FX-UV automated conformal coating inspection system inspects for coverage, selected areas of non-coverage, delamination, cracks and bubbles. No programming required. Inspection setup reported requires a few minutes. A known good board is used to learn the coverage and non-coverage areas. Inspection typically takes a few seconds, with results immediately displayed. Results can be stored and reviewed off-line at any time. Reads all common barcodes, stores images and inspection results for traceability.
Nordson YesTech, www.nordsonyestech.com
Nordson YesTech, www.nordsonyestech.com
PV InstantSeal 100% silicone reactive hot melt supports high-speed assembly, improving solar frame and junction box sealing. Is a neutral cure sealant that minimizes contamination of module components during assembly. Reportedly has a pot life up to 24 hr. and long overall open time at temperatures less than 125°C.
Dow Corning Solar Solutions, www.dowcorning.com/solar
No. 918 is a gas-heated, 350°F shelf oven currently used for lower temperature heat processing operations. Workspace dimensions measure 68" x 30" x 66". 100,000 BTU/hr. are installed in a modulating natural gas burner; a 1000 CFM, 1-HP recirculating blower provides horizontal airflow to the workload. Features an aluminized steel exterior and Type 430 stainless steel interior with 4" thick insulated walls, and a silicone rubber door gasket. Has 325 CFM and 1/3-HP powered forced exhauster. A digital indicating temperature controller displays actual and set point values. Two nickel-plated wire shelves are included with channel shelf supports.
The Grieve Corp., www.grievecorp.com
The Grieve Corp., www.grievecorp.com
The 4000Plus multi-purpose bondtester is able to perform a wide range of shear and pull applications, as well as push functionality up to 50 kg. Is suitable for traditional bond tests, and meets the requirements of ribbon pull, hot bump pull and fatigue. Has anti-backlash system to aid the setting and control of step back. Is available with a range of XY stages, with a 160 mm XY stage as standard, and an image capture system. Has extended working envelope of 200 mm for testing oversize parts. Uses Paragon software.
Nordson Dage, www.nordsondage.com
Nordson Dage, www.nordsondage.com
PR1 BGA Solder Ball Checker is for inspection of BGA soldering and QFP lead sections. Provides inspection of soldered points and BGA surfaces; features a conductive body for ESD. Enables visual inspection of QFP leads and chip parts. The handheld tool is 50 x 30 x 15 mm. Weighs 25 g. Comes with a wrist strap. Is capable of inspecting the interior section of BGA packages using a battery-powered white LED lighting system. With an expanded lens, it is capable of up to 7X magnification.
Seika Machinery Inc., www.seikausa.com
SPC+ Software is a yield improvement tool for solder paste printing. Is a high-functionality statistical process control package that can be run on the system or offline. Analyzes images and data to track performance. Defect review, X Bars and S charts, Cp and CpK calculation, histograms, and other analytical tools can be calculated with Pareto charts and the ability to drill down on specific data points. Real-time capabilities permit immediate adjustment of solder paste printing parameters. Included free on all new Koh Young equipment.
Koh Young Technology, www.kohyoung.com
Koh Young Technology, www.kohyoung.com
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