Custom SMT pick-and-place nozzles for Cree LED components offer special handling operations to prevent damage to the optical lens. Reportedly avoid mechanical stress on the LED lens by not touching the optical surface during component picking or placement processes. Permit better placements with odd-form components. Can be applied to any style of pick-and-place nozzle for any OEM or machine type.
Count On Tools Inc., www.cotinc.com
VJ Technologies, www.vjt.com
Backpack Valve Actuator reportedly cycles select EFD dispense valves two to three times faster than previously possible. Can produce smaller fluid deposits required in assembly of advanced products, such as medical devices and portable electronics. Incorporates advanced miniature solenoid technology; mounts the solenoid used to open and close the valve directly on the valve’s air cylinder. Can achieve valve actuation speeds of 5 - 6 msec. and cycle rates of 800 per min.
Nordson EFD, www.nordsonefd.com
Visionscape 4.1 is scalable software for machine vision boards, GigE solutions, and smart cameras. Includes blob analysis, OCR, OCV, barcode, vector and edge algorithms, plus pattern-matching tool Intellifind. Additional tools include color matching and color segmentation. Color matching can be used in high-speed applications such as sorting parts, and color segmentation enables other tools to be applied in a specific color plane. Machine vision jobs developed for a smart camera platform can directly be transferred to a PC-based solution without reprogramming.
Microscan, www.microscan.com
Series 2005 Zebra Carbon Connector connects LCDs to PCBs. Is a high-density, low-resistance elastomeric interconnect device. Has 500 conductive layers per in.; is for densely packed boards such as consumer and hand-held electronics. Exhibits a resistance of 2.37 ohms•in. typically, and operates across a temperature range of -58° to 257°F.
Fujipoly America Corp., www.fujipoly.com
Loctite PowerstrateXtreme Printable (PSX-P) is a print-friendly thermal management product. Thermal management materials can be deposited using traditional screen and stencil printing methodologies. Is offered in medium dry and extended dry versions. Paste format enables the material thickness to be adjusted as required. Is applied as a paste; once dry, it yields a phase-change pad. Delivers an abandon time of two hrs. minimum. Paste format is ideal for high-speed or high-mix environments. Adaptable to deviations in surface flatness, with the ability to fill any voids with varying thicknesses.
Henkel, www.henkel.com/electronics
Press Releases
- AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
- Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf
- ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland.
- PARMI USA, INC. Appoints Juan Arango as Head of Sales and Business Development to Drive U.S. Market Growth