Free simulation design kits assist with the integration of Altera’s Arria GX FPGAs onto PCBs. Arria GX FPGA transceiver-based devices are said to be ideal for applications where the technology is moving rapidly with short design cycles, such as communications, computer, storage and industrial.

A set of topology templates makes routing to JEDEC-defined signaling standards such as SSTL 1.8V a straightforward process. The kit reportedly makes it easy to compare real-board performance against the theoretical ideal, using waveform and eye pattern analysis, in addition to simulation models. It allows users to view results in both time and frequency domain, displaying both voltage and current.

Zuken, www.zuken.com/linkz

Hysol QMI5100 and Hysol QMI5200 are dicing die attach films designed to streamline the die attach process, particularly for stacked die applications. Combine properties and functions of die attach film and dicing tape into one product; dual structured materials. Reportedly only need to laminate film to backside of wafer; dice the wafer; pick the die and move to die placement; leave no burrs after dicing; eliminate common bleed issues. Said to remove the need for dispensing or curing equipment or process steps. QMI5100 is 10 µm thick material. QMI5200 is available in a thickness of 20 µm; approved for use on DA1 and/or DAX. Primarily for flash and DRAM devices. Die placement down to 0.1 sec. Formulated as pressure sensitive release materials.

KIC Explorer is a thermal profiler with a miniature-TC harness design. Said to move easily through restrictive process dimensions; incorporates high-temperature rated components; has 12 thermocouples. Reportedly provides highest sampling rate available and greater memory capacity. Measures slope, peak temperature, time above liquidous and the Process Window Index statistic. Manual prediction capability comes standard. Auto-Focus is optional.

KIC, www.kicthermal.com

Hysol QMI708 die attach paste has been formulated specifically for small die on copper leadframes. Has been developed to attach die 2.5 mm x 2.5 mm and smaller in QFN and SOIC packages. Said to be highly conductive, with low bondjoint resistance. Reportedly dispenses quickly with no tailing; is simple to set up, and allows for a wide dispense window.