Solderstar SLX Thermal Datalogger now comes with a new extension to measure vacuum level in a reflow oven.
Test Research Inc.'s TR7500QE Plus 3-D AOI includes a high-speed top camera and four side-view cameras.
Fujipoly America's CF210A thermal gap filler incorporates carbon fibers along with traditional fillers. Carbon fibers allow for higher thermal conductivity while remaining compliant. Compliance is closer to a much lower conductivity gap filler such as SARCON® PG25A. Has a stable thermal resistance, regardless of compression.
PVA's new Valve Kiosk Stand for trade shows features 18 valves that cover an array of applications including dispensing, gasketing, conformal coating, thermal interface material, underfill, jetting and potting.
Also features three 15.6” touch screen interfaces with an interactive user interface. Includes removable valves for closer inspection and in-depth breakdowns of each valve: Overview, X-ray, Operation, Applications & Dispense Patterns. Customers can navigate by Industry, Application, Valve type or “Request Help." Dispensing can extend across numerous industries and applications that require dosing in an accurate and controlled manner.
PVA
Mycronic's Iris 3D AOI features a new generation of laser scanners, image sensors and computing systems to improve test coverage while capturing nearly twice as many pixels at speeds up to 30% faster than previous technologies.
Master Bond EP5TC-80 is a one part, NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Requires a cure at only 80°C for 1.5 to 2 hours. Features a thixotropic paste consistency and adheres well to a variety of substrates such as metals, composites, glass, ceramics, and many plastics. It is formulated for bonding, sealing and small encapsulating applications.
Electrically insulating, with a volume resistivity greater than 1014 ohm-cm. Features a low thermal resistance of 6-10 x 10-6 K·m2/W and can be applied in very thin sections due to its ultra-fine particle filler. High strength system has a tensile modulus exceeding 1.5 million psi, and a compressive strength ranging between 25,000-27,000 psi.
Exhibits good dimensional stability with a low shrinkage upon cure, a Shore D hardness of 90-100, and an elongation of 0.5 to 1.5%. Serviceable over the temperature range of -50°C to +150°C and has a glass transition temperature of 110-115°C. Available in 3cc, 5cc, 10cc and 30cc syringes and ships in dry ice.
Master Bond
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association