GÖPEL electronic and SPEA have developed a boundary scan option for the Flying Probe Tester (FPT) 4040 within the scope of an OEM agreement. The solution is based upon the integration of the Cascon Galaxy software and Scanflex hardware into the flexible Flying Probe test system, involving the FPT probes to extended the Boundary Scan tests.

“Combining the capabilities of SPEA Flying Prober with GÖPEL electronic JTAG/Boundary Scan solutions offers significantly higher test throughput due to optimised use of tester resources, applying the most efficient test technology for specific board structures,” said Bettina Richter, marketing and international sales manager for GÖPEL. “The possibility to reuse existing Boundary Scan applications for testing and programming Flash components or PLD, makes this solution very attractive due to a short ROI for CMs.”

The integration is based on the Scanflex USB/LAN controller models SFX/USL1149-x with TCK frequencies of 20MHz (A type) or 50MHz (B type), respectively. The JTAG test bus connection to the Unit Under Test is realized with a Scanflex transceiver model SFX-TAP4/CR, which provides four parallel TAPs with interposing relays and up to eight programmable interface parameters for the optimal adaptation to the UUT, connected to the standard interface of the Flying Prober. The distance between TAP-Transceiver with CION interface and UUT can be up to 1.5 m., without the need for additional signal conditioning. The flying probes extend boundary scan test coverage and are controlled by the native pin electronics of the 4040, requiring no extra driver/sensor circuitry.

The software development and execution environment has been integrated into the Flying Prober's operating system Leonardo via the CAPI interface. The test vectors' link to the Flying Probes is managed through Hyscan, which enables the synchronisation of serial JTAG/Boundary Scan test vectors with parallel test vectors. The parallel vectors are linked to the physical I/O interface at run time, providing tester hardware independence. The flying probes make up this physical I/O interface.

The automated or manual generation of test vectors, debugging and fault diagnostic is done with JTAG/Boundary Scan tools. Each Flying Probe acts as an additional bidirectional Boundary Scan pin at the contacted net. Data handling is done automatically.

GÖPEL electronic, www.goepel.com
SPEA, www.spea.com

Red-E-Set Green RoHS-compliant support tooling is designed for manufacturers concerned with cross-contamination when support tooling is used in both processes on the same production line. Guarantees that residual leaded solder paste on the support tooling will not be re-deposited on a Pb-free board.  Screen printers and automated placement machines often face this dilemma.
 
“With the new lead-free requirements, manufacturers are faced with the challenge of running both the leaded and lead-free processes at the same time to remain competitive and productive,” said Tom Gordon, chief engineer. “Red-E-Set Green allows operators to continuously monitor for cross-contamination by separating materials and using the color green to differentiate between the lead-free and leaded product runs. This color identification enables line and floor operators to easily discern what products and materials they can safely use in the lead-free process.”
 
Production Solutions, production-solutions.com

Endicott Interconnect Technologies will exhibit semiconductor packaging solutions at Semicon West, July 10-14, at booth, #5484C in the NY Loves Nanotech pavilion.
 
Semiconductor packaging offerings include HyperBGA, CoreEZ and Wire Bond PBGA. EI will also showcase its PCB fabrication, first- and second-level assembly solutions.
 
HyperBGA is a flouropolymer-based, organic flip-chip package for high performance applications where speed, reliability and increased signal I/O, along with reduced weight and package size, are critical. This low stress flip-chip laminate package is suited to graphics applications that require high data processing speeds or any application requiring a system-in-package approach.
 
CoreEZ uses the HyperBGA manufacturing platform to offer organic, thin core build-up, flip chip technology that combines electrical, reliability and wireability performance with cost effective materials and processes. For applications requiring low-cost build-up materials with high performance, or for aerospace applications requiring radiation tolerance.
 
To expand the market place for CoreEZ, EI entered into a Memorandum of Understanding with Meadville Technologies Group to produce the organic substrates at their Shanghai Silicon Platform facility; qualification builds are currently underway.
 
Wire Bond PBGA offers electrical performance and material properties that are matched to the PCB, to deliver high performance and field reliability. The chip-up design is economical and targets lower power applications while the cavity package provides thermal performance.
 
Endicott Interconnect Technologies, www.endicottinterconnect.com

Dage will exhibit two of its developments in x-ray inspection and bondtesting technology at Semicon West on July 10-13. On display will be the XiDAT XD7600NT digital x-ray inspection system with a new computerized tomography (CT) option, and the enhanced 4000HS high-speed bondtester.
 
The CT option further refines the system with volumetric measurement of solder joints. CT capability is available as an option with new systems and is suited for analysis of solder interconnections such as stacked die, MEMS, package-in-package and package-on-package.
 
The Bondtester is the result of considerable research as part of a U.S. consortium and detects brittle fracture failures in the ball-to-pad interconnection of Pb-free semiconductor devices. Its capabilities have been further enhanced with digital transducer signal processing, force versus displacement (FvD) curves and fractional energy calculation.
 
Dage Precision Industries, dageinc.com.  
Semicon West Booth 7315