The SmartStream pump is said to eliminate striking of a piston to a seat or nozzle. Each cycle displaces a column of material, rather than a single sphere. Cycles at frequencies that create a stream of material that reportedly can deliver increased flow rates (greater than 70 ÿl/sec). The displacement piston, driven by a linear motor/encoder assembly, is carbide. Design allows for easy removal and cleaning of the fluidic module. Only three o-rings need to be replaced. Z travel of dispense head is said to be virtually eliminated, as material is released from a nozzle 2-3 mm above the PCB surface. Reduces number of height senses needed.
SMP300 screen printer has a three-stage conveyor to eliminate additional buffer units. Features a patented clamping process to ensure the board is in the proper plane. Uses two CCD cameras to view and teach fiducials for aligning the board to the stencil within ±0.025 mm. Has a closed-loop, pneumatically controlled print head, and comes with 2-D post print inspection and automatic wet or dry stencil cleaning. Prints for 01005 pads.
The Niton XL3 Series third-generation handheld XRF analyzer is said to provide the fastest solder alloy grade identification and laboratory-quality composition analysis of plastics and polymers. Typical time for routine solder screening measurements is said to be less than 5 sec. Features a 50 kV, 2W x-ray tube. Comes in a range of configurations with an assortment of optional features and accessories; quick screening to simultaneous measurement of up to 25 elements in a sample. Offers component testing; solder analysis; populated PCBs and finished goods; hi-reliability screening.
The M3i provides materials management and printing capabilities. Is comprised of materials management cartridges, a ProFlow enclosed printer head, and Europa printing platform. Offers programmable ratio mix control and imaging of a variety of materials. Materials are preloaded into climate-controlled cartridges and stored at low temperature, then heated within the print head when elevated materials temperatures or melting processes are required. Is said to be completely scalable and can be used for underfill, encapsulation, solar cell and fuel cell imaging. Said to be fully automated and programmable; throughput is improved; operator intervention errors are eliminated; waste is reduced.
The Symbion P36 Plus AOI features 3-D and 2-D detection and is said to provide 100% volumetric solder paste inspection accuracy. Enhanced with latest architecture and high-powered processing capabilities. Includes process control software. Has central data hub where all relevant data are stored. Automatically links post-reflow AOI inspection data with solder paste inspection data and SPI results with paste printer machine events. Alerts when processes are out of operator-defined parameters and can stop a related machine.
MPM Accela printer now comes with Benchmark 2.0 machine operating software. Is said to offer significant post-print inspection enhancements; integration of barcode scanning for product traceability and process verification; singulated processing of indexed Auer boat substrates, and support for CAMX machine data streaming per the IPC-2541 specification. Includes SpeedVision inspection architecture. Said to increase the speed of contrast-based pad coverage inspection and texture-based BridgeVision and StencilVision through the use of full field-of-view processing, rapid image acquisition and optimized camera travel. Decrease in inspection time reportedly ranges from 40 to 70%.