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Flexline software is for accurate slide line/assembly documentation.

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Heatwave software is a pictorial representation of an assembly that is updated in real-time as failures are reported to the manufacturing execution system.

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G Series XRF is for analysis of precious metals, tin and nickel on PCBs, wafers, connectors and other electronic components.

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Smart reflow process inspection (RPI) data analytics have been integrated into iTAC.MES.Suite.

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Zestron Eye Mobile monitors concentration of multiple cleaning processes.

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YSP10 solder paste printer has an automatic changeover system.

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