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Selective soldering systems with internal (integral) preheating modules are for large, high-mass assemblies in which process heat is applied only to the bottom side. Said to promote the draw of solder through the barrel to the board topside. Includes continuous preheat during selective soldering.

ACE Production Technologies, www.ace-protech.com

HD Grid-Lok is a high-density tooling solution designed to support entire PCB assembly without manual intervention. Its 12 mm pin pitch reportedly can be set up in seconds. Is said to be ideal for high changeover manufacturing environments. Is based on a modular foundation concept; reportedly will conform to any board profile and to individual substrate topographies, with pins automatically locked into position.

DEK, www.dek.com

FLO/PCB Version 4.1 thermal design software includes the ability to model potting compounds, probe temperature values interactively, provide user-defined temperature ranges and search component libraries. Is said to make it possible to perform board-level thermal simulation early in the design process. Includes a SmartPart object used to represent epoxy type solid cured potting compounds; can be placed over all or part of either side of the PCB. Multiple potting compound regions reportedly can be defined. Provides the ability to move the cursor over a temperature plot in the results visualization mode and report the point temperature. Using legend scaling options, users can define minimum and maximum values for the upper and lower bounds of the scale. Also includes an advanced search capability. Maintains bi-directional connectivity with Version 7.1 of Flotherm.

Flomerics, www.flopcb.com and www.flomerics.com

The 6-Pack Analysis Package is a sampling service designed to define the cleaning bath loading capacity for inline and batch cleaning processes. Consists of a set of sample bottles for regular sampling directly from the cleaning tank. Each sample is subsequently returned to the analytical center for detailed analysis. A bath-loading report is provided to users, including recommendations on how to further extend the cleaning agent’s bath life.

Zestron America, www.zestron.com

The RO300FC full convection reflow oven has four zones (three heating and one cooling), for all soldering and curing tasks. An inert gas model is also available, and changeovers between air and nitrogen are said to take less than 5 minutes.

The unit is 78.8 x 28 x 47.2". Solder width is 11.8", transport speed is 4 - 31.5".min.

Between heating zones is a "stream seal" that permits temperature differences between two zones up to 90°C (194°F).

Comes with optional RO-CONTROL software, which simulates new processes prior to soldering and graphically compares temperature profiles.

Essemtec, www.essemtec-usa.com

The Juki 350 selective soldering system comes standard with an X,Y, Z and A axis servo drive and is equipped with all the functionality necessary to begin production immediately. Includes a soldering unit that features forced hot air nitrogen preheat at the mini-wave nozzle. Nitrogen preheat limits dross buildup, opening the process window and reducing maintenance. An innovative nitrogen management system is used to reduce nitrogen consumption. Other standard features include a spray fluxer or micro-dot drop jet fluxer mounted on an individual A axis servo drive; 5-liter pressurized flux tank; an exchangeable quick exchange mini-wave nozzle from 4 to 30 mm in diameter (custom nozzles are available by request); exchangeable Pb-free ready solder pot with 110 lb. capacity; auto feeder solder roll for maintaining solder pot feed level; a wave height on/off control feature; online/offline programming software that can accept images such as JPG, BMP, TIF, as well as Gerber files for easy programming with a simple to use GUI; and a float sensor for keeping constant levels of solder in the pot at all times. Comes with dual nozzle and dual fluxing capability.

Juki Corp., www.jas-smt.com