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Visionscape 4.1 is scalable software for machine vision boards, GigE solutions, and smart cameras. Includes blob analysis, OCR, OCV, barcode, vector and edge algorithms, plus pattern-matching tool Intellifind. Additional tools include color matching and color segmentation. Color matching can be used in high-speed applications such as sorting parts, and color segmentation enables other tools to be applied in a specific color plane. Machine vision jobs developed for a smart camera platform can directly be transferred to a PC-based solution without reprogramming.

Microscan, www.microscan.com

Series 2005 Zebra Carbon Connector connects LCDs to PCBs. Is a high-density, low-resistance elastomeric interconnect device. Has 500 conductive layers per in.; is for densely packed boards such as consumer and hand-held electronics. Exhibits a resistance of 2.37 ohms•in. typically, and operates across a temperature range of -58° to 257°F. 

Fujipoly America Corp., www.fujipoly.com

Loctite PowerstrateXtreme Printable (PSX-P) is a print-friendly thermal management product. Thermal management materials can be deposited using traditional screen and stencil printing methodologies. Is offered in medium dry and extended dry versions. Paste format enables the material thickness to be adjusted as required. Is applied as a paste; once dry, it yields a phase-change pad. Delivers an abandon time of two hrs. minimum. Paste format is ideal for high-speed or high-mix environments. Adaptable to deviations in surface flatness, with the ability to fill any voids with varying thicknesses.

Henkel, www.henkel.com/electronics

The GoSelective light standalone will now be referred to as GoSelective; GoSelective light inline is now called the SelectiveLine to express inline capability and highlight the modular concept, which permits upgrade of a fluxer and preheat modules. Are for high product mix. Feature precise axis system for exact positioning of various workstations, and are capable of handling bare boards or assemblies in carriers up to 500 x 500 mm. Are Pb-free capable. Come with fiducial recognition for automatic PCB alignment, process visualization, and offline teach program. SelectiveLine is for inline operation and may be upgraded individually. Covers three basic modules: the SelectiveLine soldering module, separate fluxer, and preheater; can be arranged individually or as a complete production line. Modules are controlled through a central SPC control unit with a CAN bus system. Drop jet fluxer control monitors fluxer nozzle function and measures flux quantity of each drop.

Seho Systems GmbH, www.seho.de

Mydata Midas replacement nozzles reportedly are direct replacements for OEM nozzles. Are said to be compatible with TP9-1, TP9-2, TP9-3, TP9-4, TP11, TP12, TP18, MY9, MY12, MY15, MY19, and MY100 (SX/DX). Tool range includes the following nozzle types for fine-pitch components: C14, A12, A13, A14S, B12, A23, A24, and C23. Special Midas nozzles include spring suspended tools (A23S, A24S, C23S), MELF tools (A34, B34, B24, B23, C24), flat pipe tools (blade), multi-port tools, ESD ceramic tools, micro thin tools and gripper tools. Cover QFPs to BGAs to 01005s.

Count On Tools Inc., www.cotinc.com

 

LFB-1000 flip-chip bonder handles large-scale ICs.  Capabilities include NCP, chip-on-chip and copper pillar processing.

Shinkawa, www.shinkawa.com

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