A solution for flux-free formic acid reflow?

Growing performance demands for power electronics systems, driven by rapid advancements in application areas such as electric vehicle (EV) technology, present challenges for module design.¹ With increased junction temperatures, current densities and complex thermal packaging solutions, engineers must improve reliability through the design phase and material selection process. This requires constant optimization of the power module design and process flow to produce effective and reliable solutions. For successful power electronics applications, however, the production process is equally as critical as the design to achieve the required quality and cost target. One key element is the use of tooling as it affects the design (e.g., distance and tolerances between dies) and manufacturing processes (cycle time, quality and costs). Process advancements of high-quality reflow techniques with vacuum and formic acid have proven effective to achieve reliability targets,^2,3 but the focus is shifting toward scalability and efficiency to bring up production levels that meet the aggressive needs for these new applications. Due to the constantly increasing power densities in power modules, soldering processes that avoid use of additional flux are becoming more important. The upfront cost in development of processes, unique equipment, and dedicated fixturing to achieve quality is a growing concern that presents both a significant financial burden as well as a time-to-market impact for power module manufacturers introducing new designs.

The path to digitize a factory is both closer and cheaper than most engineers realize.

Reshoring has been a buzzword for a few years now. But when supply chains are undergoing dramatic disruption and inflation is raging worldwide, what is the reality?

According to research firm IDTechEx, it’s only a matter of time before an array of sensors and cobots spur far greater automation and flexibility. The firm recently published a white paper titled “Factory of the Future” that summarizes the expected advancements. Indeed, some of these changes are both relatively inexpensive and simple in scope yet open a realm of possibilities for greater process control.

IDTechEx senior technology analyst Matthew Dyson, Ph.D., who co-authored the paper, discussed the key trends in industrial manufacturing and the timeline for adoption with PCEA president Mike Buetow in late July. The following is lightly edited.

Mike Buetow: You just co-authored a white paper titled “Factory of the Future.” Lots of people, of course, are considering what that looks like. What spurred your interest?

Matthew Dyson: It’s the combination of technologies that we see being developed. The white paper is a compelling use case for them. It’s about how you can make manufacturing more efficient to address concerns like reshoring, inflation and so on.

Data-driven processes require IP coordination among vendors – and that means humans.

We hear a lot these days about smart manufacturing, but is there a broad consensus on what it means, and more specifically, its application in electronics assembly? Brian Morrison, vice president of engineering for Vexos, a mid-tier multinational EMS with manufacturing facilities in the US, Canada, China and Vietnam and more than 900 employees worldwide, explains his views on smart manufacturing to PCD&F/CIRCUITS ASSEMBLY in July.

Political and supply-chain issues could not slow printed circuit growth in 2021.

 The author attended his first IPC meeting in 1966. At that time, the consensus was the world PCB output was $500 million. Some “knowledgeable” experts predicted PCB output would dwindle since semiconductors were rising rapidly and PCBs would not be needed. If that $500 million assessment was correct, in 55 years the PCB market grew 192 times, to $96 billion!