Circuits Assembly Online Magazine - Features

XPM3i reflow system has an enhanced atmosphere recirculation system said to deliver nitrogen savings of up to 50%. Can be equipped with dual-lane, dual-speed conveyor option for high-mix processing. Includes new software features. Is equipped with AUTOset fast setup; makes it possible to accelerate process development by generating a preliminary reflow recipe based on PCB assembly’s physical characteristics. Can fine-tune preliminary recipe if needed; 85% of the time, modifications are not needed.

Vitronics Soltec, www.vitronics-soltec.com

Space-Saver BNC connector mounts on the edge of a PCB. Provides low profile for applications with tight vertical constraints. Reduces twisting stress on solder joints inherent in BNC connector mating. A notch in the connector slips over PCB edge prior to soldering, forming a tight mechanical fit that transfers majority of rotational energy to the PCB instead of solder joints. Center pin and connector body are soldered directly to a PCB, minimizing antenna effect caused by elevated mounting approaches and associated EMI/RFI problems at higher frequency ranges. Has a 75 ohm impedance and is tested to 2 Ghz.

Regal Electronics Inc., www.regalusa.com

The Fine Silver Conductor Trial Kit is capable of producing fine silver conductor traces down to 50 µm for high-density thick film circuits. Can experiment with fine polymer thick film circuits and functional printable and flexible electronics without screen printing equipment. Includes screen mask with standard fine patterns, a printing table, 50 g special silver ink, flexible substrates, squeegee, and other materials. Working table and thermal oven required.

DKN Research, www.dknresearch.com

NC265LR alcohol-based no-clean liquid flux is said to offer low residues and excellent wetting for Pbfree and SnPb wave soldering applications. Reportedly offers faster wetting for SN100C and SAC alloys and is compatible with a range of alloys. Reduces preventative maintenance requirements for spray fluxing applications. Has a 1-year shelf life when stored at room temperature and comes in a variety of packaging. Passes SIR per IPC-TM-650 method 2.6.3.7.

AIM, www.aimsolder.com

Fine Pitch Bump Adapters accommodate boards with pitches down to 0.40 mm. Permit use of higher pitch devices on smaller pitch boards. Adapter tops have landing pads that can be designed to accept any device on any pitch, and settle into fine pitch footprints, including TSSOP and QFP. Adapter bottom has raised connection pads up to 0.010" that provide easy mounting to the target board. Are 0.062" thick FR4 or Rogers 370 HR, with 1oz. copper traces on both sides. Non-solder mask-defined pads are finished with ENIG. Apparatus can operate up to 221°F for FR4 and 266°F for Pb-free. Are available in tape and reel for high-speed SMT assembly; can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003" can be used. Are available in panelized form, as adapters only, or as turnkey solutions with devices mounted.

Aries Electronics Inc., www.arieselec.com

Keratherm U 90 silicone-free thermal interface material has a light tack adhesive to provide high thermal conductivity where contamination threats prevent the use of silicone-based thermal pads; permits easy positioning between components and heat sinks. Is a ceramic-filled polyurethane film with a thermal conductivity of 6.0 W/mK and thermal impedance of 0.05 Kin²/W. Is available in thicknesses of 0.125 mm, 0.225 mm and 0.325 mm. Keratherm U 80 provides 1.8 W/mK of thermal conductivity and 0.11 Kin²/W of thermal impedance; is 0.175 mm and 0.325 mm thick. Typical applications include medical devices, laser equipment, LED lighting, solar energy, disk drives and automotive electronics. Both are available on roll stock or custom shaped pads.

MH&W International Corp., www.mhw-thermal.com