Koki S01X7C48-M500 low silver alloy solder paste offers good melting and wetting (<0.3mm dia CSP 0603 chip) and fine-pitch, low-halide content (CL+BR<1500ppm). Is said to have excellent printability and process parameters.

Koki, http://www.ko-ki.co.jp/top.html
Christopher Associates, www.christopherweb.com

Fino semiautomatic printer with vision is for small to mid-size volumes. Has intelligent control and the possibility for alignment per two vision cameras. Has a 450 x 500mm printing area. Accepts any size stencil frame up to 23 x 23" and offers quick changeover.

Essemtec, www.essemtec.com

QX100 is equipped with AI2 image analysis software; reportedly provides superior defect detection capabilities, low false call rates, and improved clarity of defect identification. Is capable of inspecting component sizes down to 01005. Provides a 90% reduction in examples. Is for high-mix printed circuit board assembly; can be adapted to high-volume production modes.

CyberOptics, www.cyberoptics.com

SN100C (551CT) Pb-free solder combines the benefits of SN100C alloy with a sustained activity cored flux. Is formulated for use with soldering tip temperatures up to 380°C, while still retaining sufficient activity to ensure good tip separation. Stable microstructure accommodates long-term cyclic strain and impact loading to which solder joints can be subjected in service. For sequential soldering and rework. 

Nihon Superior Co. Ltd., www.nihonsuperior.co.jp/english