The new silver ink series exhibits excellent electrical conductivity and good adhesion to a vast array of substrates, particularly those within the LCD market.
Specifically designed to reduce surface and FPC static electricity in smartphone screens, notebook screens, and TV screens. Features wide-ranging capabilities, extended run time with continuous dispensing, no breakage in threads or needles, low temperature properties, excellent storage stability, excellent weather resistance and extremely fast cure time.
Scope of viscosity ranges from 3000 CPS to 20000 CPs with the low viscosity SCPT and SCPW-6 meeting the needs of spray valve dispensing and thin layer applications, whilst SCPH, SCPW and SCP-HV are more suited for needle valve dispensing and low volume shrinkage. Also shows excellent levelling performance with seamless ohmic contact and adhesion with the substrate. After complete cure, demonstrates solid electrical conductivity with volume resistivity at <10 -3 Ω.cm, ensuring swift and effective export of excess electrostatic charge through the system to avoid damage to the display panel. Available in a range of sizes including 5ml, 10ml and 30ml.
Electrolube
ITW EAE's Auto Exit Wing for Electrovert Wave Soldering machines provides automatic adjustment of the laminar wave flow to match the board velocity.
Is said to provide highly repeatable, precisely controlled exit wing adjustment that can deliver up to a 70% reduction in bridging defects and improved topside hole fill. Activated by a recipe-controlled set-point to ensure optimal wave dynamics for every PCB type and application. Fully compatible with all Electrovert UltraFill 4.0 and DwellMax 4.0 nozzles in both Air and N2 Tunnel environments and is field upgradeable.
ITW EAE
Transition Automation's double-edge squeegee assembly for Yamaha YSP SMT printer platforms now has end-anchor points to improve the life of the assembly by preventing the boundary limited bonding that can cause separation. Designed to help end users eliminate machine downtime and repeat process interruption.
Transition Automation
WXsmart soldering platform consists of 2-channel soldering station and includes WXair hot-air module for in-air and vacuum requirements. WXMPS MS smart soldering iron has ergonomic pencil design that fits in operator’s hands, providing precision for small soldering applications under the microscope. Performs pico, micro and ultra soldering.
Nihon Superior's LF-C2 Lead-Free Solder Paste delivers long life in thermal cycling but with a compliance that means that it is resistant to cracking under stress typical with automotive electronics.
Uses calibrated levels of the two key strengthening tools available in solder alloy formulation, stable dispersed particles combined with solid solution strengthening of the tin matrix. With a liquidus temperature of 213°C, can be reflowed at a lower temperature than SAC305 and has a higher shear strength than SAC305. Delivers excellent performance over a wide range of component types and process parameters.
Nihon Superior
Rohm Semiconductor's CSL1901 series of 0603-size (0.6in × 0.3in)/1608-size (1.6mm × 0.8mm) LEDs are optimized for low-light applications for use in indicators and numeric displays in factory automation equipment (i.e., PLCs) and communication control equipment such as modems and routers.
Reduces brightness variations by half and color sifting by 3nm under low-light conditions. Available in a lineup of five colors in 0603 size.
Rohm Semiconductor
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association