Shenmao's PF606-P276 is an ultra-low void no-clean zero-halogen lead-free solder paste.
BTU International Aurora 200N convection reflow oven has closed-loop convection control, and 200" of heat to support faster line speeds up to 25% faster than those supported by Aurora 150N.
Würth Elektronik USB 3.1 Type-C High-Rise SMT Connector is a 24-pin fully-configured horizontal receptacle for SMT assembly.
Solderstar Reflow Shuttle O2 measurement module is a repeatable verification tool that combines O2 ppm, vibration levels in three axes, vacuum, temperature profiles, and conveyor speed on a single platform.
Master Bond Supreme 17HTND-2 is a toughened epoxy system for bonding and sealing applications.
Identco's VortexID is a wire label system that can place up to 20 labels per minute and operate 24/7.
Press Releases
- K&F Electronics Boosts Production with New Hanwha SMT Line
- Luminovo Appoints SaaS Veteran Clifton Lobo as VP Global Sales to Accelerate International Growth
- Johan Stormlund Joins Inspectis AB as Marketing and Sales Manager, Industrial Applications
- Altus Brings Heller’s Revolutionary Short-Cycle Vacuum Reflow Oven to the UK and Ireland