to optimize battery deployment and recharging. Moreover, hybrid printed sensors that combine integrated printed heating elements promise a solution to actively address battery temperature. IDTechEx estimates that printed sensor-enabled battery deployment and charging optimizations could be worth up to US$3000 in savings per vehicle.

There remains uncertainty about whether electrification trends will correspond to increased demand for physical sensors in electric vehicle batteries, owing to the utility of existing electronic readouts for managing deployment. Virtual sensors also pose a threat, where AI-enabled software models interpret data to predict and emulate physical sensor functions without the need for discreet components. However, emerging regulations regarding safety and sensor redundancy will likely favor measurable metrics and see automotive makers continue to adopt physical sensors. IDTechEx predicts that virtual sensors are unlikely to displace their physical counterparts – so long as low-cost sensors remain widely available.

Embedding printed electronics in the car of the future

IDTechEx predicts that global car sales will saturate over the next decade, with automakers increasingly looking for premium features and technical innovations to differentiate themselves from the competition. In-cabin technologies will be highly desirable – as the location where passengers reside and interact with the vehicle the most.

Lighting elements are emerging as a prominent differentiator, described as “the new chrome” by Volkswagen’s chief designer. The use of in-mold structural electronics (IMSE) enables the integration of embedded lighting elements using existing manufacturing processes. 3D electronics technologies are intrinsically attractive for automotive integration, as functional layers are conformable and lightweight while easily embedded within existing aesthetic elements.

Despite strong tailwinds, the adoption of in-mold electronics within automotive interiors has been sluggish. This is attributed to the challenges of meeting automotive qualification requirements, as well as stiff competition with less sophisticated alternatives such as applying functional films to thermoformed parts. Nevertheless, momentum is building, with technology providers like Tactotek partnering with Mercedes-Benz and Stallantis to progress the automotive validation of IMSE to TRL5.

Outlook for printed electronics in automotive applications

Just as printed force sensors heralded early passenger safety systems, printed electronics technology is poised to underpin next-generation innovations for the car of the future. But this time, the competition will be stiff. Critical cost requirements must be met, while desirable new functionality must address existing challenges faced by manufacturers. Printed electronics can play a role in supporting emerging electrified and autonomous mobility, such as augmenting LiDAR sensors or optimizing electric battery deployment. Demand for technologies that enhance passenger experience and vehicle aesthetics will continue to grow, and printed electronics can supply low-power, lightweight lighting solutions for these.

Sustained engagement from tier suppliers and manufacturers continues to make the automotive sector key to printed sensor market growth opportunities – a total market IDTechEx predicts will reach US$960M by 2034. Strong partnerships between material providers and printed electronics technology providers are complementary to those of the highly vertically integrated automotive value chains between tier suppliers and OEMs. Leveraging printing techniques to provide solutions that slot into existing manufacturing processes and designs will be crucial. In the medium term, the printed electronics technologies most likely to realize revenue potential are those that can adapt to service emerging challenges already known to the automotive industry.

For more information on IDTechEx's research on this topic, please see their report, "Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets."