Loctite Multicore HF 212 halogen-free, Pb-free solder paste is under the limit of detection for chlorine and bromine. Reportedly has consistent print performance and minimal hot slump, even at temperatures that exceed 86°F and relative humidity as high as 80%. Exhibits low voiding in CSP via-in-pad joints, good coalescence, and solderability over a range of surface finishes, including NiAu, immersion Sn, CuNiZn, immersion Ag and OSP copper. For use on components with pitches of 0.3mm and greater; is ideal for larger boards used in industrial, networking and lighting applications.

Henkel, www.henkel.com/electronics

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