Solder Plus UV is a UV-fluorescent solder paste that enables pre- and post-reflow detection of solder deposits on automated production lines. UV light source excites the paste, causing it to emit a fluorescence detectable with conventional vision systems.

Nordson EFD, www.efd-inc.com

SimuTech technology on the TD2929 is a twin track system with dual overhead gantries. Permits print, 2-D inspection, bottom-side stencil cleaning and dot dispensing simultaneously on two PCBs. Features include a dual digital servo positioning loop, vibration printing and ultrasonic cleaning. Provides high-density bottom-side contour tooling support.

P3 combines the Touch Print Digital TD2929 and the Mx400LP pick-and-place system with tray and max feeders. A dual-lane conveyor enables two PCBs to work simultaneously. Can reach placement speed of 31,000 CPH.

Milara Inc., www.milarasmt.com

XPii-II pick-and-place machine incorporates technology from the iineo platform. Benefits from low-maintenance linear motors, high-resolution digital cameras and advanced on-head optical component sensing. Features two placement heads and uses turret head, intelligent feeders and powerful software. Comes with choice of turret heads and incorporates optical sensors that can detect components as small as 01005 and as large as 50 x 50 mm from picking to placement on-the-fly. Will accommodate components supplied on tape, strip tape, stick and matrix trays. Uses integrated intelligence. Is configurable, permitting two versions: 8 or 12 nozzles, tape trolleys or feeder trolleys, matrix tray sequencer, and an internal matrix tray. Has no restrictions or limitations on component range.

Europlacer, www.europlacer.com

Sentinel print verification and process management technology captures the full board image, analyzes the data and accepts or rejects the print in real time. Reportedly manages printing inputs and outputs, and integrates verification and traceability tools. Permits printing and high-speed inspection to run concurrently. Offers high-speed paste on pad, bridge detection and alignment capabilities, with vision coverage operating at 36,000 mm2 per sec. Closed-loop control manages alignment, automatic understencil cleaning operations and paste dispensing. Rejects bad boards automatically without interrupting production.  Managed through touch-screen control of Instinctiv V9 software.

DEK International, www.dek.com