Products
Model 2200-245-051 Tip-Seal dispense valve is for precision dispensing of low- to high-viscosity flowable materials. It is also used in high-speed stitching or repetitive on-off applications where short segments of material are deposited onto a surface.
The zero-cavity design helps dispense solvent-based, moisture-curing and stringy materials such as silicones or polyurethanes. Sealing at the tip prevents material from hardening in the nozzle, oozing or dripping. The valve opens and closes its material passage at the tip of the nozzle to precisely start and stop material flow.
Pneumatically actuated, the valve has a carbide tip, titanium-coated shaft, hardened seat and wear-resistant fluid seals to extend valve life. The stroke adjuster can set the needle opening to change material-flow rates and bead-profile sizes.
The valve’s precision dowel and screw holes allow easy and accurate mounting. The 0.125” orifice and short 0.32” tip length (8.1 mm) enables the valve to reach into parts and fixturing. Other orifices and tip lengths are available. Material is delivered to the valve by either a metering assembly or under regulated pressure from supply tanks or pumps.
The zero-cavity design helps dispense solvent-based, moisture-curing and stringy materials such as silicones or polyurethanes. Sealing at the tip prevents material from hardening in the nozzle, oozing or dripping. The valve opens and closes its material passage at the tip of the nozzle to precisely start and stop material flow.
Pneumatically actuated, the valve has a carbide tip, titanium-coated shaft, hardened seat and wear-resistant fluid seals to extend valve life. The stroke adjuster can set the needle opening to change material-flow rates and bead-profile sizes.
The valve’s precision dowel and screw holes allow easy and accurate mounting. The 0.125” orifice and short 0.32” tip length (8.1 mm) enables the valve to reach into parts and fixturing. Other orifices and tip lengths are available. Material is delivered to the valve by either a metering assembly or under regulated pressure from supply tanks or pumps.
Sealant Equipment & Engineering, sealantequipment.com
ENVIRON provides web systems for managing WEEE compliance for business products, and the group has launched a new customer relationship module.
Hosted on the company’s Website, the system enables companies to gain feedback from its customers on product satisfaction and after-sales service. Customers wishing to use the WEEE collection and recycling system are required to complete a marketing questionnaire which is emailed to the company. As part of the questionnaire, customers are required to enter valid model numbers to use the system.
The WEEE web system:
Provides a single contract to manage producer registration, in-country recycling, and compliance reporting in all Member States;
Provides straightforward collection arrangements, which the company can communicate to business end-users through their own company website;
Offers a single corporate solution that can be expanded to cover other countries;
Includes the option to pass collection costs on to business end-users;
Provides flexibility and control of future WEEE recycling arrangements, enabling companies to ensure that recyclers continue to provide competitive rates for their services, and change recyclers in individual Member States to take advantage of new recycling technologies and techniques;
Demonstrates to customers that the company is compliant with the WEEE Directive and has addressed its environmental responsibilities.
ENVIRON, www.b2bweee.com
Hosted on the company’s Website, the system enables companies to gain feedback from its customers on product satisfaction and after-sales service. Customers wishing to use the WEEE collection and recycling system are required to complete a marketing questionnaire which is emailed to the company. As part of the questionnaire, customers are required to enter valid model numbers to use the system.
The WEEE web system:
Provides a single contract to manage producer registration, in-country recycling, and compliance reporting in all Member States;
Provides straightforward collection arrangements, which the company can communicate to business end-users through their own company website;
Offers a single corporate solution that can be expanded to cover other countries;
Includes the option to pass collection costs on to business end-users;
Provides flexibility and control of future WEEE recycling arrangements, enabling companies to ensure that recyclers continue to provide competitive rates for their services, and change recyclers in individual Member States to take advantage of new recycling technologies and techniques;
Demonstrates to customers that the company is compliant with the WEEE Directive and has addressed its environmental responsibilities.
ENVIRON, www.b2bweee.com
SEFAR LDS is a laser technology stencil imaging machine for small format screen printing applications. With imaging capabilities between 1700 and 2400 dpi, it reportedly creates precision stencils that adhere to high quality standards, perfectly placed on each screen to ensure consistent color-to-color registration.
Available in two configurations: 1330 (max. screen size 15.5 x 17.5 in. – developed for the optical disc market) and 4060 (max. screen size 25.5 x 27.5 in.). Both systems are said to increase productivity (by removing several prepress steps from stencil making through on-press registration) and reduce costs by eliminating time and expenditures associated with conventional film imaging processes.
Sefar Printing Solutions, sefar.us.
Available in two configurations: 1330 (max. screen size 15.5 x 17.5 in. – developed for the optical disc market) and 4060 (max. screen size 25.5 x 27.5 in.). Both systems are said to increase productivity (by removing several prepress steps from stencil making through on-press registration) and reduce costs by eliminating time and expenditures associated with conventional film imaging processes.
Sefar Printing Solutions, sefar.us.
Christopher Associates announced significant breakthroughs in performance of the NSpec AOI system. With a universal data converter, an enhanced and extensive parts library, and significant performance improvements, programming/debugging time has been reduced by 50% or more depending upon program specifics. Inspection speeds have improved and defect detection capabilities have also been enhanced. The programming speed improvement can be applied to all 3,500 NSpec systems in the field by a simple software update.
Using LED lighting and a telecentric lens with a high resolution color camera, the latest model, the DL, can inspect components, solder joints, full color inspection, 2-D solder paste, text, and 01005 components.
Christopher Associates Inc., christopherweb.com
Using LED lighting and a telecentric lens with a high resolution color camera, the latest model, the DL, can inspect components, solder joints, full color inspection, 2-D solder paste, text, and 01005 components.
Christopher Associates Inc., christopherweb.com
Thermo Electron’s NITON Analyzers business unit has released new software with additional features and benefits to assist with RoHS compliance.
NITON Analyzers are portable x-ray fluorescence (XRF) instruments for on-site, nondestructive RoHS screening. Used for testing of polymers, solders and electronic components for RoHS, ELV and WEEE compliance verification screening. Supply easy-to-use and reliable onsite screening and material analysis.
Version 5.1 analyzer software includes an advanced thickness correction for improved direct analysis of polymer materials. For several years, the RoHS analyzers have been used to quantify
restricted elements in plastic matrices down to 5 mm thickness. However, though semi-quantitative testing was done directly, very thin samples typically required folding or layering in order to provide the best analytical results possible. The Thickness Correction algorithm provides the ability to compensate test results for even ultra-thin plastic materials. Is straightforward and easy-to-use.
The new software features six language options, improved analytical accuracy and element additions to already extensive calibration matrices.
Version 5.1 is currently shipping on all new instruments, and is a free upgrade to customers with existing compatible analyzers.
NITON Analyzers are portable x-ray fluorescence (XRF) instruments for on-site, nondestructive RoHS screening. Used for testing of polymers, solders and electronic components for RoHS, ELV and WEEE compliance verification screening. Supply easy-to-use and reliable onsite screening and material analysis.
Version 5.1 analyzer software includes an advanced thickness correction for improved direct analysis of polymer materials. For several years, the RoHS analyzers have been used to quantify
restricted elements in plastic matrices down to 5 mm thickness. However, though semi-quantitative testing was done directly, very thin samples typically required folding or layering in order to provide the best analytical results possible. The Thickness Correction algorithm provides the ability to compensate test results for even ultra-thin plastic materials. Is straightforward and easy-to-use.
The new software features six language options, improved analytical accuracy and element additions to already extensive calibration matrices.
Version 5.1 is currently shipping on all new instruments, and is a free upgrade to customers with existing compatible analyzers.
Thermo Electron Corp., thermo.com
SHELLCASE CF is a wafer-level technology for optical components integrated into electronic products such as miniaturized cameras in camera phones, digital still cameras and video camcorders.
Suitable for image sensors, certain types of MEMS and other optical devices, it protects components from contamination from the initial stage of processing and is compatible with conventional Chip-on-Board (COB) assembly processes.
An immediate application is for CMOS and CCD image sensors used in camera phones. Said to provide up to 40% improvement in yield over existing COB technology. This is realized through the protection of the sensor's active area from contamination and the ability to perform wafer-level image testing prior to module assembly, both of which improve camera module yield and reduce overall cost.
Uses existing wire-bond assembly infrastructure and processes, minimizing the hurdles to rapid adoption.
Unlike COB technology, it encapsulates the image sensor, MEMS or other optical device with a glass cover that is elevated from the silicon surface using cavity walls. The cover design leaves the image sensor bond pads exposed allowing for standard wire-bond assembly. The protected die is then singulated and mounted to the board using standard die attach processes. Provides the flexibility to perform optical testing at the most favorable point of the assembly flow, as defined by their specific requirements and manufacturing environment.
Tessera, tessera.com
SEMICON West, Booth 8622
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