Circuits Assembly Online Magazine - Features

AOI software v.5 now includes 64-bit computing technology, standard 12 Gb of memory (expandable to 72 Gb), and integrated 3D Gerber translation; reportedly can generate production-ready 3D inspection program from stencil data within 5 min. Specifies stencil thicknesses and step stencil data in a wizard-driven environment. Inspection parameters are set automatically based on user input. Gencad and Gencam handling permit mapping individual components and lead numbers to Gerber data.

Machine Vision Products Inc., www.machinevisionproducts.com

Spectra is a large-board AOI built on the design of the Supra and Ultra series. Uses a tri-linear stage and comes in two formats. Is capable of inspecting boards up to 24" x 24". Spectra XL is capable of inspecting up to 24" x 36".

Machine Vision Products Inc., www.machinevisionproducts.com

GenesisSC blends flip-chip assembly capabilities on a Genesis platform. Reportedly provides a complete solution for any production environment. Is tailored for dies and passives placement, including 300 mm wafers. Placement accuracy is said to be ±10 µm @ Cp>1. On-board linear thin film applicator provides dipping capabilities for paste or flux.

Universal Instruments Corp., www.uic.com

LK-G5000 laser displacement sensor comes with RS-CMOS sensor for a 392 kHz sampling rate said to be 8 times faster than previous models, ±0.02% full scale linearity and 0.01 µm repeatability. Is smaller than previous models. Active Balanced Laser Control Engine control is more powerful, and balances laser emission time, laser power, and gain. Dual-port data transfer, using a quad speed clock, enables pixel data to be transferred eight times faster than conventional models, thus simultaneously achieving high-speed and high-resolution. HDE (High Definition Ernostar) lens, together with twice the pixel resolution, results in highly-defined received light wave patterns. Three selectable built in algorithms improve the application solving potential. Perform calculations for up to 12 sensor heads for flatness, warpage and multi-point thickness. Measure speed and acceleration while measuring displacement.

Keyence Corp. of America, www.keyence.com/prlk5

The AIM print test board and kit includes new component technologies: 0.4 and 0.5 mm pitch FusionQuad components, DualRow MLF, 01005 and 0201 resistors, as well as others. Contains BGA and microBGA pads, both having circular and square pad designs to test paste release. Includes the standard IPC slump test pattern. A number on the board indicates the distances between pads. Common pad sizes are incorporated into the layout, including 1206, 0805, 0402, 01005 and 0201 rectangular pads for discrete components; have varying distances between them. Four pads are available for use with various aperture styles to permit wetting tests. Includes several fine-pitch QFP pads.

AIM, www.aimsolder.com

RPS Vision Correct fully integrated fiducial inspection and auto correction software is for selective soldering systems. Uses stored images to validate known fiducial points and other indicators. Identifies position errors of detected fiducials and uses correction algorithms to adjust the soldering program by the X and Y axes deltas. Features include high-def video camera and white LED ring light; precision position correction ±0.005"; sensitivity control for image recognition and search regions, and integration with CamConductor programming software.

RPS Automation LLC, www.rpsautomation.com