X2825 silica-filled board-level underfill encapsulant has a CTE of 26 ppm/°C. Is said to enhance drop and shock test reliability and provide thermal cycle performance. In one trial, thermal cycling of a BGA between -20° and +85°C, an unfilled version, with a CTE of 60 ppm/°C, resulted in first failure at 500 cycles; had no failures after 1500 cycles. Said to be reworkable at temperatures of 170° to 180°C.
Zymet, www.zymet.com
BPM Microsystems, www.bpmicro.com
R6000 halogen-free printer ribbon is for circuit board ID. Comes with a variety of halogen-free polyimide labels. Is environmentally friendly. Reportedly has near identical performance characteristics as existing R6000 ribbons. Contains 45 halogen ppm – bromine and chlorine combined.
Brady Corporation, www.bradyid.com
Q Series 1500 mL cartridges have leak-free mixer connections and self-bleeding Quadro pistons. Are currently available in 1:1 ratio cartridges. Fit all common industry dispensers. Are pressure-tested for safe operation. Are available in polypropylene or Nylon and in 7/8-9 or 7/8-14 threads. Outlets available are side-by-side or cut-off tip.
Sulzer Mixpac USA Inc., www.sulzermixpacusa.com
Two IC thermal detection units for the Aerial flying probe tester detect thermal parameters of ICs under power. Compare temperatures of known good boards to suspect boards, and indicate bad components. Reportedly permit precise thermal measurement of the IC or other components while the part is powered up, even under low-voltage conditions.
Seica, www.seica.com