The MT2168 pick-and-place test handler is configurable and comes with up to 16 contact sites. Reported index time is 0.38 sec. and temperature accuracy is +/-1.0°C. Features soak capacity for 3.5 JEDEC trays and throughput of up to 20,000 uph. Handles BGAs, QFNs QFPs and other thin and small devices (3.0 x 3.0 x 0.3 mm) with contact pitches of 0.3 mm or higher.

Multitest Elektronische Systeme GmbH, www.multitest.com

Model 27E magnet wire stripper is designed to strip magnet wire, coils and resistor leads to within 0.031" from the component body. Rotating slotted stripping insert removes the film insulation. Strip lengths with stop rod installed are up to 0.625" or up to 2.87" with stop rod removed. Changes easily for various wire gauges and available in tool steel or carbide. Optional P/N 1939D Flexible Shaft Assembly; converts from benchtop to portable unit, capable of processing leads on heavy coils.  

Carpenter Manufacturing Co. Inc., www.carpentermfg.com  

Enterprise 3000 v. 8.2 is an automated DfM verification tool for PCB design. Is said to cut processing time 25%, while memory management improvements enable analysis of larger designs than previously possible. The new version also incorporates functionality that improves the system’s ease-of-use, simplifies the DfM analysis preparation process and improves upon filtering capabilities. Provides new analysis verification for HDI designs through the integration of net integrity, electrical return path, and via stack count for HDI designs. Via Stack Count verification is used to locate likely microvia fractures and return path validation. Also enables wire bond and die pad netlist validation. A new design preparation rule set module makes preparing a design an order of magnitude faster and easier than using traditional automation techniques. Attributes are now provided with a complete and meaningful name, making it easier for DfM users to setup and be productive. Analysis for thermal impact of embedded pads has been improved to calculate the percentage of perimeter for the covered area to minimize incorrect identification of DFM issues. 

Supra-E AOI uses iPro and comes standard with a 5-MP camera with Tri-Color illumination. Has resolutions between 7 and 17 µm; is capable of inspecting 01005 components to solder joint level. Is capable of board handling of 20 x 18". For low- to high-volume and low- to high-mix environments. Can reportedly be placed at any position in the production line without configuration changes. Programming times said to be 10 to 90 min.

 

Machine Vision Products Inc., www.machinevisionproducts.com