TestWay reference coverage analysis tool quantifies and qualifies test coverage for a range of inspection and test equipments. Features probe analyzer, an interactive, rules-based routine to identify possible probe locations based on copper surface. Coordinates access constraints, spacing checks, test points assignment, use of largest probe size, pin offset and bead probes, and company-specific guidelines. Estimates ICT and FPT test coverage based on measurement capabilities of the targeted test equipment. Generates accessibility report that states whether adequate probe locations were identified for each net. Defines the test line and combines ICT or FPT with complementary test techniques, such as AOI, AXI, BST, FPT, ICT, MDA and functional test.
Aster Technologies, www.aster-technologies.com
FR-830 compact hot air preheater is said to deliver consistent heat through closed-loop temperature control, permitting preheating temperature between 300° and 572°F. Optional extension pipe extends airflow an additional 27 mm. vertically and a port to permit the preheating cycle to be activated by remote foot switch or hand switch. Can be integrated with Hakko FR-803B, so the start of the preheating cycle is directly controlled by the FR-803B rework profile. ESD-safe.
American Hakko Products, www.hakkousa.com
Paraquda SMD pick-and-place machine uses new materials for high-speed control. Features short changeover times, an intuitive operation system (Eplace), and an integrated quality management system. Has 210 feeder capacity. Head can simultaneously hold and measure four components. Component range is 01005 up to 4" sq., up to 1" in height. Min. pitch is specified with 0.01". High-resolution fly-by vision system is equipped with latest Cognex SMD image processing technology.
Essemtec, www.essemtec.com
Offline teaching program II software has an XML data structure that enables a bidirectional data exchange; taking solder programs out of the offline teaching program and into the machine and vice versa is possible without further conversions. Differences between the original solder program and the program stored in the machine control system can be displayed automatically. Can process image data from cameras and scans. Automatically eliminates common picture distortions. Offers globally storing periodical process parameters for use with particular solder points or soldering passages when developing new solder programs. After teaching all solder points, the program computes the fastest way to minimize handling. This prospectively computed cycle time is displayed directly.
SEHO Systems GmbH, www.seho.de
NL932 no-clean, Pb-free, halide-free solder paste is said to feature good solderability, improves stencil life, and provide superior cosmetics, especially when using SN100C. Offers print consistency with high process capability index across all board designs. Provides print release down to 0.55 SAR when used with the Slic Stencil. Features excellent wetting on OSP, NiAu, NiPdAu, SN100C and HAL. Displays repeatability and consistency in a wide range of temperatures (65°-85°F) and relative humidity (25-65% RH). Reportedly stencil prints at up to 200 mm/sec.; voiding exceeds IPC Class III.
FCT Assembly, www.fctassembly.com