Products
‘Advantage X’ enhancement package is said to boost placement rates by 15%. The retrofittable upgrade is suitable for all MIMOT pick-and-place machines; it combines hardware and software advances. Beneficial for high-mix pick-and-place systems, bringing the cph rate to 24,000 for devices from chip components to fine pitch.
Features an intelligent nozzle vacuum sensor, automatic polarity checks for feeder setup and other software help tools.
Will be a standard feature on all new Advantage Systems.
MIMOT, mimot.com
Features an intelligent nozzle vacuum sensor, automatic polarity checks for feeder setup and other software help tools.
Will be a standard feature on all new Advantage Systems.
MIMOT, mimot.com
Blue Thunder Technologies will distribute Loctite Multicore product line. The company has been supplying consumables such as GREEN MONSTER! stencil wiping rolls, lint-free wipes, pre-saturated wipes, ESD items, gloves and more to the electronics industry for several years.
Blue Thunder is now distributing Loctite’s electronic products including but not limited to solder paste, Pb-free solder paste, solder bar, solder wire, underfills, encapsulants, flux materials, surface-mount adhesives, circuit board protection and low-pressure molding.
Blue Thunder, www.bluethundertechnologies.com
BP Microsystems will highlight the latest addition to its Helix automated device programmer at the upcoming NEPCON South China exhibition and conference in Shenzhen.
As a desktop automated system, the Helix comes with two precision-designed tray input and output handling systems with a reject location. The updated system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BP Microsystems automated line. The pressure plates are exchangeable between the tray version and the Helix-TU-10 units.
Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability. This allows for programming up to four devices simultaneously per site. Designed to handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
BP Microsystems, www.bpmicro.com
Nepcon Shenzhen booth 52C01
As a desktop automated system, the Helix comes with two precision-designed tray input and output handling systems with a reject location. The updated system is designed to have the same dph and is based on the Helix-TU-10 design. The tray version uses the same core programming technology, as well as the same socket modules as the standard BP Microsystems automated line. The pressure plates are exchangeable between the tray version and the Helix-TU-10 units.
Integrated in the handler are two Enhanced 7th Generation programming sites with FX4 socket module capability. This allows for programming up to four devices simultaneously per site. Designed to handle a range of packages including MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date.
BP Microsystems, www.bpmicro.com
Nepcon Shenzhen booth 52C01
Blakell Europlacer Ltd. will display the new Tornado head at the upcoming NEPCON South China trade show and exhibition.
The head features 12 position turret nozzles. Available on the Xpress range. Xpress 15 equipped with a Tornado head becomes Xpress 15T and the Xpress 25 becomes Xpress 25T. The speed of the machines is reportedly increased by 10%.
Xpress 25T combines high-speed and fine-pitch capabilities within a compact footprint. Twin heads can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70mm QFP and 100 mm connector optional) at a tact time of 0.128 sec (28,000 cph equivalent). Equipped with “smart nozzles” and on the fly vision.
Europlacer, europlacer.com
Nepcon Shenzhen booth 2M05
The head features 12 position turret nozzles. Available on the Xpress range. Xpress 15 equipped with a Tornado head becomes Xpress 15T and the Xpress 25 becomes Xpress 25T. The speed of the machines is reportedly increased by 10%.
Xpress 25T combines high-speed and fine-pitch capabilities within a compact footprint. Twin heads can place devices ranging from 0201 to 50 x 50 mm QFP (70 x 70mm QFP and 100 mm connector optional) at a tact time of 0.128 sec (28,000 cph equivalent). Equipped with “smart nozzles” and on the fly vision.
Europlacer, europlacer.com
Nepcon Shenzhen booth 2M05
FINETECH will highlight the compact rework system Fineplacer CRS10 at Nepcon South China on Aug. 29 to Sept. 1.
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71
The rework station handles the complete rework process and supports automated component placement and lift-off. Has user-friendly Chinese software. Better than 10 µm placement accuracy allows for rework of high density packaged boards. Large field of view accommodates large component alignment (e.g., super BGAs with side lengths of up to 45 mm), without additional optics. Even larger components can be aligned using the company's Split Field Optics "MIRAGE". Typical applications include BGA, CGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small components such as 0201, 0402, 0603 and connectors, RF-shields, shielding frames, flip chip rework and customized applications.
FINETECH, www.finetech.de
Nepcon Shenzhen booth 2G71
ESSEMTEC AG will highlight CSM7100, a flexible pick-and-place system with intelligent feeders for high-mix/low-volume production, at the upcoming NEPCON South China exhibition and conference.
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
Footprint is 80 x 80 cm.
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50
Features large feeder capacity, intelligent feeders and easy-to-use operation software. Standard laser alignment is accurate, reliable and maintenance-free. Every component is measured and aligned on-the-fly. Tape reels, tape strips, sticks and trays of any size can be used to feed parts. Components as tall as 15 mm can be placed.
Ooffers a wide application range, feeder capacity of 100 x 8 mm, intelligent tape feeders from 8 to 56 mm, 4000 placements per hour, optical on-the-fly alignment, easy graphical operation system, integrated dispensing system, barcode-based feeder setup and a universal CAD data input filter.
Includes machine operation software Lightplacer. Barcode labels on feeders and components guarantee the correct and quick feeder setup using a barcode reader.
Footprint is 80 x 80 cm.
ESSEMTEC, essemtec.com
Nepcon South China booth 2C50
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