Apex Expo 2012 Products
NC259 solder paste is Pb-free and halogen-free. Reportedly offers the performance of SnPb and high-silver Pb-free solder pastes. Has the ability to eliminate head-in-pillow failures.
AIM, www.aimsolder.com
PXI 1149/DAK is a mass interconnect interface within the frame of Scanflex boundary scan hardware. The option for the SFX/PXI1149/Cx controller is compatible with SCOUT, the mass interconnect system from MAC Panel. Can now combine JTAG/boundary scan with PXI connectivity solution from MAC Panel. Is available in two versions: PXI 1149/DAK2 has a differential test bus with 200 pin receiver and single-ended PIP resources; PXI 1149/DAK1 has a single-ended test bus with 96 pin receiver, as well as single-ended PIP resources. Is an option for the SFX/PXI1149/Cx and SFX/PXIe1149/Cx controller. Both mass interconnect interfaces are also available as a variant supporting Direct Access Kit-Extended version. Fully supported by System Cascon software.
Goepel electronic, www.goepel.com
A custom fit tooling solution for Mydata E series pick-and-place equipment is available. Eliminates the need for tooling setup and dedicated fixtures. Provide a 13mm bottom-side clearance. Reportedly overcomes a previous limitation in regard to a low tooling pin stroke and subsequent inability to accommodate tall components on the PCB bottom-side. Can be installed in about an hour and a half. Is operated by pressing one button in manual mode or hands-free in the automatic mode. May be reconfigured to support nearly any PCB in seconds.
Quik-tool, www.quik-tool.com
LabelScan handheld automated vision system can take a single image of all the fields on a supplier barcode label. Features an advanced algorithm to recognize different fields of data and transfer this data in a suitable format to any application used for receiving materials, such as an MES, MRP or ERP.
Cogiscan Inc., www.cogiscan.com
A test board for the dummy (mechanical sample) version of Amkor’s 0.3mm pitch CVBGA is available. CVBGA368-8mm Evaluation Board is for testing, evaluating and qualifying fine-pitch technology. Board size is 77 x 132mm, 1mm thick, and features four layers with 15 pads. Is offered with OSP, ImAg, and ENIG finishes. Is 8 x 8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is identical to live package without IC die inside.
Practical Components, www.practicalcomponents.com
Ablestik ICP-3535M1 one-component, pre-mixed electrically conductive adhesive provides low and stable contact resistance when used with 100% tin-terminated components. Offers lower temperature processing, lower stress assemblies and regulatory-compliant Pb-free formulations. Attaches to a variety of substrates, including low-temperature co-fired ceramics, high-temperature ceramics, and OSP-finished printed circuit boards. Reportedly maintains stable contact resistance and good mechanical integrity after 3,000 hrs. of temperature and humidity testing, 3,000 cycles of thermal shock evaluation, and 3,000 hrs. of heat storage.
Henkel, www.henkel.com/electronics
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