MaxiReflow process gas cleaning system for reflow ovens is equipped with cyclone technology. Extracts contaminated process gas from all heated zones, leads it through a cyclone and then directs the cleaned gas back to heating area. The temperature inside the cyclone is controlled. By injecting a small amount of water into the cyclone, both liquid and solid residues are washed off and led into an active carbon filter unit. Is configured as closed system.

Seho Systems GmbH, www.seho.de

Vision series convection reflow ovens have new cooling zone designs. Are effective for the homogenous cooling of large thermal mass PCBs. Cooling area in VisionXP is laid out in 2, 3 or 4 stages. Fans in the individual zones, available with separate speed/volume control, can cool Pb-free processed PCBAs to below 50°C.  Bottom-side cooling configuration now available. The design is useful for uniformly processing thick PCBs, workpiece carriers, and PCBs with unevenly distributed copper innerlayers.

Rehm Thermal Systems, www.rehm-group.com

Condor EZ bond testing solution offers multiple test capabilities. Standard bond testing applications include wire pull, ball shear, die shear; also has capability to perform peel testing, push testing, and roller testing. All tests can be done on one test head; features four different measurement sensors. Can perform mechanical shock testing by changing the test head for impact testing or ribbon peel testing of photovoltaic cells by using USB tweezers. Joysticks move the X-Y stage to the desired position and feature 12 logically arranged buttons. Software features onboard graphics and intelligent wizards.

Xyztec, www.xyztec.com

V-M.O.L.E. solar profiling kit is photovoltaic solar cells metallization. Combines elements of legacy profilers with adaptations for metallization’s special requirements. Comes with the V-M.O.L.E. thermal profiler; special solar thermal barrier, which is 0.7" in height, MAP software; and special thermocouples. Includes OK button. The three-channel profiler provides quick-charge capability to go from dead-to-profiling in fewer than 15 min. Can quickly program key parameters and control limits into memory. Configurable report page offers more than 180 customizable data extractions. Steel enclosure is a 0.7" x 3.1" x 9.3". Alloy stainless steel sheathed thermocouples are 0.020" diameter x 12" Type-K with standard mini-connectors and can handle temperatures up to 1150°C.

ECD, www.ecd.com