Virtual Panel Carrier centers substrates and is said to enable multiple component support and alignment during screen printing and all subsequent assembly processes. Enables alignment once; reportedly no further adjustments are required. Design consists of a base carrier with a consumable foil. Said to provide stability, centering and alignment capabilities required to process substrates or components in a single panel. Parts are placed manually or loaded with a placement system. Substrates are held in the carrier via a patented four-sided tensioning mechanism. Parts are referenced using two global fiducials. Is scalable.

SIwave v3.5 is a full-wave electromagnetic field simulator optimized for signal-integrity, power-integrity, and electromagnetic interference analysis of high-speed PCBs and IC packages. Features a finite-element-based DC solver optimized for extraction of power rail geometry in low-voltage/high-current PCBs and packages. Engineers reportedly can view voltage and current distributions in all relevant geometry, including vias and bond wires; have access to voltage drop and current flow information through vias, bond wires, sources, resistors, inductors, etc. in tabular format. Said to simulate electromagnetic behavior of complex PCBs and IC packages, including multiple, arbitrarily shaped power and ground layers, and any number of vias and signal traces. Full-wave S-, Y- or Z-parameters or GHz-bandwidth circuit model is used in concert with time- and frequency-domain analyses within Nexxim and DesignerSI or third-party SPICE-compatible circuit tools. Highlights include 64-bit capability; frequency-dependent source implementation; linear interpolation; frequency-dependent material model (Djordjevic-Sarkar); visualization of near E and H fields, and clip design tool. 

Ansoft Corp., www.ansoft.com/siwave