KIC will showcase its 24/7 Process Monitor at the upcoming Nepcon South China exhibition and conference in Shenzhen.
24/7 Process Monitoring brings automation to the thermal process: Automatic profiling of each product, around-the-clock monitoring, SPC charting, analysis, documentation and production traceability -- all in a single, intuitive product. Continuous tracking occurs in the background, never interrupting production. Real-time process data enables engineers to make crucial cost containment and quality control decisions.
Uses custom probes installed inside the oven at the product level to gather and record real-time thermal process data for every product. Automatically charts all critical process specs: peak temperature, soak time, time above liquidous, etc. The data is plotted on real-time control charts and process capability (Cpk) is calculated for each specification. The overall process window index (PWI) is charted, providing a real-time Cpk for the entire process. Any process drift outside of control limits or defined Cpk value will immediately trigger an alarm. Real-time Cpk tracking provides a zero-defect, fail-safe system that automatically identifies potential defects before they occur.
3-D engineering models for all DEK printer subassemblies can now be downloaded over the Internet, allowing machine owners to examine components in detail without taking a machine offline, and to verify and order new parts or upgrades quickly and easily.
The 3-D Find-a-Part service is free to all DEK machine owners, and is accessible 24/7 via the secure technical support account pages at www.dek.com.
Models are the actual CAD models used by DEK engineers, and are accurate, fully detailed and up to date. Customers can rotate the models in three axes, measure dimensions, zoom in or zoom out, isolate and inspect individual sub-components, and find part numbers using context sensitive keys. Price and availability, as well as online ordering, are also supported.
Because of the large file size for each model, DEK has installed extra, dedicated Internet infrastructure to support the service, so customers can view any model on screen in the time it takes to download the file.
“This service is valuable for customers needing to quickly inspect any subassembly or optional unit, such as a print head or underscreen cleaner, and also streamlines ordering of replacement or upgrade parts,” said Jon Howell, Customer Service Group manager. “As well as providing a more powerful troubleshooting solution than hard copy general assembly drawings, customers no longer have to spend time describing a required component to DEK sales or support staff. Examining a component and finding the part number now requires just a few simple mouse clicks.”
Servo-Flo 305 System is a mid-sized shot meter for robotic and automated dispensing applications such as bonding, gasketing, filling and sealing operations. The robust positive rod displacement and servo-motor design will dispense abrasive and filled one-component adhesives and sealants such as epoxies, silicones, urethanes and mastics.
Delivers a precise flow rate of material to a Snuf-Bak, Tip-Seal or No-Drip dispense valve for accurate start-stop of material flow. Can be floor-, pedestal- or robot-mounted for automation or manual applications. System-design selections include meter-volume size, material-temperature control, operator interface, dispense valve, material supply and system integration.
Closed-loop processor ensures precise shot volumes, consistent bead diameters and variable bead diameters during the dispense cycle. Using the touch-screen interface, the operator sets flow rates and materialvolume and the automation selects stored flow-rate and shot-volume programs for different parts.
The Solder Paste Group of EFD and Leister Technologies will jointly market an automated tabletop solder paste reflow system.
The soldering system combines EFD’s auger valve and Ultra TT tabletop dispensing robot with Leister’s Novolas diode laser. Uses EFD’s SolderPlus solder paste. The solder paste formulations available are fast, clog-free and designed to support the sub-second reflow cycles times common with laser heating.
The package system includes SolderPlus paste, the Ultra TT robot, EFD ProcessMate 6500 temperature control system and the diode laser, all housed in a laser-safe certified cabinet. These system components can also be bought individually.
EFD and Leister have aimed the marketing of their system at users requiring discreet, precise, rapid heating and controlled non-spatter high-yield solder performance.
The package is ideal for processes requiring non-contact point-to-point soldering of temperature-sensitive parts, especially component manufacturers serving the automotive and medical industries. Heat damage to temperature-sensitive plastics is said to be eliminated with the system.
SP003 semiautomatic stencil printer is now available as SP003-V with vision for faster control and alignment correction.
Features trans-stencil vision, a motorized print head and vertical stencil separation. Can accommodate stencils or screens up to 29 x 29".
Said to achieve precise printing by controlling all important print parameters including squeegee pressure, angle of squeegee, print speed, stencil position and stencil separation after printing.
Available with different print mounts, giving it numerous applications ¾ vacuum table, groove table, flat table or magnetic table. The magnetic table is used mostly with single- and double-sided boards, and is flexible.
Easy to operate and control, for small- and medium-volume production. Print alignment is accomplished by clearance-free, fine-pitch thread screws, and other print parameters can be adjusted on the front panel.
Designed for stencil printing, screen printing, print/print, print/flood and flood/print; can print a max. of 400 x 410 mm, features two cameras (both adjustable) and is 700 x 800 x 500 mm (without optional substructure).
NITON XLt 898He is a nondestructive portable analysis tool for light element content in alloy material. Provides fast, laboratory-quality chemical analysis of light element content in aluminum and titanium alloys, as well as nickels, superalloys, stainless steels and more.
NITON X-Ray Fluorescence analyzers quickly and reliably provide accurate alloy material verification.
System fills the interior of the measurement head with pure helium, purging atmospheric air from the x-ray analysis path, and allowing light element x-rays to contact the high-resolution x-ray detector. As a result, operators can measure light element alloy content with the same analyzer that they use to test high-temp alloys.