Products
LMS6000 is a fully functional, closed loop, ytterbium-doped fiber laser system capable of marking a variety of flat label materials and direct marking on specific metallic and plastic substrates. Includes an in-line mark grading system with error detection capability. Features reel-to-reel transportation with integrated fume extraction and vacuum hold-down of the material being marked.
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m2 marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
Tyco Electronics Corporation, www.tycoelectronics.com
Ytterbium laser provides marking resolution up to 1000 dpi at a marking speed of 2000 mm/sec. Labeling applications include compact bar codes and 2D data-matrices. Effective marking area of 130 x 130 mm can be expanded to 185 x 185 mm for continuous applications; with optional direct part marking module, a 1m2 marking area is possible. Provides fast throughput for cutting, oxidizing, engraving and anodizing.
Specific materials suitable for the system include: AL-AN anodized aluminum tags, ACR Tamper Evident Acrylic, acrylic coated polyester, polyester, Poly-A200 and Poly-A400 Laser Markable Polyesters, NMX Aramid Tags, TTVF Polyvinyl Fluoride, RMK and RMK6 Raymark epoxy coated labels, Stainless Steel, Brown Steel, Duroplast, Copper, Titanium and Carbide as well as polyaramid, PVF, AlumaMARK laser markable aluminum and many others. Other materials can be optimized per application requirements or to specific industry specifications.
Weighs 35Kg and measures 150 x 25 mm, which allows for portability, sharing or on-site work. Integrated software package helps with label designs and connects with many production control software systems.
Tyco Electronics Corporation, www.tycoelectronics.com
The electronics group of Henkel has introduced a new process, Accelerated Cooling (AC), to be used with its two flip-chip in package non-conductive paste (NCP) underfill encapsulants. The NCP materials, Hysol FP5000 and Hysol FP5001, provide moisture resistance, thermal cycling resistance, expedite the assembly process and are designed for Pb-free interconnects.
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning.
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
Henkel, electronics.henkel.com
Provide an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a Pb-free compatible thermal compression process, eliminating the need for flux application, reflow and cleaning.
AC process heats the device while it is secured by the flip-chip bonder head and then is rapidly cooled during compression onto the NCP-coated substrate. This rapid cooling enables assembly completion prior to any excess heat exposure and, consequently, reduces package warpage, voids caused by moisture and assembly cycle time. Cuts typical cycle time in half (cycle times average 7 sec.).
Henkel, electronics.henkel.com
DataFlex Plus thermal transfer overprinter (TTO) provides on-line printing of variable and real-time data, such as expiration dates, batch/lot codes, ingredients/parts listings, bar codes and logos.
Direct-drive ribbon technology contains few wearable parts, increasing reliability and minimizing downtime and costs associated with ribbon breaks. Standard 1,000 meter ribbon means less frequent changes and higher production line efficiency. Features simple ribbon cassette
Has an intuitive 8.4” SVGA GUI and color touch screen with easy-to-learn, icon-based controls. The standard WYSIWYG job display features a zoom facility to reduce operator error and minimize printing incorrect codes. Has three levels of password protection.
Bi-directional ribbon drive allows unused ribbon to be recaptured following each print. This maintains a 1 mm gap between prints for the complete length of the ribbon, creating more prints per roll.
Direct-drive ribbon technology contains few wearable parts, increasing reliability and minimizing downtime and costs associated with ribbon breaks. Standard 1,000 meter ribbon means less frequent changes and higher production line efficiency. Features simple ribbon cassette
Has an intuitive 8.4” SVGA GUI and color touch screen with easy-to-learn, icon-based controls. The standard WYSIWYG job display features a zoom facility to reduce operator error and minimize printing incorrect codes. Has three levels of password protection.
Bi-directional ribbon drive allows unused ribbon to be recaptured following each print. This maintains a 1 mm gap between prints for the complete length of the ribbon, creating more prints per roll.
Videojet Technologies Inc., videojet.com
Axiom X-1022 Dual-Lane dispensing system maximizes throughput during multi-pass underfill operations. Increases the number of units per hour (UPH) produced in high-volume semiconductor applications such as flip chip and CSP underfill. Allows parallel processing on two lanes for continuous dispensing, eliminating lost time in non-dispensing activities. In some applications, a 60 to 80% increase in throughput over single-lane dispensers can be achieved.
Dual-lane capability allows underfill flow-out in one lane while jetting underfill in the opposite lane. Eliminates wait-time by enabling two dispensing processes at the same time.
The conveyors are independently controlled, allowing different-sized parts to be processed in lanes one and two. Programmable flat-belt, dual-lane conveyor allows for a variety of process carriers, including Auer boats, lead frames and custom carriers. Conveyor is SMEMA compliant with a fixed first rail and adjustable second, third and fourth rails.
Configured with up to six stations of contact or impingement heating, three stations per lane: pre-heat, dispense and post-heat. The heat stations ensure consistent substrate heating at specified ramp rates for efficient, reliable fluid dispensing.
Fluidmove for Windows XP software offers advancements in throughput, fluid management and process control. For example, the board or substrate is sensed in the pre-dispense station and the associated dispensing program is automatically loaded.
Mass Flow Control and Calibrated Process Jetting control the critical aspects of the fluid dispensing process in a closed feedback loop.
Dual-lane capability allows underfill flow-out in one lane while jetting underfill in the opposite lane. Eliminates wait-time by enabling two dispensing processes at the same time.
The conveyors are independently controlled, allowing different-sized parts to be processed in lanes one and two. Programmable flat-belt, dual-lane conveyor allows for a variety of process carriers, including Auer boats, lead frames and custom carriers. Conveyor is SMEMA compliant with a fixed first rail and adjustable second, third and fourth rails.
Configured with up to six stations of contact or impingement heating, three stations per lane: pre-heat, dispense and post-heat. The heat stations ensure consistent substrate heating at specified ramp rates for efficient, reliable fluid dispensing.
Fluidmove for Windows XP software offers advancements in throughput, fluid management and process control. For example, the board or substrate is sensed in the pre-dispense station and the associated dispensing program is automatically loaded.
Mass Flow Control and Calibrated Process Jetting control the critical aspects of the fluid dispensing process in a closed feedback loop.
Asymtek, asymtek.com
Model 3500-III flexible, computer-controlled work cell performs adhesive dispense, component placement, die attach and flip chip operations over a 720 sq. in. work area. Applications include flip chip, stacked die, chip-on-board, fine pitch SMT, MEMs devices, multichip modules, microwave modules, optoelectronic modules and hybrid microcircuits.
Capable of automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.
Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the sub-micron axis resolution yields placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications.
Placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms.
Machine base is a honeycomb core optical table that provides vibration damping and thermal settling response. Large work area. Cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in pickup and placement of fragile devices. Eight-position turret head can rapidly change tools on the fly without a tool dock assembly. Constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, so any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.
Has infrared light curtain around the open perimeter of the assembly cell. This sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 millisec.) shorts the inputs to the digital servo driven motors, stopping all motion.
Uses Windows XP.
Palomar Technologies, www.palomartechnologies.com
Capable of automated eutectic die attach using backside metalized die or preforms, and enables bonding of thin die with air bridges using 2 or 4 sided perimeter collets. Pulse heat process controls the heat throughout the entire process from temperature ramp up to cool-down.
Using look-up and look-down cameras for flip chip applications and relative-to referencing for linear micro-strip line placement, the sub-micron axis resolution yields placement repeatability of better than ±12 micron (0.5 mil), 3 sigma with fluids, ±5 micron (0.2 mil), 3 sigma with pulse heat eutectic applications.
Placement of the die in relation to a previously placed die can also be tightly controlled through custom automation algorithms.
Machine base is a honeycomb core optical table that provides vibration damping and thermal settling response. Large work area. Cantilever design permits unobstructed, open access on three sides for set-up. Soft touchdown or non-contact laser height sensing mechanisms assist in pickup and placement of fragile devices. Eight-position turret head can rapidly change tools on the fly without a tool dock assembly. Constructed from an optical breadboard where parts can be bolted down in a myriad of configurations, so any form of presentation such as expanded wafers, waffle or gel packs, tubes, or tape and reel may be used and options for up to three dispensers, hot rails, heat cure stations, hot gas, UV fluid curing systems, and more can be incorporated.
Has infrared light curtain around the open perimeter of the assembly cell. This sends an infrared signature down each inch of the perimeter so that it cannot be fooled by background thermal radiation. When the system is in operation and the safety curtain is violated, the system immediately (within ~ 3 millisec.) shorts the inputs to the digital servo driven motors, stopping all motion.
Uses Windows XP.
Palomar Technologies, www.palomartechnologies.com
EPM-2493 low-viscosity, thermal interface material meets the challenges of the high-temperature and high-stress operating conditions in electronic packaging. Low outgassing property is ideal for situations, such as electro-optic systems, in which contamination is a concern. Low viscosity provides an easy-to-dispense material that flows easily through dimensionally intricate electronic configurations.
NuSil Technology, nusil.com
NuSil Technology, nusil.com
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