MILWAUKIE, OR – ECD plans to showcase its award-winning M.O.L.E.™ EV and RIDER™ portfolios at SMTA Guadalajara Expo and Tech Forum, the company announced today. At the September 11- 12 event, ECD will exhibit with regional partner PAC Global, Inc. from booth #534, offering demonstrations of its M.O.L.E. EV6 touchscreen thermal profiler and machine quality management pallets OvenRIDER™, WaveRIDER™, and SelectiveRIDER™. The company has seen significant growth in the Mexican electronics manufacturing sector, particularly in the production strongholds of Chihuahua, Juarez, and Guadalajara, and attributes its success to continued product innovation and unmatched customer support.

Since its market introduction last year, M.O.L.E. EV6 has set the benchmark for thermal profiling productivity, accuracy, and ease of use. Enabling lineside access to profiles, calculation templates, and pass/fail analysis, M.O.L.E. EV6 eliminates the need for offline PC data viewing, allowing immediate corrective action implementation. The thermal profiler integrates with all ECD’s machine quality management pallets – OvenRIDER, WaveRIDER, and SelectiveRIDER – for a scalable solution to total soldering process control.

“The time savings and intuitiveness afforded by M.O.L.E. EV6 is tremendous for productivity and operator training,” shares Oscar Gomez, ECD Latin America Sales Manager. “My conversations with customers throughout Mexico confirm this fact. These plants are busy, and saving time on the line equates to higher yields and increased revenue. M.O.L.E. EV6 provides thermal profiling confidence in real-time.”

ECD and PAC Global look forward to demonstrating the M.O.L.E. EV difference to SMTA Guadalajara Expo visitors. To learn more about ECD’s complete range of M.O.L.E., SmartDRY, and machine quality management technologies, visit www.ecd.com 

SANTA CLARA, CA – Promex Industries, a Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, and its San Diego-based division QP Technologies, a leading provider of innovative microelectronic packaging and assembly solutions, today announced a sales/marketing reorganization aimed at growing both companies’ core businesses. As part of this effort, key changes have been implemented at the executive level at both sites. Rosie Medina, who has served as vice president of sales and marketing for both companies over the past several years, was named senior vice president of sales and marketing for Promex’ Santa Clara site.

“As our business expands, we are focused on engaging with a broader customer set,” said Dave Fromm, Promex chief operations officer. “Rosie has proven adept at establishing and building customer relationships. In her new role, she will take the lead in identifying new customers and educating them about Promex’s central value: helping solve difficult product development problems and building complex, high-value subassemblies for advanced applications such as medtech/biotech devices and MEMS and sensors.”

On the QP Technologies side, Matt Hansen has been promoted to VP of sales and marketing from his prior position as director of sales and business development for Promex. In this role, Hansen will leverage his experience to pursue new customers for QP Technologies in such key markets as the rapidly growing military-aerospace arena. Already ITAR-registered, the company is actively pursuing certification in AS9100, the international Quality Management System standard for the aviation, space and defense industry. Compliance with AS9100 is vital to gaining access to large OEMs and the broader supply chain.

Ken Molitor, chief operating officer for QP Technologies, noted, “Rosie has done a fantastic job for us over the past nine years. With that said, Matt’s two-plus decades of experience in sales and business development and proven track record in revenue growth make him a valued addition to the QP team. We are the leader in quick-turn and low-medium volume, turnkey onshore IC packaging and assembly services, and having Matt dedicated to QP Technologies will allow us to enhance our customers’ overall experience.”

The reorganization was prompted by both companies’ continued strong growth, which has also fueled expansion of their respective manufacturing lines. QP Technologies is seeing strong demand from global customers across its offerings – in particular, for its air-cavity open-molded plastic packages (OmPP) and its custom turnkey solutions for high-performance, substrate-based assemblies. Promex experienced double-digit growth in fiscal 2024 (ended June 30), driven by escalating demand for its ability to solve complex integrated device challenges, including precision miniaturization processes for MEMS and sensor devices.

WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Amkor. The incentives, which are part of the CHIPS and Science Act, will support Amkor’s advanced packaging operations in Arizona. The Commerce Department previously announced incentives for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.

“Today’s Amkor announcement will strengthen U.S.-based advanced packaging operations—a critical step in the chip production process—while further expanding Arizona’s booming semiconductor ecosystem and bringing more jobs and economic growth to the state. We commend Amkor for investing ambitiously in U.S.-based advanced packaging, which is an area that needs to be strengthened in the U.S. chip ecosystem, and we salute the U.S. Commerce Department for continuing to make impressive headway in getting CHIPS Act incentives out the door in a timely and effective manner. We look forward to continuing to work with leaders in government and industry to ensure the CHIPS Act delivers maximum benefits for America’s economic strength, national security, and supply chain resilience.”

The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced more than 80 new projects across 25 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 56,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032, ranking second only to Taiwan (31%).

SINGAPORE – ASMPT and IBM today announced a renewed agreement to extend their collaboration on the joint development of the next advancement of chiplet packaging technologies. Through the agreement, the two companies will work together to advance thermocompression and hybrid bonding technology for chiplet packages, using ASMPT’s next generation of Firebird TCB and Lithobolt hybrid bonding tools.

Chiplets deconstruct SOCs into their composite parts, creating smaller chips that can then be packaged together to operate as a single system, to provide potential benefits that can include improved energy efficiency, faster system development cycle time, and reduced costs. However, packaging advances are needed to move chiplets from research to mass production more quickly and efficiently, driven by the rapid pace of innovation in AI computing.

This latest agreement builds on an existing collaboration between ASMPT and IBM, resulting last year in the debut of a new hybrid bonding approach* that optimizes bonding quality between two chiplets. Now, they will continue to work together on the development of bonding technologies for chiplet packages.

“IBM has been at the forefront of developing advanced packaging technology for the age of AI,” said Huiming Bu, Vice President of IBM Semiconductors Global R&D and Albany Operations, IBM Research. “We are proud to continue our work with ASMPT to advance chiplet packaging technology to pave the way for smaller, more powerful, and more energy efficient chips.”

“We are excited to build on our strong relationship with IBM to drive the frontiers of Advanced Packaging in tandem with accelerating innovations in artificial intelligence,” said Lim Choon Khoon, Senior Vice President, ASMPT. “We are pleased to work with IBM to advance next generation packaging and Heterogeneous Integration solutions for the AI era.”