Apex Expo 2012 Products
DE-7826 (dam) and CE-7826 (fill) dam and fill chip encapsulants are for chip-on-board applications. Are designed to protect wire bonds and reduce stresses associated with thermal cycling. Are engineered to withstand circuit board reliability test criteria. Have thermal expansion coefficients in the 20ppm range when measured by thermal mechanical analysis. Have high glass transition temperatures and modulus to retain low expansion properties throughout operating temperature range of the circuit board. Meet standards for ionic cleanliness.
Engineered Material Systems, www.conductives.com
LF-Z3 PF-14 D3 is a SnZn paste designed for reducing Ag-erosion such as silver pad. Has peak reflow temperature of approximately 225°C. Has high reactivity; flux medium with activation control is required. Is designed to maintain a stable viscosity during storage to preventing any degradation of paste. Is halogen-free.
Nihon Superior, www.nihonsuperior.co.jp/english
SN100C7A is a high melting point Pb-free solder alloy. Is an extension of SN100C; provides benefits of nickel-modified microstructure with minimal growth of interfacial intermetallic. Can be applied to assembly of power modules that require a high melting point alloy.
Nihon Superior, www.nihonsuperior.co.jp/english
SN100C P810 D4 is designed for use in vacuum reflow with nitrogen. Is a high-reliability no-clean Pb-free solder paste optimized to deliver excellent reflow characteristics; generally can be reflowed with a profile similar to that commonly used with SAC 305 and SAC 405 with 240°C peak. Reduces voiding to less than 1% in measured void area. Has excellent wetting behavior. Is a compliant alloy that provides high-impact strength.
Nihon Superior, www.nihonsuperior.co.jp/english
FX SL AOI inspection system reportedly has more than twice the inspection speed of previous generation systems. Magnification options include 8, 12, and 25 µm/pixel. Delivers automated inspection of solder and lead defects, component presence and position, correct part, polarity and through-hole parts. Is well suited for high-volume and high-mix manufacturing environments; is capable of inspecting 01005 components. Uses a standard package library.
Nordson YESTech, http://www.nordson.com/en-us/divisions/yestech/pages/default.aspx
ProDEK dynamic print process control is said to enable real-time continuous alignment adjustments and cleaning frequency adaptation to enhance throughput and yield and limit operator intervention. Uses paste offset (alignment) data feeds from the SPI to monitor a configurable quantity of PCBs, sending an independently corrected forward and reverse offset to the printer, which then adjusts paste on pad alignment in real-time. Using barcode tracking technology, guarantees printed and inspected board synchronization. Monitors high area warning counts from SPI data feeds, as potential indicators of excessive or insufficient understencil cleaning. Automatically adapts cleaning frequency to suit current process conditions, optimizing understencil cleaning and introducing more stability while significantly reducing consumables usage. Retrofittable to DEK printers, and compatible with CyberOptics, Koh Young and Parmi SPI.
DEK, www.dek.com
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