Loctite Ablestik ICP 2120 electrically conductive adhesive cures at room temperature, improving yield rates and protecting sensitive structures within mobile device compact camera modules (CCMs).

Indium Corporation's PicoShot WS-5M is a water-soluble, halogen-free paste for its Mycronic MY-series jet printers.

Delivers smallest dot volume (6.5nl/dot, 350µm diameter) among pastes in its class, precision deposit (x,y targeting), long usage (syringe life >8 hours), minimal statellites.

Can be used in applications such as jetting into cavities and uneven/warped substrates, high-mix/low-volume stencil replacement, CSP/microBGA solder attach, military and aerospace jetting applications, system-in-package (SiP), camera module assembly where an overmolding step is required, and shield-attach and secondary processing.

Indium Corporation

www.indium.com

Pasternack’s new series of field-replaceable connectors feature frequency coverage to 65 GHz, plus SMA, 2.92 mm, 2.4 mm and 1.85 mm connector options with many pin types, including glass bead feed-through or a tab contact, or a pin in a dielectric.

Assist in easily replacing damaged connectors without accessing sealed components, and EMI gaskets provide shielding against RF interference. Contacts mate with five-pin diameters ranging from 0.009" to 0.036". Two-hole and four-hole flange types make for easy assembly in hard-to-reach areas where flexibility is required.

Pastermack

www.pasternack.com

PF735-EP307 joint enhanced solder paste (JEP) is a low-melting-point epoxy-based solder material for extremely fine-pitch or fine-pad soldering, especially advanced display assembly.