LTS-QFP is a programmable, automated machine that reconditions QFP and FP component leads for high reliability or RoHS applications. Has robotic part handling device that picks QFPs from a loading platform with a vacuum head. Component is inspected by camera for location. Flux is applied to the leads. Has two solder pots said to eliminate bridging. Is based on the LTS200 platform. Can be programmed to handle transistors, capacitors, diodes, axials, radials, pin grid array, sips, dips, connectors and more.
ACE Production Technologies Inc., www.ace-protech.com
Comes with full native boundary scan test capabilities and VTEP v2.0 Powered vectorless test suite, including Cover-Extend.
Agilent Technologies, www.agilent.com
Next Production Modular is a single-platform modular assembly machine with interchangeable, plug-and-play placement heads for nearly any component. Integrates solder paste inspection, adhesive dispense, post-placement inspection and screen-printing capabilities. Both heads of each NPM unit work on both stages. The Dual Screen Printer module performs parallel, simultaneous printing of two unique products. Has area productivity of up to 25,000 cph/m2. Uses features of CM series placement equipment, including intelligent feeders and nozzles with interchangeable head capabilities. Exchange carts reportedly provide virtually zero downtime during changeover.
Panasonic Factory Solutions Co. of America, www.panasonicfa.com/?id=NPM