The GoSelective light standalone will now be referred to as GoSelective; GoSelective light inline is now called the SelectiveLine to express inline capability and highlight the modular concept, which permits upgrade of a fluxer and preheat modules. Are for high product mix. Feature precise axis system for exact positioning of various workstations, and are capable of handling bare boards or assemblies in carriers up to 500 x 500 mm. Are Pb-free capable. Come with fiducial recognition for automatic PCB alignment, process visualization, and offline teach program. SelectiveLine is for inline operation and may be upgraded individually. Covers three basic modules: the SelectiveLine soldering module, separate fluxer, and preheater; can be arranged individually or as a complete production line. Modules are controlled through a central SPC control unit with a CAN bus system. Drop jet fluxer control monitors fluxer nozzle function and measures flux quantity of each drop.

Seho Systems GmbH, www.seho.de

Mydata Midas replacement nozzles reportedly are direct replacements for OEM nozzles. Are said to be compatible with TP9-1, TP9-2, TP9-3, TP9-4, TP11, TP12, TP18, MY9, MY12, MY15, MY19, and MY100 (SX/DX). Tool range includes the following nozzle types for fine-pitch components: C14, A12, A13, A14S, B12, A23, A24, and C23. Special Midas nozzles include spring suspended tools (A23S, A24S, C23S), MELF tools (A34, B34, B24, B23, C24), flat pipe tools (blade), multi-port tools, ESD ceramic tools, micro thin tools and gripper tools. Cover QFPs to BGAs to 01005s.

Count On Tools Inc., www.cotinc.com

 

LFB-1000 flip-chip bonder handles large-scale ICs.  Capabilities include NCP, chip-on-chip and copper pillar processing.

Shinkawa, www.shinkawa.com

Siplace CA combines die placement from wafers with classic SMT placement technology. Reportedly eliminates special die bonding processes. Processes flip-chips from wafers at high speeds together with passive components from reels. Is based on Siplace X series, with additional wafer systems as feeders. Features include flip unit, special vision systems, and linear flux dip unit. Each Speedstar CP 20 head is able to place up to 9,000 flip-chips or 6,000 die-attach components per hr. in sizes ranging from 0.8 to 18.7 mm with an accuracy of ±10 µm. Can handle different wafers, which are replaced automatically. Punch-out speed is programmable. Requires only one pass through the oven.

Siemens, www.siplace.com