Products
PCS peelable coating mask is a flexible synthetic acrylic latex designed to withstand coating and wave soldering processes. Is water-based and environmentally friendly. On application the mask is orange and darkens once cured. Said to it peel easily after curing. Reportedly noncorrosive to most substrates, with good solvent resistance. For masking components, connectors and other items during a conformal coating process. Is suitable for dip, spray or brush applied conformal coatings.
Electrolube, www.electrolube.com
Electrolube, www.electrolube.com
The BC-60 edge carry transfer conveyor is 600 mm in length and has a single drive; the BC-100 comes with a single 1M drive or 2-500 mm drives. The ESD edge belt is 3 mm wide and can handle PCBs up to 18" in width. Features include variable speed control, front ESD work surface with grounding strap (green or royal blue mats available), Inspect and Pass mode selection with both hand and foot pedal for PCB release, and programmable logic controller.
Promation Inc., www.Pro-mation-Inc.com
This no-drip, Pb-free, no-clean SAC 305 solder paste for mechanical soldering is said to be excellent for gap filling and application on vertical surfaces. Help solder joints around a heat tube (or heat sink) container. Reportedly wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper.
EFD Inc., www.efd-inc.com
SIP and STRIP male pin headers feature sturdy 0.040" diameter leads; mate to standard SIP and STRIP female sockets. The double-row connector is offered standard in 8 (2x4) up to 100 (2x50) position configurations on 0.100" spacing. Reportedly creates a high current interconnect rated at 8 amps per position. The low-profile insulator (0.071" thick) is manufactured with high-temperature thermoplastic. Standard and RoHS plating available. Use brass alloy 360 ½ hard.
Mill-max, www.mill-max.com
Hysol FP4581 and FP4583 are liquid epoxy encapsulants for use as underfills for flip-chip devices. FP4581 is formulated high-lead, bumped large die flip-chip packages. Is said to have low coefficient of thermal expansion properties and improved toughness over previous materials; forms a rigid, low-stress seal on solder joints. Is said to be ideal for flip-chip devices that require improved crack and fracture resistance. Is compatible with most no-clean flux systems. FP4583 is for applications requiring a fine filler. Contains fillers less than or equal to 2 µm in diameter; is formulated for overmolded components.
Henkel Corp., www.henkel.com/electronics
The YTV B3 benchtop AOI now comes standard with Fusion Lighting. Said to offer up to 3x improvement in inspection speed and advanced image processing. Consists of more than 600 colored LED lights that project to the PCB surface from different angles (high, medium and low). Enhanced contrast in the image is said to allow inspection algorithms to identify features in component body or solder joints that would have been previously difficult to see. Is available with two top-down viewing thin cameras for inspection of components down to 01005s. Cameras reportedly permit small component inspection without a significant increase in cycle times.
YESTech, www.yestechinc.com
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments