Quadra W8 wafer-level inspection system has integrated dual-port EFEM to protect wafers by removing manual wafer handling, so operators can inspect wafer-level quality directly from FOUP.
Spot-On 1.5 and 2.0 SMT potting wire-to-board connector system improves process capabilities and mechanical reliability, and protects against water damage in white goods products that require a potting system.
CT23NJ PCB Router automated tabletop PCB router comes with Kawasaki duAro dual-arm SCARA robot.
Bergquist Bond-Ply LMS-HD thermally conductive laminate now comes in an 0.018”-thick thermal adhesive that complies with UL standards for reinforced insulation and IEC Class II insulation standards.
CSP-40A-024 and CSP-40G-021 radio frequency (RF) coaxial probes mate to a variety of industry standard connectors such as MMCX, Fakra, SMB and U.FL.
C 200 pneumatic tabletop crimp press takes a variety of dies from different manufacturers.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing