Corelis has added direct I2C and SPI-based device programming capabilities for the ScanExpress Boundary-Scan System that employs JTAG controllers. SPI and I2C interfaces are independent of the JTAG test interface; the user can use the same JTAG controller to test the board and perform direct programming of serial EEPROM and flash memories without removing the JTAG connector or switching to a dedicated SPI and I2C programmer.
 
The user needs only to enable the direct programming option on the Test Programming file Generator (ScanExpressTPG) to create the SPI and I2C programming files. The programmer automatically detects the file type and programs the device using either the SPI protocol or the I2C.
 
Serial FLASH/EEPROM devices can be programmed at speeds up to the device theoretical programming time. This typically 10 times faster than programming the devices indirectly using JTAG. Programming capability allows versatile I2C and SPI device access.
 
Customers can upgrade their old controllers to include the new direct programming feature.
 
Corelis, corelis.com

Easyteach is a software tool that makes selective soldering set-up fast and simple. An operator uses a simple graphic image of the assembly – a JPEG or flat scan – to program the soldering sequence for any assembly in a matter of minutes with a few mouse clicks.
 
Anyone who can use a photo-editing program, or layout a newsletter, can master ‘Easyteach’. No specialized CAD tools, sophisticated training or computer programming abilities are needed. Begins with a simple graphic image of the PCB that will be soldered. The user selects fluxing and soldering points on the image, clicks to mark the fluxing and soldering points, and the program automatically sets up the fluxing and soldering sequence in minutes.
 
Sets of sequences can be copied or duplicated for multiple boards, and the program automatically calculates the path and sequence for the soldering points. The operator marks the sites to be soldered and indicates the board’s outer dimensions.
 
Part of mySelective 6745, an in-line capable, compact, modular selective soldering system for medium volume, high-mix assembly. Features precision flexible robotics, optimized product handling and a compact footprint. Preheat modules and fluxing units can be added. Incorporates an IR preheating module, dropjet fluxer and SelectWave nozzle.
 
Vitronics Soltec, vitronics-soltec.com
 

AkroMetrix will display its latest product, the LineMoiré automated flatness measurement system, Model J5000, at Semicon West booth #8301. 
 
The high-speed, full-field shadow moiré technique allows for flatness measurement of chip-carriers/substrates, packages and ICs in JEDEC (or similar) trays. Can measure the full contents of a tray simultaneously (with one-sec. data acquisition time per tray), has integrated tray stack/destack and part sorting capabilities. Can measure stacks of trays, replace “bad” parts (i.e., parts that fail a user-specified warpage specification) with known good parts, and then stack good and bad trays separately. This is important for incoming/outgoing inspection of parts.  Enables flatness characterization before any value added processing is performed.
 

COMET has added an upgrade to its Feinfocus Cougar X-Ray platforms: Computerized Numerical Control (CNC). This enables operators to program and automate x-ray inspection procedures, as well as perform 2-D measurements of hidden details during failure analysis without the need for calibration.
 
CNC provides numerous benefits, facilitating an efficient failure analysis process. With the ability to program the manipulation system of the platform, CNC can automatically position the optical overview camera in the optimal position for inspection. Operators can even program the entire inspection process with CNC, including x-ray parameters and image processing, eliminating costly variables associated with manual control. User-friendly “teach-in” buttons enable easy programming.
 
The platform provides x-ray inspection for a range of inspection needs, from 2-D failure analysis of manufacturing components to advanced 3-D imaging of complex BGA and wafer-level packages. Has a small, ergonomic design, small footprint (approximately 1 m x 1 m), low system weight (approx. 1,450 kg) and convenient front- and side-door service access. Includes a microfocus x-ray tube up to 160 Kv, standard 5-axes manipulator with Auto Isocentric Motion (AIM) Technology for oblique viewing, CNC Capabilities, HDX-Ray real-time 16-bit image processing, digital flat panel detector and a hardware-driven anti-collision system.